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Digital Mirror Device
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"Lab-on-a-Chip"-for the hot stamping of glass components
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| | You have mastered the processes of thin-film and thick-film fabrication. You are familiar with modern assembling and packaging technologies. You know that microsystems engineering means more than just airbag sensors, and that the scanning electron microscope is only one of the tools for analyzing and characterizing materials.
Use the advantages of non-contact optical surface analysis.
Navigate with speed and certainty – from the millimeter to the submicrometer range.
Measure your microstructures with the
LSM 700 – either with sample-preserving light in the green-to-red spectral region, or with blue for maximum optical resolution.
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