Assessing Electronics with Advanced 3D X-ray Imaging and Deep Learning

This webinar presents advanced workflows that combine 3D X-ray microscopy (XRM), nanoscale tomography, and deep learning (DL) to generate a detailed visualization of the interior of electronic devices and assemblies to enable the study of internal components for failure analysis (FA). Newly developed techniques, such as the integration of DL-based algorithms for improving 3D image reconstruction and upscaling high-resolution data to large field of views, are discussed.

• Recent advancements in 3D X-ray imaging allow new FA workflows for electronic devices with the integration of 3D XRMs and nanoscale tomography

• These imaging workflows allow spatial resolution imaging of fine details within electronic devices without interfering with or destroying the root cause of failure

• Using deep learning-based algorithms for CT reconstruction allow for 3D XRM workflows to be applied much more economically by reducing the time required for data acquisition

• DL-based X-ray inspection technologies will have a significant impact on improving image quality and reducing time spent on testing and failure analysis of advanced electronic packages