ZEISS Xradia 520 Versa 3D X-ray microscope unlocks new degrees of flexibility for scientific discovery. Building on industry-best resolution and contrast, Xradia 520 Versa expands the boundaries of non-destructive imaging for breakthrough flexibility and discernment critical to your research. Innovative contrast and acquisition techniques free you to seek-and find-what you've never seen before to move beyond exploration and achieve discovery.
Xradia 520 Versa achieves spatial resolution of 0.7 µm and minimum achievable voxel of 70 nm.
In addition to well-known advantages offered by the ZEISS Xradia Versa series of X-ray microscopes – highest resolution, best contrast, RaaD (resolution at a distance) and non-destructive submicron X-ray imaging – ZEISS Xradia 520 Versa advances lab-based X-ray imaging with breakthrough techniques and innovations:
Dual Scan Contrast Visualizer (DSCoVer)
DSCoVer provides flexible side-by-side tuning of two distinct tomographies at different imaging conditions or sample conditions. This enables compositional probing for features normally indistinguishable in a single scan, enabling you to seamlessly and easily collect the data required for dual energy analysis. Imaging a sample at two different X-ray spectra, or in two different states, aligning the resulting datasets and then combining them assures you will achieve optimum contrast for the material of interest and allow you to establish repeatable research parameters.
DSCoVer takes advantage of how X-rays interact with matter based on effective atomic number and density. This provides you with a unique capability for distinguishing, for example, mineralogical differences within rocks as well as among difficult-to-discern materials such as silicon and aluminum.
High-Aspect Ratio Tomography (HART)
The innovative High Aspect Ratio Tomography (HART) mode on Xradia 520 Versa provides you with higher throughput imaging for flat samples such as those found with semiconductor packages and boards. HART enables you to space variable projections so that you collect fewer projections along the broad side of a flat sample and more along the thin side. A significant amount of 3D data is provided by these closely-spaced long views versus less densely-spaced short views.
You can also tune HART to emphasize higher throughput or better image quality, thereby potentially accelerating image acquisition speed by 2X.
Automated Filter Changer (AFC)
Now it’s even easier to image challenging samples. Source filters used to tune the X-ray energy spectrum are an important complement to DSCoVer and in situ applications. The AFC houses a standard range of 12 filters along with space for a dozen additional custom filters for new applications. Filter selection is easily programmed and recorded within imaging recipes so filters may be changed without disrupting the work flow.
Wide Field Mode & Vertical Stitching
Wide Field Mode provides you with either an extended lateral field of view for imaging large sample types or higher resolution using the standard field of view, both in a single tomography. For larger samples, the lateral field of view is approximately twice as wide as the standard mode providing 3D volume more than three times larger. Using standard field of view, WFM provides nearly twice the number of voxels. Combining WFM with the existing Vertical Stitching feature enables you to image large samples that are both wider and taller than the standard field of view.
Optional Diffraction Contrast Tomography (LabDCT)
Building on the industry-best resolution and contrast of ZEISS Xradia Versa X-ray microscopes (XRM), optional ZEISS LabDCT™ advanced imaging module provides you with direct visualization of 3D crystallographic grain orientation. This powerful combination of diffraction capability with unique reconstruction software for the Xradia 520 Versa meets the growing need for metallurgists and materials scientists to obtain such information to accompany your data sets. And now, for the first time ever, LabDCT brings non-destructive diffraction contrast tomography (DCT) directly to your laboratory.
Optional Flat Panel Extension (FPX)
ZEISS FPX™ flat panel extension enables unmatched versatility in a single X-ray system. Image significantly larger samples (beyond 5” diameter) and greater volumes (10X increase) with high throughput (better by 2-5X). Get to results faster by performing rapid macroscopic scouting scans and then zooming in to regions of interest at high resolution. With FPX, simplify and expand your multiscale imaging, characterization and modeling workflows all on a single platform.
Maximize your instrument’s utilization by minimizing user intervention with the optional ZEISS Autoloader, available for all instruments in the ZEISS Xradia Versa series of 3D X-ray microscopes. Reduce the frequency of user interaction and increase productivity by enabling multiple jobs to run. Load up to 14 samples, queue, and allow to run all day, or off-shift. The software provides you with the flexibility to re-order, cancel and stop the queue to insert a high priority sample at any time. An e-mail notification feature in the ZEISS Scout-and-Scan user interface provides timely updates on queue progress. Autoloader also enables a workflow solution for high volume repetitive scanning of like samples.
Optional In Situ interface kit
X-ray imaging is uniquely suited to image materials under variable environments with controlled conditions including over time (4D) to non-destructively characterize and quantify the evolution of 3D microstructures. With its unique architecture, the Xradia Versa has emerged as the industry's premier solution supporting the use of the widest variety of in situ rigs, from high pressure flow cells to tension, compression and thermal stages. The optional In Situ Interface Kit delivers stable and robust management of often complex in situ electrical and plumbing facilities and ensures Xradia performance is maintained, along with recipe-based software capability that simplifies operation from within the Xradia Versa user interface. The In Situ Interface Kit is available on all Xradia Versa systems.
Unprecedented resolution in non-destructive 3D X-ray imaging
Advanced contrast capabilities for imaging challenging samples
The premier in situ and 4D solution
Achieve direct visualization of 3D crystallographic grain orientation in a non-destructive tomography environment with the LabDCT™ advanced imaging module. Diffraction contrast tomography (DCT), previously available only at a limited number of synchrotron X-ray facilities, can become your routine tool for non-destructive 3D grain mapping with the introduction of LabDCT as an option for your ZEISS Xradia 520 Versa 3D X-ray microscope (XRM).
Acquire and reconstruct crystallographic information from polycrystalline samples, such as metals and alloys, with LabDCT, a combined hardware and software solution. Combine grain orientation information with microstructural features observed in absorption or phase contrast tomography (e.g. cracks, porosity network, inclusions), open new possibilities for characterization of damage, deformation and growth mechanisms related to 3D materials science. Achieve enhanced understanding of the fundamental materials science behind these processes with powerful microscopic imaging features in three dimensions.
Expose your samples to in situ environments within the microscope, or to an extended time evolution "4D" experiment (across days, weeks, months), a unique strength of laboratory-based XRM experiments over the synchrotron environment. For the first time, with LabDCT you can extend the ability of 4D and in situ microstructural evolution experiments to explore the influence of crystallography and understand mechanisms like corrosion on materials microstructures in a laboratory tomography instrument.
Following an evolution experiment, your sample may be sent to the electron microscope or focused ion beam (FIB-SEM) for complementary high-resolution post-mortem investigation (such as EDS or EBSD) of identified volumes of interest. Such correlative workflows, efficiently enabled by ZEISS Atlas 5, point to the future of modern microscopy and seamlessly leverage the multi-modal, multi-scale and multi-dimensional characterization platforms provided by ZEISS.
Now you can accomplish large-sample, high throughput scanning with ZEISS best-in-class image quality. Versa FPX enhances imaging flexibility and creates workflow efficiencies with an all-in-one system for industrial and academic research.
Rapidly scout large samples to identify a region of interest (ROI), and then zoom to image targeted volumes at high resolution using the exclusive Versa dual magnification microscope objectives that enable you to maintain resolution at a distance (RaaD). FPX extends the Xradia 520 Versa Scout-and-Zoom workflow by achieving full field of view, whole-sample imaging, beyond 5” diameter for samples like geological cores or intact smartphones, with higher throughput.
ZEISS Versa FPX combines geometric magnification with high resolution RaaD objectives. Adding the optional flat panel extension (FPX) to your ZEISS Xradia Versa system further increases its versatility. This combination of detector designs allows the widest range of sample sizes and types to be studied efficiently and accurately.
ZEISS XRM Autoloader transforms powerful ZEISS Xradia Versa X-ray microscopes into high utilization work horses. Set-up queues of imaging jobs and receive automatic notification of job completion, maximizing XRM throughput. Use the easy-to-set up Autoloader across a shift, a full day, overnight, or over a weekend for maximum flexibility and minimum user interaction.
Autoloader facilitates precise and repeatable sample measurements and is also flexible for handling diverse sample types in the same queue. Expand the value of your world-class Xradia Versa X-ray microscope whether your setting is a research or industrial laboratory, industrial process development, service laboratory, or university central imaging laboratory.
Characterize materials, observe fracture mechanics, investigate properties at multiple length scales, quantify and characterize microstructural evolution. Perform in situ and 4D (time dependent) studies to understand the impact of heating, cooling, oxidation, wetting, tension, tensile compression, imbibition, drainage and other simulated environmental studies. Xradia 520 Versa offers non-destructive views into deeply buried micro-structures that may be unobservable with two-dimensional surface imaging such as light, scanning electron, and atomic force microscopy; compositional contrast for studying low Z or "near Z" elements and other difficult-to-discern materials. Look at very large samples on a macro scale to determine regions of interest for high resolution imaging.
Characterize and quantify pore structures, measure fluid flow, study carbon sequestration processes; analyze tailings and conduct thermodynamic leaching studies to maximize mining efforts and perform quality analysis/quality control for mining procedures; understand grain orientations in steel and other metals. Image large samples (beyond 5” in diameter) in multiple length scales at high throughput. Xradia 520 Versa offers the most accurate 3D submicron support for digital rock simulations, in situ multiphase fluid flow studies, 3D mineralogy, and steel and metals R&D.
Perform virtual histology, visualize cellular and subcellular features, characterize submicron structures in samples that are inches to centimeters in size. Expand your views in developmental biology with high resolution, high contrast images of cellular and subcellular structures. Xradia 520 Versa offers the highest resolution and best contrast in of lab-based computed tomography solutions for unstained and stained hard and soft tissues and biological microstructure. Image large, intact specimens and determine ROI for high resolution study.
Manufacturing and Assembly
Optimize your process development, study package reliability, perform failure analysis, analyze package construction. Xradia 520 Versa offers non-destructive submicron imaging of intact packages for defect re-localization and virtual cross sectional images with a fast time to results. Use this single-tool workflow with high throughput macroscanning of an intact device to non-destructively scout-and-zoom from module to package to interconnect. Your submicron imaging of defect re-localization and characterization with a fast time to results complements or replaces physical cross-sectioning.
All of the features introduced by the Xradia 520 Versa are seamlessly integrated within the Scout-and-Scan Control System, an efficient workflow environment that allows you to easily scout a region of interest and specify scanning parameters. The easy-to-use system is ideal for a central lab-type setting where your users may have a wide variety of experience levels. The interface maintains the flexibility for which Xradia Versa systems are well-regarded, enabling you to set-up scans even more easily. Scout-and-Scan software also offers recipe-based repeatability, which is especially useful for your in situ and 4D research, and enables you to have greater control and efficiency for future work.
New on Version 11:
ZEISS recommends Dragonfly Pro from Object Research Systems (ORS)
An advanced analysis and visualization software solution for your 3D data acquired by a variety of technologies including X-ray, FIB-SEM, SEM and helium ion microscopy.
Formerly Visual SI Advanced, Dragonfly Pro delivers high-definition visualization techniques and industry-leading graphics. Dragonfly Pro supports customization through easy to use Python scripting. Users now have total control of their 3D data post-processing environment and workflows.
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