Please visit our ZEISS booth # 221 at SPIE Advanced Lithography Conference and learn more about our latest innovations! The Conference runs from February 21-25, 2016 in San Jose!
Since the photomask is one of the key elements in photolithography it deserves special care and attention. The strategic business group Semiconductor Metrology Systems (SMS) of ZEISS has many years of experience in qualification, repair and verification, metrology as well as tuning of photomasks. Together with the industry we are constantly developing complete systems and providing innovative technology for all relevant nodes.
We provide unique solutions for mask making and lithography in the areas of zero defect, in-die metrology, critical dimension/registration and overlay control to achieve high mask yield improvement and mask recovery.
Even least defects in the layout of a single photomask can consign all chips on the exposed wafer resulting in enormous losses. That is why it is crucial to inspect all masks for defects, understand their impact on the photolithography process, and eliminate them before the mask is used in a stepper or scanner.
ZEISS has launched the new ZEISS MeRiT neXT system for repairing smallest next generation defects. With its low energy ebeam column the tool represents a paradigm shift in classical photomask repair.
With shrinking feature sizes in-die metrology is not only desirable, but essential as the measurement of test structures no longer reflects the complex interacting between patterns and illuminating light in the deep sub-wavelength regime.