Extending the Measurement Capabilities of 3D X-ray Microscopy to Dimensional Metrology

Today’s manufacturing industry demands increasingly higher levels of precision, accuracy and reliability for dimensional measurements on feature sizes that are in the order of 10 mm or smaller. There are requirements for higher levels of resolution, precision, and accuracy, ideally with technologies that measure internal features and avoid causing damage to the original device.

ZEISS has recently launched a package, consisting of hardware and software, for performing highly accurate dimensional measurements using 3D X-ray microscopes with an accuracy that far exceeds the limits of conventional X-ray computed tomography. This technology will contribute to geometric dimensioning and tolerancing of mechanical parts (and other device components) and can be used as a tool for nondestructive dimensional quality control in various manufacturing industries, e.g., automotive, aerospace, electronics assembly and packaging, medical devices, injection molding, casting, and additive manufacturing.

• Combine high-resolution X-ray imaging with high-precision metrology capabilities

• Measure with an accuracy far beyond the limits of conventional X-ray CT metrology

• Non-destructively inspect the design of a part’s complex internal and external features