November 23 & 24, 2021 | 9:00 – 12:00 CET

Electronics Workshop

In collaboration with Infineon, Kleindiek and Raith

Join our online workshop with microscopy experts from Infineon, Kleindiek, Raith and ZEISS on fast and convenient imaging techniques and failure identification methods in device engineering and failure analysis.

Live demonstrations and interesting lectures from renowned industry experts and users will provide you with an overview on leading edge imaging technologies as well as with real-life experiences in Failure Analysis labs.

This online workshop aims to connect ZEISS and our partners to discuss and address the challenges in the semiconductor and electronics industry.

Fast & convenient large area imaging

Unique sample preparation using X-ray and femtosecond-laser ablation

Flexible high-end-nano-probing solutions including an application note from the field

Automation in failure analysis & Sensitive imaging and analytics

Target Audience

Industry experts and engineers in Semiconductor FA, Characterization, product and process development as well as package development and reverse engineering in Semiconductor devices and related technologies.

Register for each session separately.

In collaboration with

Share this event with your friends & colleagues:

Guest Speakers

Dr. Christian Hollerith
Infineon Technologies

Dr. Andrew Smith
Kleindiek Nanotechnik

Andreas Rummel
Kleindiek Nanotechnik

Dr. Guido Piaszenski
Raith Nanofabrication

Martin Rasche
Raith Nanofabrication

Day 1

November 23, 2021 | 9:00 – 12:00 CET

Welcome

Gabriel Reichl

How to Produce Ultra-precise High-resolution Image Mosaics for Physical and Electrical 3D IC Analysis and More

Guido Piaszenski & Martin Rasche

Towards Full Field Chip Scanning in Semiconductor Reverse Engineering

Stephan Nickell

Fast Sample Preparation Using Femtosecond Laser Ablation in FIB-SEM Applications

Peter Gnauck

Q&A

 

Watch the Webinar Recording

Day 2

November 24, 2021 | 9:00 – 12:00 CET

Welcome

Gabriel Reichl

Flexible High-End-Nano-Probing Solutions for Fast & Convenient Device Characterization

Andrew Smith & Andreas Rummel

Application Note: SEM-Probing for Advanced CMOS/Characterization and E-beam Localization

Christian Hollerith

Automation in Failure Analysis

Fabian Perez Willard

Q&A

 

Watch the Webinar Recording

Abstracts

Raith Chipscanner: How to Produce Ultra-precise High-resolution Image Mosaics for Physical and Electrical 3D IC Analysis and More

Raith designs and builds electron beam lithography systems since 1980 for which precision and long-term stability are the key criteria. The acquisition of perfectly calibrated images over days and capability to precisely move to the adjacent image with minimum image stitching errors delivers near to perfect raw data for further layout extraction and minimizes subsequent computing overhead. The ultra-high global accuracy allows 3D layer stitching for reconstruction up to the netlist and schematics, either with customer’s or optional Raith software. Also, 3D biology samples like brain slides could be scanned and precisely stitched, 2D and 3D, due to the good raw data.
During the presentation, the system and software basics are explained. A recorded short live demo provides a unique experience of the accuracy that is built into Raith Chipscanners.

MultiSEM: Towards Full Field Chip Scanning in Semiconductor Reverse Engineering

Reverse engineering of semiconductor integrated circuits (ICs) enables detection of violations of intellectual property or adverse manipulations of product designs. The continuous shrink of semiconductor patterns imposes several challenges not only on the fabrication of ICs, but also on the imaging of their structures used in process control and reverse engineering. Scanning electron microscopy (SEM) can resolve the relevant patterns, but so far has not been able to achieve the throughput requirements for large area screening at a practicable time frame. Using a multi-beam SEM increases the throughput dramatically and therefore allows to image entire chips. Here, we will present details on the ZEISS MultiSEM and how this worldwide fastest multi-beam electron microscope can facilitate imaging and analysis of modern integrated circuits.

Kleindiek Nanotechnik: Flexible High-End-Nano-Probing Solutions for Fast & Convenient Device Characterization

Nanoprobing has become a standard tool for design houses and device manufacturers. Being able to quickly and efficiently address issues is key to fast product development. We will show how an SEM can be upgraded to a full-fledged nanoprobing setup by introducing a nanoprobing system based on a compact platform that is loaded just like any other sample. In addition, a typical failure analysis workflow will be demonstrated.

Infenion: SEM-Probing for Advanced CMOS/Characterization and E-beam Localization

SEM-nanoprobing has become a crucial method for failure analysis of advanced logic devices. In addition to parametric measurements also electron beam-based localization methods like EBAC and EBIRCH have become very beneficial to get high-resolution localization results for direct TEM-lamella preparation of failure positions, where some examples will be shown.

Speakers Profiles

Dr. Peter Gnauck

Peter Gnauck received his PhD from the Eberhard Karls University, Faculty of Physics in 2000. From 1995 - 1999 he worked as a research scientist at the NMI (Natural and Medical Science Institute) in Reutlingen, Germany. From 1999 - 2001 he was Project Manager in the R+D department at Carl Zeiss NTS, Oberkochen Germany. During 2001 and 2006 he worked as Product Manager for Focused Ion Beam systems at Carl Zeiss NTS. Since 2006 He holds the position of Business Development Manager at Carl Zeiss Microscopy.

Dr. Christian Hollerith

Christian Hollerith was born 07.04.1976 in Munich. He studied physics at TU Munich from 1996 to 2001. He did his diploma and PhD thesis about the application of transistion edge sensors for EDS until 2006. During this time he was involved developing a high resolution low temperature EDS system for FA usage at the FA lab of Infineon at Munich Perlach. After this time he started to work for Infineon FA lab Munich. There he worked in the development of the fields of SAM, SEM, Nanoprobing, mechanical preparation of warped surfaces, tester based localization and package modification.

Dr. Stephan Nickell

Stephan Nickell earned his Diploma degree in Physics from the University in Heidelberg in 1997 and his doctoral degree from the Technical University in Munich in 2001. In his studies he turned towards optics and electron microscopy. He was working as a group leader at the Max Planck Institute of Biochemistry in Munich where he contributed to the development of cryo electron microscopy. In 2011, Stephan Nickell joined Carl Zeiss Microscopy in Oberkochen, Germany. Stephan Nickell is currently Head of Product Management Academia & Other Industry at Carl Zeiss MultiSEM GmbH.

Dr. Guido Piaszenski

Guido Piaszenski, Senior Application Engineer: Joined Raith in 2003 as application scientist for electron beam lithography (EBL). He is familiar with all aspects of system operation for EBL and Large Area Imaging. He is involved in various international research collaborations.

Martin Rasche

Martin Rasche, Senior Product Manager: Joined Raith in 1997 as application specialist for semiconductor failure analysis and OEM microscope stages. Together with key clients, he has been responsible for developing the Raith Chipscanner SEM technology. Today he is responsible for all aspects of the technical roadmap and development of all lithography and imaging products manufactured at Raith in Dortmund.

Gabriel Reichl

Gabriel Reichl joined Zeiss in 2020 as a Business Development Manager EMEA at Zeiss Research Microscopy Solutions (RMS). Gabriel worked in semiconductor manufacturing-, equipment- and service companies since more than 35 years. He held various positions in service, sales and business development at SPTS, Accretech, Photronics and Brooks Automation before joining ZEISS. Gabriel holds a degree in mechanical engineering from the HTBL in Saalfelden, Austria.

Andreas Rummel

Andreas Rummel studied physics at the Eberhard-Karls-Universität in Tübingen focusing on electron and force microscopy. He is working on applied research and development in the field of electrical probing, sample preparation and manipulation at Kleindiek Nanotechnik.

Dr. Andrew Smith

Andrew Jonathan Smith studied chemistry at the Heinrich-Heine-Universität Düsseldorf. After specializing in electrochemistry he moved into the field of nanotechnology, studying arrays of metallic nanowires. In July 2008 he joined Kleindiek Nanotechnik and is responsible for sales support and application development.

Dr. Fabián Pérez Willard

Fabián Pérez Willard is Solutions Manager at ZEISS Microscopy. He focuses on microscopy solutions for the area of nanoscience and nanomaterials. Fabián studied physics at the Karlsruhe Institute of Technology (KIT), where he completed a Ph.D. in low-temperature physics in 2003. After heading a multiuser service lab facility with focus on the fabrication and characterization of functional nanostructures at KIT, Fabián moved to ZEISS in 2006. At ZEISS he has held different positions in applications, product management, and marketing. Fabián has 20+ years of experience in electron microscopy and is an expert in the field of ion microscopy.