Microscopy Conference 2017

Microscopy Events

ZEISS at Microscopy Conference 2017

August 21 - 25, 2017 - Lausanne, Switzerland, Booth #16

Join us at booth #16 and discover new insights to your real world questions.

Learn how ZEISS light, electron/ion and X-ray microscopes give you the power to work on any sample. ZEISS microscopes combined with correlative solutions make it easy to bring together multiple modalities and solve real life questions. Join us in Lunch & Learn Sessions and learn from our microscopy experts about the newest advances in confocal and field emission technology and get to know the next level of correlating microscopes in multiple dimensions.

ZEISS Talks

Helium Ion Microscopy – Recent Developments and New Applications
Peter Gnauck
ZEISS Microscopy
Wednesday, Aug 23, 2017 |  2.15 pm - 3.15 pm | Room C

The Helium Ion Microscope has been described as an impact technology offering new insights into the structure and function of nanomaterials. Combining a high brightness Gas Field Ion Source (GFIS) with unique sample interaction dynamics, the helium ion microscope provides images offering unique contrast and complementary information to existing charged particle imaging instruments such as the SEM and TEM. Formed by a single atom at the emitter tip, the helium probe can be focused to below 0.5nm offering the highest recorded resolution for secondary electron images. The small interaction volume between the helium beam and the sample also results in images with stunning surface detail. Besides imaging, the helium or neon ion beam can be used for fabricating nanostructures at the sub-10nm length scale. In this workshop we will discuss the broad application range of this technology ranging from imaging over nano structuring to TEM lamella preparation and to recent analytical techniques as well as correlative microscopy.
 

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Application of Correlative X-Ray Microscope Workflows for Quality Control and Process Development in Additive Manufacturing
Tim Schubert
University Aalen
Thursday, Aug 24, 2017 | 2.15 pm - 3.15 pm | Room C

Additive manufacturing is a promising technology to manufacture attractive energy- and resource-efficient products for future competitive mechanical engineering and sustainable mobility as well as power-enigneering. To present there is a need of deeper understanding of process and materials characteristics as well as quality and realiability of additively manufactured parts. The talk will outline how to non-destructively detect certain defects in additively manufactured Aluminum-parts using high-resolution X-Ray-micrsocope ZEISS Xradia Versa, how to prepare the samples for further analyses in the light-microscope and via FIB/SEM-Tomography and how to locate and correlate sample positions in the different microscopic technologies.

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Enjoy Lunch and a Technology Lecture

Learn about some of the newest solutions and workflows from our product management team.

 

Be sure and register for just one or all the topics below to secure your lunch.

Multimodal Workflow Solutions for Industrial Quality Assurance and Failure Analysis Dirk van der Wal
ZEISS Microscopy
Tuesday, August 22, 2017 | 12.45 am - 1.45 pm | Garden AB

Material Science or Industrial R&D applications typically involve in-depth investigations of material properties with a particular analytical instrument to reveal a specific attribute of the sample under investigation. Industrial Quality Assurance (QA) or Failure Analysis (FA), on the other hand, is subjected to constantly different parts submitted by the shop floor, and typically involves a wide range of instruments to measure multiple attributes of the part subjected to inspection (multimodal QA workflow).
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One fine example of a multimodal workflow is the combination of light and scanning electron microscopy for metallography and failure analysis, or technical cleanliness in manufacturing and assembly industries such as Automotive. The ZEISS correlative microscopy solutions not only allow for seamless relocation of regions of interest from one microscopy to another, it also  keeps data from multiple modalities together to meet emerging data integrity and connectivity requirements from trends such as Industry 4.0.
 
In this lecture, we will present examples of typical industrial QA multimodal workflows, and explain how ZEISS connected laboratory solutions contribute to materializing enhanced integration of QA and production data.
 

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High-Resolution X-ray Microscopy and NanoCT @ Sub-100nm Resolution for Scale-Bridging Materials Research
 
Erdmann Spiecker
Friedrich-Alexander Universität Erlangen-Nürnberg
Wednesday, August 23, 2017 | 12.45 am - 1.45 pm | Garden AB

Scale-bridging 3D characterization is one of the main challenges of materials characterization. In this context X-ray tomography techniques play an important role as they are non-destructive, cover a wide range of length scales (sample volume and resolution) and can be routinely carried out with lab-based instruments. From materials science perspective there is strong need for further improving resolution on a regular basis in order to being able to directly address phenomena at the nanoscale and better link to electron tomography techniques. In this contribution we show recent applications of high-resolution X-ray microscopy and NanoCT with Zeiss Xradia Ultra 810 lab instrument which routinely achieves resolutions down to 50 nm owing to Fresnel zone plate imaging/magnification. Examples range from scale-bridging characterization of nano-/microporous metals to investigation of natural photonic crystals in butterfly wing scales and make use of both absorption and phase contrast. The importance of sample preparation will be emphasized. Moreover, strategies for in situ microscopy/NanoCT will be discussed.
 

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3D Ultrastructural Imaging of Life - Large Volume and Correlative Scanning Electron Microscopy Saskia Lippens
VIB Bioimaging, Core
 
Thursday, August 24, 2017 | 12.45 am - 1.45 pm | Garden 2/3

The electron microscope is an invaluable tool for unravelling the structural details of cells and tissue. For the majority of questions the transmission electron microscope (TEM) is used to investigate resin embedded or cryo specimens. The scanning electron microscope (SEM) was mainly used to collect topography information of a specimen. However, modern field emission SEMs have reached a level in resolution that enables imaging tasks, which were traditionally covered by TEMs. Nowadays modern SEMs are utilized as imaging tools for traditional EM samples with additional advantages over classical TEM approaches. These advantages include the opportunity to section a resin-embedded sample directly in the SEM (serial block face imaging) or to prepare a large number of serial sections before imaging them in the SEM, automatically. Another advantage is the easy connection of SEMs with the light microscopes while maintaining the high potential and flexibility of the combined microscopes. The versatility and the outstanding performance enable SEMs as a tool to complement, or even replace the TEM in a wide range of biological applications.
 

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ZEISS Live Presentations

Join ZEISS live presentations and see how to enter new dimensions of enhanced optical resolution in combination with full sample flexibility.
Don´t miss your chance to use real equipment and samples, while also exploring a variety of practical topics in common to day-to-day microscopy work.

Array Tomography Alexandra Elli and Robert Kirmse
ZEISS Microscopy
Aug 22 | 2.15 pm - 3.15 pm | Room A/B
Aug 23 | 4.00 pm - 5.00 pm | Room A/B

Array Tomography is a volumetric microscopy method on a high-throughput basis, which can be either correlative or non-correlative. Ordered arrays of ultrathin, resin-embedded serial sections can be imaged with different microscopes. ZEISS offers intuitive workflow solutions to perform Array Tomography with both the light and electron microscope. A high degree of automation ensure efficient image acquisition of hundreds to thousands of serial sections. Afterwards the images from the individual serial sections can be reconstructed in 3D.
In this workshop, we will demonstrate the usual steps to setup a typical Array Tomography experiment.
We will discuss the opportunities that this approach provides with respect to high throughput and large area imaging as well as correlative microscopy.
 

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Correlative SEM and Confocal Raman Microscopy
Fang Zhou
ZEISS Microscopy
Aug 22 | 4.00 pm - 5.00 pm | Room A/B
Aug 24 | 11.00 am - 12.00 am | Room A/B

The recent achievement in correlative microscopy is the full integration of WITec 3D confocal Raman microscope into ZEISS FESEMs. Out of it the new SIGMA 300 RISE enables the best-in-class SEM imaging of composite materials and directly links their chemical/molecular information in addition by means of confocal Raman Imaging (CRI) capabilities. This fast and precise correlative approach allows to identify molecules or non-metallic compounds at high resolution, even if these show the same stoichiometry. Examples from various fields of applications will be presented.
 

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Correlative EVO MA and Smartzoom 5 Microscopy Dirk van der Wal
ZEISS Microscopy
Aug 23 | 2.15 pm - 3.15 pm | Booth #16
Aug 24 | 11.00 am - 12.00 am | Booth #16

In this workshop, we will demonstrate the complementary nature of Light Microscopy data, using ZEISS’ Digital Light Microscope Smartzoom 5, and Scanning Electron Microscopy data, using a ZEISS EVO MA25 SEM.
Both systems will be connected in a multimodal workflow using correlative microscopy solutions ZEN 2 core and Shuttle & Find, to facilitate easy transfer of samples, seamless relocation of regions of interest, and keeping both LM and SEM data together in a single data archive and reporting solution.

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Introducing ZEISS Latest FIB-SEM: ZEISS Crossbeam 550
Fang Zhou and Luyang Han
ZEISS Microscopy

Aug 22 | 2 workshops per day | EPFL- Station 12

Aug 23 | 2 workshops per day | EPFL- Station 12

The latest ZEISS FIB-SEM development, ZEISS Crossbeam 550, launched early spring of this year. ZEISS Crossbeam 550 advances high throughput 3D analysis and sample preparation. In this workshop, we will review some of the highlights of the new instrument.  

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TEM Lamella Thinning with Real-Time Thickness Control
Fang Zhou and Luyang Han
ZEISS Microscopy

Aug 22 | 4.00 pm - 5.00 pm | EPFL- Station 12

Aug 24 | 2.15 pm - 3.15 pm | EPFL- Station 12

Preparation of highest quality samples for transmission electron microscopy (TEM) requires precise control of the specimen thickness. With SmartEPD, ZEISS presents a solution for real-time monitoring of the lamella thickness during FIB thinning. SmartEPD relies on the quantification of the backscattered electron signal and allows automatic end pointing towards a target thickness.
 

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High-Resolution Analytical 3D Tomography
Fang Zhou and Luyang Han
ZEISS Microscopy

Aug 23 | 11.00 am - 12.00 am | EPFL- Station 12

Aug 24 | 4.00 pm - 5.00 pm | EPFL- Station 12

In combination with energy dispersive x-ray spectroscopy (EDS), FIB-SEM tomography allows to characterize the 3D microstructure of a sample comprehensively. In the past, analytical FIB-SEM tomography was done at a fixed SEM landing energy, high enough to excite the characteristic EDS spectrum lines. This sacrificed spatial resolution in the FIB-SEM tomogram. Today, ZEISS Atlas 5 3D Tomography solution ensures best 3D resolution and best 3D EDS analysis without compromises.
 

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In-Situ Material Testing and AFM Application Inside FE-SEM
Fang Zhou and Luyang Han
ZEISS Microscopy

Aug 22 | 2.15 pm - 3.15 pm | EPFL- Station 12

Aug 23 | 11.00 am - 12.00 am | EPFL- Station 12

Aug 24 | 4.00 pm  - 5.00 pm | EPFL- Station 12

ZEISS FE-SEM is equipped with an in-situ material testing stage to explore the microstructure evolution at sub-grain size level under various mechanical load and defined temperature. Furthermore, the integration and applications of AFM inside FE-SEM will be demonstrated. This AFM-SEM integration delivers the full range of scanning probe techniques on a flexible SEM platform.
 

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One-on-One Demo

Don’t miss this opportunity to test drive our latest microscopes.

While we bring most of our technology, some systems simply can’t be set up for a tradeshow - meet one-on-one with product specialists for these tools who can answer your questions, share application data and provide information on these instruments.

ZEISS Crossbeam 550
Your Interactive SEM for Multi-User Environments
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ZEISS EVO MA 25
Your SEM for Large and Heavy Samples
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ZEISS Sigma 300
Your ZEISS SIGMA FE-SEMs for High Quality Imaging and Advanced Analytical Microscopy
Book Your Demo
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Registration for a One-on-One Demo

MC 2017 ZEISS One-on-One Demo

Date21 August 2017 - 25 August 2017
StatusRegistration: Open
Registration deadline24 August 2017
LocationSwissTech Convention Center, Lausanne, Switzerland
DescriptionJoin us at booth #16 and discover new insights to your real world questions.
Learn how ZEISS light, electron/ion and X-ray microscopes give you the power to work on any sample. ZEISS microscopes combined with correlative solutions make it easy to bring together multiple modalities and solve real life questions.
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Location

SwissTech Convention Cente
Quartier Nord de l'EPFL
Route Louis-Favre 2
1024 Lausanne
Switzerland

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