Connect with ZEISS at MC 2019 in Berlin to explore the latest microscopy innovations and advancements through hands-on technology demonstrations and daily in-booth educational presentations.
Meet our experts to learn how ZEISS can help you advance research, achieve insights, and minimize time-to-result with the latest in our portfolio of light, confocal, electron/ion and X-ray microscopy solutions.
The Microscopy Conference will host an extended exhibition, which will bring together manufacturers and suppliers in the field of microscopy. Latest developments and new applications will be highlighted during lunchtime lectures.
Sep 02, 2019 | 12.45 - 1.45 PM
Discover new insights by connecting information across dimensions with ZEN Connect
Dr. Alexandra Elli, ZEISS Microscopy | Room H 0104
ZEISS ZEN Connect offers the possibility to combine multiple perspectives of a sample – across scales and across modes of acquisition– to provide answers to some of the most complicated scientific questions. This software module can now bring a whole portfolio of imaging technologies – ZEISS or non-ZEISS – together. The multimodal data is automatically relocated and overlaid, and then stored in well-organized projects with intuitive image labels. The resulting data can be overlaid and stored together in one place which makes it easy to gain insights into the whole experiment and removes the difficulty associated with multiple storage locations and instruments. As a result, you gain efficiency and effectiveness with intuitive data management, simplified workflows and limitless navigation.
During this lunch lecture ZEN Connect will be introduced and results from different application areas will be shown. The picture below shows images of a mouse brain tissue section. The overview image was acquired with Axio Scan Z1. A region of interest was identified and localized with ZEN Connect on a ZEISS confocal laser scanning microscope with Airyscan detector. Neuronal structures like spines which are not detectable with standard detectors discovered. Neurons are shown in green, neuronal protein was stained with Alexa Fluor 568 (red). Sample courtesy Luo Guanghong, College for Life Science, Shanghai University, China.
Sep 03, 2019 | 12.45 - 1.45 PM
Opportunities in 3D and 4D imaging with X-ray microscopy in the materials research laboratory
Nicolas Gueninchault, ZEISS Microscopy
As the complexity of advanced materials and devices continues to increase, 3D imaging and analysis has become essential in the modern materials laboratory. From materials inspection to device failure analysis, 3D imaging can reveal intricate details not visible through traditional 2D methods. X-ray microscopy is a non-destructive 3D imaging technique closely related to conventional X-ray computed tomography, but with advantages that allow for imaging with higher resolution on relatively large samples and for imaging with alternative contrast methods (such as phase contrast or diffraction contrast). In this talk I will describe how X-ray microscopy can play a central role in complex material development. I will present details of the technique as well as application examples that highlight the unique capabilities it can bring to the modern materials characterization laboratory.
Sep 04, 2019 | 12.45 - 1.45 PM
Raman imaging and Scanning Electron Microscopy (RISE) combined with EDX - correlative microscopy for different fields of science and technology
Armin Zankel, Institute of Electron Microscopy and Nanoanalysis, NAWI Graz, Graz University of Technology (FELMI), Graz Centre for Electron Microscopy (ZFE), Steyrergasse 17, Austria (ZFE)
Fang Zhou, ZEISS Microscopy
Scanning electron microscopy (SEM) and Raman spectral imaging deliver complementary sample information which helps to gain a deep understanding of the investigated specimens. This recent achievement in correlative microscopy is a full integration of a RISE system into a ZEISS Sigma FE-SEM which enables superior SEM imaging of composite materials and additionally delivers chemical and or molecular information by means of confocal Raman Imaging and EDX analytics. A paper cup was embedded in resin and cut with an ultramicrotome. It shows a complex setup of different layers after using RISE mapping. Further, a similarly prepared plastic packing foil was analyzed, where rutile particles were identified by Raman spectroscopy as additives. Automated particle analysis was performed to determine the particles´ equivalent circle diameter (ECD) and their size distribution. RISE enables pointwise spectroscopic investigation, especially, when the specimens are not flat as is presented. For hard materials like metals, ceramics or mineralogical specimens polished surfaces are a prerequisite. A prominent example for this is a part of the Chelyabinsk meteor, where RISE in combination with EDX enables a more detailed mineralogic characterization.
Sep 02, 2019 | 2.30 - 3.30 PM
The new ZEISS SIMS portfolio – Compositional analysis at all length scales
Dr. Fabián Pérez-Willard & Dr. Peter Gnauck, ZEISS Microscopy | Room H 2037
When it comes to elemental analysis of low concentrations or light elements, Secondary Ion Mass Spectroscopy (SIMS) is the technique of choice for materials characterization. It not only allows to detect element traces down to the ppm level, it also enables detection of all elements of the periodic table and even clusters or small molecules. In this workshop we will give you an insight into this technology and present the new ZEISS SIMS portfolio covering applications in battery and solar cell research and steel failure analysis.
Sep 03, 2019 | 2.30 - 3.30 PM
Connect the microscopic world - Discover new insights by connecting information across dimensions with ZEN Connect
Dr. Alexandra Elli, ZEISS Microscopy
Correlative microscopy becomes increasingly important in all fields of microscopy. Multiple tools are involved during a correlative workflow ranging from light microscopes for large field of view acquisition to light microscopes with highest resolution and finally to field emission scanning electron microscopes showing the ultrastructure of a sample. The combination of various imaging tools reveals new insights into biological interdependencies. So far, a coordinated transfer between different imaging sources is in the focus to connect different imaging modalities. ZEN Connect enables this task in an easy way - and opens up even more possibilities.
Sep 04, 2019 | 2.30 - 3.30 PM
Take your image analysis to the next level with machine learning and cloud-computing
Tobias Volkenandt, ZEISS Microscopy
Since today’s researchers are no longer interested just in great images of their samples but aim for information and measured numbers, post-processing and image analysis have become very important. Machine learning techniques have proven their applicability to this and even offer advantages over classic methods. Learn more about ZEISS ZEN Intellesis and how easy it is to leverage machine learning for image segmentation. Additionally, we will introduce you to a new and free to use platform that allows you to outsource your image analysis workflows to the cloud and share it with your peers: APEER.
Work on a wide range of industrial applications - such as roughness and topographical characterization - that come up every day in QA/QC departments, production environments and R&D labs.
You are interested in a demo? Please fill out the form below.
We are happy to show you the latest innovations and answer your questions in a one-to-one demo with your own samples. Let us know if you would like to join a demo and we will get in contact with you to arrange the details.