Get more information and enhanced data integrity

Harness the complementary nature of light and electron microscopy to get complete data for critical decisions

Increasing material complexity and more rigorous quality inspection requirements are driving industrial QA and materials research engineers to seek new methods for obtaining maximum sample information with the shortest time-to-result.

In order to obtain more meaningful information quickly for quality control and material analysis, engineers are discovering the power of combining complimentary data from light (LM) and scanning electron (SEM) microscopes. The integration and correlation of these two techniques enables you to collect maximum relevant data with minimal effort.

Typical information preferably obtained by digital light microscopy
ZEISS Smartzoom 5
Fracture surface; visible failure lines help to locate the origin of the defect

Fracture surface; visible failure lines help to locate the origin of the defect

Fracture surface; visible failure lines help to locate the origin of the defect
Fast inspection and examination
Enabled by a macro-to-detail workflow and superior flexibility of illumination

Fracture surface; visible failure lines help to locate the origin of the defect

Fast inspection and examination
Enabled by a macro-to-detail workflow and superior flexibility of illumination
Oblique view on a PCB detail, image taken with extended depth of focus

Oblique view on a PCB detail, image taken with extended depth of focus

Oblique view on a PCB detail, image taken with extended depth of focus
Natural view on samples and workpieces
Enabled by true color imaging and extended depth of focus

Oblique view on a PCB detail, image taken with extended depth of focus

Natural view on samples and workpieces
Enabled by true color imaging and extended depth of focus
3D reconstruction of a solder bump with height/depth measurements

3D reconstruction of a solder bump with height/depth measurements

3D reconstruction of a solder bump with height/depth measurements
Reproducible and accurate measurements
Enabled by 2D/3D views and efficient documentation

3D reconstruction of a solder bump with height/depth measurements

Reproducible and accurate measurements
Enabled by 2D/3D views and efficient documentation
Typical information preferably obtained by scanning electron microscopy
ZEISS EVO MA 10
High resolution image of the fracture surface reveals a void from which the fractures extend radially

High resolution image of the fracture surface reveals a void from which the fractures extend radially

High resolution image of the fracture surface reveals a void from which the fractures extend radially
Sub-micrometer surface examination
Enabled by high resolution, high contrast secondary electron beam imaging

High resolution image of the fracture surface reveals a void from which the fractures extend radially

Sub-micrometer surface examination
Enabled by high resolution, high contrast secondary electron beam imaging
Soldered component, HDBSD detector helps to reveal corrosion and damage

Soldered component, HDBSD detector helps to reveal corrosion and damage

Soldered component, HDBSD detector helps to reveal corrosion and damage
Visualization of surface phase contrast
Enabled by backscattered electron imaging

Soldered component, HDBSD detector helps to reveal corrosion and damage

Visualization of surface phase contrast
Enabled by backscattered electron imaging
Soldered component, HDBSD detector helps to reveal corrosion and damage

Lithium ion battery cathode, EDS compositional mapping, main constituents of the different oxides

Soldered component, HDBSD detector helps to reveal corrosion and damage
Microanalysis of elemental chemistry
Enabled by energy-dispersive spectroscopy (EDS)

Lithium ion battery cathode, EDS compositional mapping, main constituents of the different oxides

Microanalysis of elemental chemistry
Enabled by energy-dispersive spectroscopy (EDS)
Complementary data yields superior information

The combined LM and SEM correlative microscopy dataset is much richer than what light or electron microscopy can provide on their own. With more data, you gain a deeper understanding for better interpretations and decisions with respect to the properties or quality of your work pieces. ZEISS is the only company to offer a turnkey solution where both techniques work together seamlessly to deliver complete and detailed datasets.

Learn more about this correlative LM to SEM microscopy solution developed specifically for industrial QA/QC and materials research.

Please fill the form to download the technical note
Brochure: Enhancing Materials Inspection and Characterization Information and Data Integrity by Combining Light and Scanning Electron Microscopy in a Correlative Workflow

 

Further reading
ZEISS Shuttle & Find Bringing the highest level of productivity to correlative microscopy Learn more
We use cookies on this site. Cookies are small text files that are stored on your computer by websites. Cookies are widely used and help to optimize the pages that you view. By using this site, you agree to their use. more