Massive Material Removal and Ultrafast Site-Specific Sample Preparation
Combining Crossbeam Laser and X-ray Microscopy
![]({"small":"https://images.zeiss.com/Microscopy/resource-center/authors/gnauck-peter.ts-1620308195076.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&w=640&s=5709cde04f5158bb14c1efb77a9f011b","large":"https://images.zeiss.com/Microscopy/resource-center/authors/gnauck-peter.ts-1620308195076.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&w=1280&s=c9cfcbab6cc94fcf20516940741490ac","medium":"https://images.zeiss.com/Microscopy/resource-center/authors/gnauck-peter.ts-1620308195076.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&w=832&s=eadcb9eff6b681be2161caed01458529","full":"https://images.zeiss.com/Microscopy/resource-center/authors/gnauck-peter.ts-1620308195076.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&w=1920&s=2737f8edb1cdc2ece024085e770cbeca"})
Dr. Peter Gnauck
Business Development Manager,
ZEISS Microscopy
ZEISS Microscopy
In this webinar, the details of the femtosecond laser, integration of the system and the workflow using the Crossbeam laser together with a X-ray Microscope will be presented along with application examples focusing on geoscience, electronics, battery research and additive manufacturing.
Key Learnings:
- Innovative 3 beam concept for fast and easy sample preparation of various material classes
- Dual chamber approach: Massive material removal without contamination
- Integrated correlative workflow with X-ray Microscopy
![]({"small":"https://images.zeiss.com/Microscopy/resource-center/screensaver/psdfiles/preview-massive-material-removal.ts-1620309928762.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&w=640&s=8b19086a8345ee4c5597aa061b423ee8","large":"https://images.zeiss.com/Microscopy/resource-center/screensaver/psdfiles/preview-massive-material-removal.ts-1620309928762.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&w=1280&s=55e8e05bac697ee13fd565a5ebc19d90","medium":"https://images.zeiss.com/Microscopy/resource-center/screensaver/psdfiles/preview-massive-material-removal.ts-1620309928762.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&w=832&s=78d7da50a3c62d57ad2de4cba4cec3f1","full":"https://images.zeiss.com/Microscopy/resource-center/screensaver/psdfiles/preview-massive-material-removal.ts-1620309928762.jpg?auto=compress%2Cformat&fm=png&ixlib=java-1.1.11&w=1920&s=282f814083bd17f6066fa100ed9174b5"})
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LaserFIB for ZEISS Crossbeam
Your femtosecond laser for ultrafast, large-scale material ablation
Discover the new LaserFIB for ZEISS Crossbeam, your femtosecond laser for ultrafast material processing of large samples. Fabricate samples on the scale from 10 µm to 1 mm or more. Cut deep cross-section through hard material such as SiC and expose structures of interest directly. When performing laser milling you will easily avoid contamination of your FIB-SEM as the laser is attached to a dedicated chamber which is separated from the main instrument chamber.