The Technology Behind ZEISS Crossbeam

SEM Electron Optics

Choose between Two Columns

Field emission SEMs are designed for high resolution imaging. Key to the performance of a field emission SEM is its electron optical column. Gemini technology comes with all ZEISS FE-SEMs and FIB-SEMs: it is tailored for excellent resolution on any sample, especially at low accelerating voltages, for complete and efficient detection, and ease-of-use.

 

Gemini Optics is Characterized by Three Main Components

  • The Gemini objective lens design combines electrostatic and magnetic fields to maximize optical performance while reducing field influences at the sample to a minimum. This enables excellent imaging, even on challenging samples such as magnetic materials.
  • Gemini beam booster technology, an integrated beam deceleration, guarantees small probe sizes and high signal-to-noise ratios.
  • The Gemini Inlens detection concept ensures efficient signal detection by detecting secondary (SE) and backscattered (BSE) electrons in parallel minimizing time-to-image.

 

Benefits for Your FIB-SEM Applications

  • Long-term stability of the SEM alignment and the effortless way it adjusts all system parameters such as probe current and acceleration voltage
  • Achieve distortion-free, high resolution imaging even over large fields of view with the help of the near magnetic-field free optics
  • Tilt the specimen without influencing the electron optical performance
ZEISS Crossbeam with Gemini I SEM Column

ZEISS Crossbeam 340:
Gemini column with single condenser, one Inlens detector and VP capability.

Crossbeam 340 with Gemini I VP

  • maximum sample flexibility in multi-purpose environments
  • in situ experiments with outgassing or charging samples
  • unique Gemini material contrast with the optional Inlens Duo detector
     
ZEISS Crossbeam with Gemini II SEM Column

ZEISS Crossbeam 550:
Gemini II column with double condenser and two Inlens detectors.

Crossbeam 550 with Gemini II

  • high resolution even at low voltage and high current thanks to the double condenser system
  • more information in less time with high resolution imaging and fast analytics
  • unique topographical and material contrast with simultaneous Inlens SE and EsB imaging

Gemini Novel Optics

Profit from Surface Sensitive Imaging

Today’s SEM applications demand high resolution imaging at low landing energy as a standard. It is essential for:

  • beam sensitive samples
  • non-conductive materials
  • gaining true sample surface information without undesirable background signal from deeper sample layers

The novel Gemini optics are optimized for resolutions at low and very low voltages and for contrast enhancement.
Technological characteristics are the high gun resolution mode and the optional Tandem decel.

  • The high gun resolution mode results in minimized chromatic aberration thanks to of a reduction of primary energy width by 30%
ZEISS Crossbeam 550 Objective with Tandem decel

Tandem decel optional sample biasing up to 5 kV further improves the excellent imaging capabilities at low voltages.

Tandem decel , now introduced to ZEISS Crossbeam 550, can be used in two different modes:

  • Tandem decel, a two-step deceleration mode, combines the beam booster technology with a high negative bias voltage that is applied to the sample: the electrons of the primary electron beam are decelerated, thus the landing energy is effectively reduced
  • Apply a variable negative bias voltage between 50 V and 100 V. One application mode enhances the contrast of your images
  • Apply a negative bias voltage between 1 kV and 5 kV and improve the low kV resolution of your images
ZEISS Crossbeam - sections of SEM and FIB column

ZEISS Crossbeam 550 with a Gemini II column incl. double condenser and two Inlens detectors and a FIB-column arranged at an inclination angle of 54°.

FIB-SEM Technology

Discover the only FIB with 100 nA Current

The ZEISS Crossbeam Family comes with a focused ion beam column tailored to achieve precise results in FIB-SEM tomography with isotropic voxel size.

  • Access five orders of magnitude in beam current, from 1 pA up to 100 nA
  • Get precise and reproducible results with maximum stability during acquisition
  • Benefit from fast and precise material removal or milling thanks to the larger beam currents of up to 100 nA
  • Achieve exceptionally small probe sizes with a diameter of less than 3 nm at currents as low as 1 pA
  • The Crossbeam family now additionally comes with automatic FIB emission recovery for long-term experiments