ZEISS Xradia 515 Versa for the APAC Region

Your 3D Submicron Imaging System with Breakthrough Flexibility

ZEISS Xradia 510 Versa

Break the one micron resolution barrier with this X-ray microscope for 3D imaging and in situ / 4D investigations.

Use the combination of resolution and contrast with flexible working distances to extend the power of non-destructive imaging in your lab.

Benefit from its architecture that uses a two-stage magnification technique to achieve submicron resolution at a distance (RaaD). Reducing dependence upon geometric magnification maintains submicron resolution even at large working distances.


Enjoy versatility even at large working distances from the source - from millimeters to centimeters.
  • Perform 3D Imaging for soft or low-Z materials with advanced absorption and innovative phase contrast
  • Achieve world-leading resolution at flexible working distances beyond the limits of projection-based micro-CT
  • Resolve submicrometer-scaled features for diverse sample sizes
  • Extend non-destructive imaging in your lab with an in situ / 4D solution
  • Investigate materials in native-like environments over time
  • Throughput with image quality

Application Examples

ZEISS Xradia 515 Versa

Materials Research

Typical tasks and applications
  • Visualizing cracks in soft composite materials or measuring porosity in steel
  • Perform in situ studies by imaging under varying conditions such as tensile, compression, gas, oxidation, wetting and temperature variations
  • Image materials that are incompatible with vacuum and charged particle beams
  • View into deeply buried microstructures that may be unobservable with 2D surface imaging such as optical microscopy, SEM, and AFM
  • Maintain resolution at a distance for in situ imaging experiments, allowing you to study a wide variety of sample sizes and shapes using various in situ apparatus
  • Understand the impact of these varying conditions over time with the non-destructive nature of X-rays

Application Video

Sintered Powder Steel

Non-destructive 3D imaging is crucial for additive manufacturing development. A powder stainless steel sample was laser-sintered and imaged by ZEISS Xradia Versa. From the 3D dataset, the non-sintered solid phase was virtually segmented and volume quantified. XRM also provides ability to do interior tomography and look at virtual cross-sections without damage to the sample. Sample courtesy of NIST.

Life Sciences

Typical tasks and applications
  • Perform histologies virtually and visualize cellular and subcellular features
  • Expand your views in developmental biology with high resolution, high contrast images of cellular and subcellular structures
  • Image large intact samples such as brains or large bones
  • Achieve high resolution and high contrast for unstained and stained tissue
  • Investigate hard and soft tissues and biological microstructures
Dental implant © Sunita Ho, UCSF, California
Dental implant

Raw Materials

Typical tasks and applications
  • Characterize heterogeneity at core plug scale and quantify pore structures
  • Measure fluid flow, analyze texture, and understand dimensional classification
  • Study carbon sequestration efforts
  • Advance mining processes: analyze tailings to maximize mining efforts; conduct thermodynamic leaching studies; perform QA/QC analysis of mining products such as iron ore pellets
  • Benefit from getting the most accurate 3D submicron support for digital rock simulations, in situ multiphase fluid flow studies, 3D mineralogy, and laboratory-based diffraction contrast tomography (LabDCT)
  • Perform multi-scale imaging, characterization and modeling of large (4" core) samples at high throughput
Shale heterogeneity
Shale heterogeneity


Typical tasks and applications
  • Optimize your process development and analyze failures by using non-destructive submicron imaging of intact packages for defect localization and characterization
  • Measure buried features in three dimensions or study package reliability
  • Benefit from high resolution and non-destructive imaging for 3D submicron imaging that complements or replaces physical cross sectioning methods
  • Work efficiently in a single tool workflow with high throughput macro-scanning of an intact device
  • Non-destructively scout-and-zoom from module to package to interconnect for submicron imaging of defect re-localization and characterization with a fast time to results that complements or replaces physical cross-sectioning
Flip chip bumps
Flip chip bumps


ZEISS Advanced Reconstruction Toolbox

Better image quality, higher throughput

The Advanced Reconstruction Toolbox is an innovative platform on your ZEISS Xradia 3D X-ray microscope (XRM) or microCT for accessing advanced reconstruction technologies. Unique modules leverage deep understanding of both X-ray physics and customer applications to solve some of the hardest imaging challenges in new and innovative ways.

Here is what you can find about this latest technical advancement in Xradia technology:

With the Advanced Reconstruction Toolbox, you are able to:

  • Improve data collection and analysis for accurate and faster decision-making
  • Greatly enhance image quality
  • Achieve superior interior tomography or throughput on a broad class of samples
  • Reveal subtle difference through improved contrast-to-noise
  • Increase speed at an order of magnitude for sample classes requiring repetitive workflow

These optional modules are workstation-based solutions for easy access and usability:  

  • OptiRecon
  • DeepRecon

ZEISS OptiRecon

Similar results, 4x faster

ZEISS OptiRecon is an implementation of iterative reconstruction that greatly increases acquisition throughput, while optimizing image quality.
ZEISS OptiRecon allows you to achieve good image quality with about one quarter of the data acquisition time for many samples typically found in the academic and industrial energy, engineering, natural resources, biological, semiconductor, manufacturing, and electronics research fields.

OptiRecon 4X Throughput for Battery Research
OptiRecon 4X Throughput for Battery Research
Mobile phone camera module demonstrating 4X throughput improvement with comparable image quality
Mobile phone camera module demonstrating 4X throughput improvement with comparable image quality

Slide right to left to compare:

Standard Reconstruction #300Zoom OptiRecon #300Zoom
Standard Reconstruction

Application Examples

4X Throughput for Mining Powder

Flexibility for Rock Exploration 
– Image Quality vs. Throughput

4X Throughput for Battery Research

Flexibility for Battery Research
– Image Quality vs. Throughput

2X Throughput for 2.5D Semiconductor Package (50 mm x 75 mm)

Improved Image Quality for 2.5D Semiconductor Package (50 mm x 75) 

2X Throughput for Semiconductor Package

Improved Image Quality for Semiconductor Package

ZEISS DeepRecon

Imaging throughput up to 10X faster for repetitive samples

ZEISS DeepRecon for ZEISS Xradia X-ray systems is the first commercially available deep learning reconstruction technology. It enables you to increase throughput by an order of magnitude (up to 10X), without sacrificing novel XRM resolution at a distance, for repetitive workflow applications. DeepRecon uniquely harvests the hidden opportunities in big data generated by your Xradia platform and provides significant AI-driven speed or image quality improvement.

DeepRecon for Repetitive Workflows – 9X Throughput for Geo Science Exploration
DeepRecon for Repetitive Workflows – 9X Throughput for Geo Science Exploration
Use of AI to Advance Reconstruction Technology

Super-charging 3D X-ray Imaging

Wiley Webinar

One of the principal challenges when applying X-ray microscopy to solve academic and industrial problems is a compromise one needs to make between imaging throughput and image quality. High resolution 3D X-ray microtomography acquisition times can be on the order of several hours, which can lead to challenging return-on-investment (ROI) calculations when weighing the relative advantage of high accuracy 3D analysis with cheaper, less capable analytical techniques.

To tackle this issue, optimization of each step in the production of actionable information from these microscopes is required. For 3D X-ray microtomography, these steps typically consist of sample mounting, scan setup, 2D-projection image acquisition, 2D to 3D image reconstruction, image post-processing and segmentation, and final analysis.

In case of questions or to learn how to upgrade your
3D X-ray microscope with advanced reconstruction technologies

Please fill the form below to contact us.
A member of our team will respond to you as soon as possible.


Increase your sample handling efficiency

Autoloader option enables you to program up to 70 samples at a time to run sequentially.
Autoloader option enables you to program up to 70 samples at a time to run sequentially.

Maximize your instrument's utilization with the optional Autoloader, available for all instruments in the ZEISS Xradia Versa series. Reduce the frequency of user interaction and increase productivity by queueing multiple jobs. Load up to 14 sample stations, which can support up to 70 samples, and set to run overnight, or across multiple days. Unprecedented mechanical stability enables high volume quantitative repetitive scanning of like samples.

Wide Field Mode

Flexibly image larger samples

Image large samples with Wide Field Mode such as this 6” stereo speaker.
Image large samples with Wide Field Mode such as this 6” stereo speaker.

Wide Field Mode (WFM) can be used to image across an extended lateral field of view. The wide lateral field of view can provide 3x larger 3D volume for large samples, or give a higher voxel density for a standard field of view. All Xradia Versa systems are capable of WFM with the 0.4x objective. The Xradia 620 Versa system also features WFM with the 4x objective. In combination with Vertical Stitching, WFM enables you to image larger samples at exceptional resolution.


Create Efficient Workflows by Using The Simple Control System

Easily scout a region of interest and specify scanning parameters within the Scout-and-Scan Control System. Take advantage of the easy-to-use system in your central lab where users may have a variety of experience levels.

Benefit from:

  • Internal camera for sample viewing
  • Recipe control (set, save, recall)
  • Multiple energies
  • Multiple samples with Autoloader option
  • Micropositioning capability with a simple mouse click
Scout-and-Scan Control System
Scout-and-Scan Control System
Lithium-ion Battery
Lithium-ion Battery

Visualization and Analysis Software

ZEISS recommends Dragonfly Pro from Object Research Systems (ORS)
An advanced analysis and visualization software solution for your 3D data acquired by a variety of technologies including X-ray, FIB-SEM, SEM and helium ion microscopy.
Available exclusively through ZEISS, ORS Dragonfly Pro offers an intuitive, complete, and customizable toolkit for visualization and analysis of large 3D grayscale data. Dragonfly Pro allows for navigation, annotation, creation of media files, including video production, of your 3D data. Perform image processing, segmentation, and object analysis to quantify your results.



ZEISS Xradia 515 Versa

最先端の研究の サポートに

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ZEISS Xradia 515 Versa3D X-ray Microscope

Non-destructive imaging for advanced packaging.

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ZEISS Xradia 515 Versa3D X線顕微鏡

トップクラスのResolution at a Distance

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ZEISS Xradia 515 Versa

3D X 線イメージングの境界線を押し広げる

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For the APAC region only!