ZEISS Xradia 610 and 620 Versa

3D X-ray Microscopy for Faster Sub-Micron Imaging of Intact Samples

Move beyond exploration to achieve your moments of discovery.

Unlock new degrees of versatility for your scientific and industrial research with the most advanced 3D X-ray microscope models in the ZEISS Xradia Versa family.

Building on industry-best resolution and contrast, ZEISS Xradia 610 & 620 Versa expand the boundaries of your non-destructive sub-micron scale imaging.

Highlights

Extending the Limits of Micro- and Nano-CT Solutions

Non-destructive sub-micron scale microscopy of intact samples
Higher flux and faster scans without compromising resolution
True spatial resolution of 500 nm with a minimum achievable voxel size of 40 nm
High resolution across a broad range of sample types, sizes, and working distances
In situ imaging for non-destructive characterization of microstructures in controlled environments and over time
Upgradeable and extendible with future innovations and developments

Highest Resolution and Flux

Where traditional tomography relies on single-stage geometric magnification, Xradia Versa features a combination of unique two-stage magnification optics and a high flux X-ray source to produce faster sub-micron scale resolution images. The Resolution at a Distance (RaaD) architecture enables high resolution 3D imaging of larger, denser objects including intact components and devices. The optional flat panel extension (FPX) enables rapid scans of very large samples (up to 25 kg), allowing navigation to interior regions of interest.

New Degrees of Freedom

Use the industry’s most comprehensive 3D X-ray imaging solution for advanced scientific and industrial research: Maximize absorption and phase contrast to achieve unprecedented characterisation of your materials and their properties. Unlock 3D crystallographic information with Diffraction Contrast Tomography. Improve scan speed and accuracy of large or irregular samples with advanced acquisition techniques. Apply machine learning algorithms to help with post-processing and segmentation of your samples.

Premier 4D / In Situ Solution

ZEISS Xradia 600-series Versa can non-destructively characterize the 3D microstructure of materials under controlled perturbations (in situ), and observe the evolution of structures over time (4D). By leveraging Resolution at a Distance, the Xradia Versa maintains highest resolution across large working distances, accommodating both sample, environmental chamber, and high precision in-situ load rigs without sacrificing resolution. The Versa seamlessly integrates with other ZEISS microscopes to solve multi-scale correlative imaging challenges.

Application Examples

ZEISS Xradia 610 and 620 Versa at Work

Lithium Ion Batteries

Typical tasks and applications

Recipe development and supply chain control: Inspection of intact samples for effective supplier control, revealing changes in recipe or cost savings that may affect performance or longevity
Safety and quality inspection: Identification of debris, particle formation, burrs at the electrical contact or damage to the polymer separator
Lifetime and aging effect: Longitudinal studies of aging effects

Intact cylinder cell (160 kV) – welding burrs, metallic inclusions, folds and kinks in conductive layers.

Large pouch cell (120 kV) – failure analysis, swelling, wetting, electrolyte gas evolution.

Small pouch cell (80 kV) – in situ microstructure, aging effect at cathode grain level, separator layer.

Small pouch cell: 0.4x overview scan; 4x Resolution at a Distance; 20x Resolution at a Distance.

Electronics and Semiconductor Packaging

Typical tasks and applications

Perform structural and failure analysis for process development, yield improvement and construction analysis of advanced semiconductor packages, including 2.5/3D and fan-out packages
Analyze printed circuit boards for reverse engineering and hardware security
Non-destructively image across length scales from module to package to interconnect for submicron-resolution characterization of defects at speeds that can complement physical cross-sectioning
Enable better understanding of defect locations and distributions by viewing unlimited virtual cross-section and plan-view images from all desired angles

Visualization of C4 bumps, TSVs, and Cu-pillar micro bumps in a 2.5D package, enabling high-resolution views from within the intact package, 1 µm/voxel.

Virtual cross section from the 2.5D package reveals solder cracks and voids in C4 bumps.

DRAM package interconnect within a 10 mm x 7 mm x 1 mm package containing a 4-die stack. Solder extrusion is easily visualized in 3 dimensions, 0.8 µm/voxel.

Virtual cross section of micro bumps in a DRAM package. TSVs are 6 μm in diameter and micro bumps average 35 µm in diameter. Small solder voids of 2 μm are visible.

Additive Manufacturing

Typical tasks and applications

Detailed shape, size, and volume distribution analysis of particles in Additive Manufacturing (AM) powder bed to determine proper process parameters
High-resolution, non-destructive imaging for microstructural analysis of AM parts
3D imaging for comparison with the nominal CAD representation
Detection of unmelted particles, high-Z inclusions, and voids
Surface roughness analysis of inner structures that cannot be accessed by other methods

Surface roughness evaluation of an AM printed duct (Ti-6Al-4V); high resolution scan acquired at ~1.7 mm voxel over a ~3.4 mm area.

Imaging of different A205 AM powder qualities at 3.9 µm voxel resolution.

Inner structure of an AM manufactured aluminum gear wheel; 3 µm voxel resolution imaging is used to see unmelted particles, high-Z inclusions, and small voids.

ISO 25178 surface roughness evaluation of a Ti-6Al-4V test sample. Results are very similar between XRM and ZEISS Smartproof 5 confocal microscope.

Materials Research

Typical tasks and applications

Characterize three-dimensional structure
Observe failure mechanisms, degradation phenomena, and internal defects
Investigate properties at multiple length scales
Quantify microstructural evolution
Perform in situ and 4D (time dependent studies) to understand the impact of heating, cooling, desiccation, wetting, tension, compression, imbibition, drainage and other simulated environmental studies

Additive manufactured lattice structure.

Porous glass foam insulation imaged at multiple length scales.

Carbon fiber reinforced polymer composite.

Localized high resolution tomography and segmentation of multiple phases in concrete.

Raw Materials

Typical tasks and applications

Perform multiscale pore structural and fluid flow analysis
Directly measure fluid flow at the pore scale using in situ flow equipment
Analyze crystal structures using LabDCT
Particle analysis with full 3D reconstruction
Advance mining processes: analyze tailings to maximize mining efforts; conduct thermodynamic leaching studies; perform QA/QC analysis of mining products such as iron ore pellets
Understand grain orientations in steel and other metals

Individual gold grain identified from population of ~26,000 pyrite grains.

Multiscale non-invasive characterization of sandstone core, showing high quality non-invasive interior tomography and integrated pore scale analytical investigation (showing pore separation).

Traditional absorption contrast image of disaggregated olivine.

Individual sub-crystals identified using LabDCT on disaggregated olivine.

Life Sciences

Typical tasks and applications

3D imaging of biological samples in their natural surroundings
Imaging of plant roots still embedded in their original soil without any special sample preparation
Imaging of fragile animals and plants without any sample preparation and sectioning
Sub-micron imaging of solid structures like seeds as a whole

The XRM micrograph of a blossom reveals its components in a new 3D view. Sepals (yellow) and petals (purple) can be distinguished.

Dragonfly, imaged in its native structure without any sample preparation and sectioning.

Seeds are very solid and compact structures and their inside is difficult to image as a whole. The image shows the pre-shaped seed leaves which will contain the energy reservoir for the further grow of the plant.

Embedded plant root in soil: the root can be recognized as a dominant structure within the soil which consists of grains of different sizes and shapes. Voxel size: 5.5 µm.

Technology Insights

Non-destructive Imaging at Industry-best Resolution and Contrast

Highest Resolution without Compromise

Standard X-ray computed tomography (CT) is limited to small sample sizes when imaging at high resolution; due to the geometric nature of magnification. Maintaining high resolution for larger samples is impossible due to the longer working distances required. High resolution imaging in CT systems also requires low X-ray flux, reducing the throughput of the measurement. This limits the practical application of maximum resolution claimed by most CT manufacturers.

ZEISS Xradia 600-series Versa overcomes these trade-offs by integrating dual-stage magnification architecture with high flux X-ray source technology.

ZEISS specifies true spatial resolution, bringing a standard measure of microscope performance to 3D X-ray measurement. Spatial resolution refers to the minimum separation at which two features can be resolved by an imaging system. ZEISS Xradia 600-series Versa systems obtain true spatial resolution of 500 nm with a minimum achievable voxel size of 40 nm.

Higher X-ray Flux Source

Numerous Advantages

ZEISS Xradia 600-series Versa introduces a breakthrough high power (25 W) X-ray source technology that can provide significantly higher X-ray flux compared to its predecessors. The new source pushes the boundaries of performance with improved thermal management, increased flux and throughput while preserving resolution performance. A new source control system improves source responsiveness enabling faster scan setup leading to an easier and more engaging user experience.

What higher X-ray flux offers:

Faster tomography scans
More sample runs
More regions of interest
Higher contrast-to-noise ratio
Stronger diffraction patterns
Enabling long/multi-scan workflows
(in situ, DSCoVer, stitching, DCT)

ZEISS Xradia 620 Versa X-ray source.

ZEISS X-ray Microscopes

The Versatile Advantage of RaaD

ZEISS Xradia Versa uses a two-stage magnification architecture to enable sub-micron resolution imaging at large working distances (Resolution at a Distance) for a diverse set of sample sizes and types. Images are initially magnified via geometric projection as with conventional microCT, the projected image is cast onto a scintillator, converting X-rays to a visible light image which is then optically magnified by microscope optics before acquisition by a CCD detector.

With more X-ray photons available, the ZEISS Xradia 600-series Versa provides faster time to results for the widest range of sample sizes and types, without compromising resolution.

Conventional microCT Architecture

Sample must be close to the source to achieve resolution.

ZEISS XRM Two-stage Magnification Architecture

Sample imaged independent of distance to source, enabling interiors of larger samples to be imaged non-destructively at higher resolution.

Accessories

Extend the Range of Possibility for Advanced Material Characterization in 3D

LabDCT

Bringing synchrotron capabilities to your lab experiments

LabDCT (Diffraction Contrast Tomography), available exclusively on Xradia 620 Versa, enables non-destructive mapping of orientation and microstructure in 3D. Direct visualization of 3D crystallographic grain orientation opens up a new dimension in the characterization of metal alloys and polycrystalline materials.

Obtain comprehensive 3D microstructure analysis from large volumes down to local individual grain boundary analysis.
Investigate microstructural evolution with 4D imaging experiments.
Combine 3D crystallographic information with 3D microstructural features.
Combine modalities to understand structure-property relationships.

Armco iron sample with abnormal grain growth.

Flat Panel Extension

Image even larger samples with high throughput

Three-stage Scout-and-Zoom workflow.

Optional Flat Panel Extension (FPX) delivers large-sample, high throughput scanning with ZEISS best-in-class image quality. FPX enhances imaging flexibility and creates workflow efficiencies with an all-in-one system for industrial and academic research.

Scout-and-Zoom is a unique capability of ZEISS X-ray microscopes that leverages FPX to perform exploratory “Scout” scans across a large field of view to identify interior regions of interest for higher resolution “Zoom” scans without complex sample preparation.

In Situ experiments

Push the limits for scientific advancement

ZEISS Xradia Versa provides the industry’s premier 3D imaging solution for the widest variety of in situ rigs, from high pressure flow cells to tension, compression and thermal stages.

To accommodate various types of in situ apparatus, such experiments require samples to be mounted further away from the X-ray source. With traditional microCT systems, this significantly limits the resolution achievable during such measurements. ZEISS X-ray microscopes are uniquely capable of Resolution at a Distance (RaaD) technology, which give the highest fidelity of 3D structural information during in situ imaging.

Tensile testing of laser welded steel under increasing load.

Autoloader

Increase your sample handling efficiency

Autoloader option enables you to program up to 70 samples at a time to run sequentially.

Maximize your instrument's utilization with the optional Autoloader, available for all instruments in the ZEISS Xradia Versa series. Reduce the frequency of user interaction and increase productivity by queueing multiple jobs. Load up to 14 sample stations, which can support up to 70 samples, and set to run overnight, or across multiple days. Unprecedented mechanical stability enables high volume quantitative repetitive scanning of like samples.

Wide Field Mode

Flexibly image larger samples

Image large samples with Wide Field Mode such as this 6” stereo speaker.

Wide Field Mode (WFM) can be used to image across an extended lateral field of view. The wide lateral field of view can provide 3x larger 3D volume for large samples, or give a higher voxel density for a standard field of view. All Xradia Versa systems are capable of WFM with the 0.4x objective. The Xradia 620 Versa system also features WFM with the 4x objective. In combination with Vertical Stitching, WFM enables you to image larger samples at exceptional resolution.

Automated Filter Changer

Simplify exploration of challenging samples

The Automated Filter Changer (AFC) offers 12 standard filters with room for 12 custom filters.

X-ray source attenuation filters are used to tune the X-ray energy spectrum illuminating the sample to optimise contrast, which depends on the specific material properties of the sample. Every ZEISS Xradia Versa comes standard with a set of 12 filters. ZEISS Xradia 610 Versa is equipped with a single filter slot allowing for manual filter change. ZEISS Xradia 620 Versa systems feature an Automated Filter Changer (AFC), which improves ease of use, allowing seamless change of filters for convenient investigation of unknown samples.

The Xradia 600-series Versa

	ZEISS Xradia 610 Versa	ZEISS Xradia 620 Versa
Spatial resolution^a	500 nm	500 nm
Resolution at a Distance (RaaD™)^a,b (at 50 mm working distance)	1.0 μm	1.0 μm
Minimum Achievable Voxel^c (Voxel size at sample at maximum magnification)	40 nm	40 nm
Source Voltage Range	30–160 kV	30–160 kV
Source Maximum Power Output	25 W	25 W
Scout-and-Scan™ Control System	✓	✓
Scout-and-Zoom	✓	✓
Vertical Stitch	✓	✓
XRM Python API	✓	✓
Automated Filter Changer (AFC)		✓
High Aspect Ratio Tomography (HART)		✓
Dual Scan Contrast Visualizer (DSCoVer)		✓
Wide Field Mode	0.4x	0.4x and 4x
ZEISS LabDCT for Diffraction Contrast Tomography		Optional
ZEISS Autoloader	Optional	Optional
In Situ Interface Kit	Optional	Optional
ZEISS OptiRecon	Optional	Optional
ZEISS ZEN Intellesis	Optional	Optional
ORS Dragonfly Pro	Optional	Optional

^aSpatial resolution measured with ZEISS Xradia 2D resolution target, normal field mode, optional 40x objective.
^b RaaD™ working distance defined as clearance around axis of rotation
^c Voxel is a geometric term that contributes to but does not determine resolution, and is provided here only for comparison.
ZEISS specifies resolution via spatial resolution, the true overall measurement of instrument resolution

Protect Your Investment

ZEISS X-ray microscopes are designed to be upgradeable and extendible with future innovations and developments to protect our customer’s investment. This ensures the microscope capabilities evolve with the advancements in leading edge technology.
From ZEISS Xradia Context microCT, to ZEISS Xradia 510/520 Versa, and now with the addition of ZEISS Xradia 610/620 Versa, users can field-convert their systems to the latest X ray microscopes.

Software

Create Efficient Workflows by Using The Simple Control System

Easily scout a region of interest and specify scanning parameters within the Scout-and-Scan Control System. Take advantage of the easy-to-use system in your central lab where users may have a variety of experience levels.

Benefit from: