- Home
- Products
- X-ray Microscopy
- ZEISS Xradia 610 and 620 Versa
ZEISS Xradia 610 and 620 Versa
3D X-ray Microscopy for Faster Sub-Micron Imaging of Intact Samples

Move beyond exploration to achieve your moments of discovery.
Unlock new degrees of versatility for your scientific and industrial research with the most advanced 3D X-ray microscope models in the ZEISS Xradia Versa family.
Building on industry-best resolution and contrast, ZEISS Xradia 610 & 620 Versa expand the boundaries of your non-destructive sub-micron scale imaging.
Highlights
Extending the Limits of Micro- and Nano-CT Solutions
- Non-destructive sub-micron scale microscopy of intact samples
- Higher flux and faster scans without compromising resolution
- True spatial resolution of 500 nm with a minimum achievable voxel size of 40 nm
- High resolution across a broad range of sample types, sizes, and working distances
- In situ imaging for non-destructive characterization of microstructures in controlled environments and over time
- Upgradeable and extendible with future innovations and developments
- Throughput with image quality
Highest Resolution and Flux
Where traditional tomography relies on single-stage geometric magnification, Xradia Versa features a combination of unique two-stage magnification optics and a high flux X-ray source to produce faster sub-micron scale resolution images. The Resolution at a Distance (RaaD) architecture enables high resolution 3D imaging of larger, denser objects including intact components and devices. The optional flat panel extension (FPX) enables rapid scans of very large samples (up to 25 kg), allowing navigation to interior regions of interest.
New Degrees of Freedom
Use the industry’s most comprehensive 3D X-ray imaging solution for advanced scientific and industrial research: Maximize absorption and phase contrast to achieve unprecedented characterisation of your materials and their properties. Unlock 3D crystallographic information with Diffraction Contrast Tomography. Improve scan speed and accuracy of large or irregular samples with advanced acquisition techniques. Apply machine learning algorithms to help with post-processing and segmentation of your samples.
Premier 4D / In Situ Solution
ZEISS Xradia 600 Series Versa can non-destructively characterize the 3D microstructure of materials under controlled perturbations (in situ), and observe the evolution of structures over time (4D). By leveraging Resolution at a Distance, the Xradia Versa maintains highest resolution across large working distances, accommodating both sample, environmental chamber, and high precision in-situ load rigs without sacrificing resolution. The Versa seamlessly integrates with other ZEISS microscopes to solve multi-scale correlative imaging challenges.
Application Examples
ZEISS Xradia 610 and 620
Versa at Work
Electronics and Semiconductor Packaging
Typical tasks and applications
- Perform structural and failure analysis for process development, yield improvement and construction analysis of advanced semiconductor packages, including 2.5/3D and fan-out packages
- Analyze printed circuit boards for reverse engineering and hardware security
- Non-destructively image across length scales from module to package to interconnect for submicron-resolution characterization of defects at speeds that can complement physical cross-sectioning
- Enable better understanding of defect locations and distributions by viewing unlimited virtual cross-section and plan-view images from all desired angles




Lithium Ion Batteries
Typical tasks and applications
- Recipe development and supply chain control: Inspection of intact samples for effective supplier control, revealing changes in recipe or cost savings that may affect performance or longevity
- Safety and quality inspection: Identification of debris, particle formation, burrs at the electrical contact or damage to the polymer separator
- Lifetime and aging effect: Longitudinal studies of aging effects




Additive Manufacturing
Typical tasks and applications
- Detailed shape, size, and volume distribution analysis of particles in Additive Manufacturing (AM) powder bed to determine proper process parameters
- High-resolution, non-destructive imaging for microstructural analysis of AM parts
- 3D imaging for comparison with the nominal CAD representation
- Detection of unmelted particles, high-Z inclusions, and voids
- Surface roughness analysis of inner structures that cannot be accessed by other methods




Materials Research
Typical tasks and applications
- Characterize three-dimensional structure
- Observe failure mechanisms, degradation phenomena, and internal defects
- Investigate properties at multiple length scales
- Quantify microstructural evolution
- Perform in situ and 4D (time dependent studies) to understand the impact of heating, cooling, desiccation, wetting, tension, compression, imbibition, drainage and other simulated environmental studies




Raw Materials
Typical tasks and applications
- Perform multiscale pore structural and fluid flow analysis
- Directly measure fluid flow at the pore scale using in situ flow equipment
- Analyze crystal structures using LabDCT Pro
- Particle analysis with full 3D reconstruction
- Advance mining processes: analyze tailings to maximize mining efforts; conduct thermodynamic leaching studies; perform QA/QC analysis of mining products such as iron ore pellets
- Understand grain orientations in steel and other metals




Life Sciences
Typical tasks and applications
- 3D imaging of biological samples in their natural surroundings
- Imaging of plant roots still embedded in their original soil without any special sample preparation
- Imaging of fragile animals and plants without any sample preparation and sectioning
- Sub-micron imaging of solid structures like seeds as a whole




Technology Insights
Non-destructive Imaging at Industry-best Resolution and Contrast
Highest Resolution without Compromise
Standard X-ray computed tomography (CT) is limited to small sample sizes when imaging at high resolution; due to the geometric nature of magnification. Maintaining high resolution for larger samples is impossible due to the longer working distances required. High resolution imaging in CT systems also requires low X-ray flux, reducing the throughput of the measurement. This limits the practical application of maximum resolution claimed by most CT manufacturers.
ZEISS Xradia 600 Series Versa overcomes these trade-offs by integrating dual-stage magnification architecture with high flux X-ray source technology.
ZEISS specifies true spatial resolution, bringing a standard measure of microscope performance to 3D X-ray measurement. Spatial resolution refers to the minimum separation at which two features can be resolved by an imaging system. ZEISS Xradia 600 Series Versa systems obtain true spatial resolution of 500 nm with a minimum achievable voxel size of 40 nm.

Higher X-ray Flux Source
Numerous Advantages
ZEISS Xradia 600 Series Versa introduces a breakthrough high power (25 W) X-ray source technology that can provide significantly higher X-ray flux compared to its predecessors. The new source pushes the boundaries of performance with improved thermal management, increased flux and throughput while preserving resolution performance. A new source control system improves source responsiveness enabling faster scan setup leading to an easier and more engaging user experience.
What higher X-ray flux offers:
- Faster tomography scans
- More sample runs
- More regions of interest
- Higher contrast-to-noise ratio
- Stronger diffraction patterns
- Enabling long/multi-scan workflows
(in situ, DSCoVer, stitching, DCT)

ZEISS X-ray Microscopes
The Versatile Advantage of RaaD
ZEISS Xradia Versa uses a two-stage magnification architecture to enable sub-micron resolution imaging at large working distances (Resolution at a Distance) for a diverse set of sample sizes and types. Images are initially magnified via geometric projection as with conventional microCT, the projected image is cast onto a scintillator, converting X-rays to a visible light image which is then optically magnified by microscope optics before acquisition by a CCD detector.
With more X-ray photons available, the ZEISS Xradia 600 Series Versa provides faster time to results for the widest range of sample sizes and types, without compromising resolution.

Conventional microCT Architecture

ZEISS XRM Two-stage Magnification Architecture

Accessories
Extend the Range of Possibility for Advanced Material Characterization in 3D
Better image quality, higher throughput
Advanced Reconstruction Toolbox (ART) introduces Artificial Intelligence (AI)-driven reconstruction technologies on your ZEISS Xradia 3D X-ray microscope (XRM) or microCT. A deep understanding of both X-ray physics and applications enable you to solve some of the hardest imaging challenges in new and innovative ways.
Discover how speed of data acquisition and reconstruction as well as image quality are enhanced without sacrificing resolution by using OptiRecon, two variants of DeepRecon and PhaseEvolve, the unique modules of ART.
- Improve data collection and analysis for accurate and faster decision-making
- Greatly enhance image quality
- Achieve superior interior tomography or throughput on a broad class of samples
- Reveal subtle difference through improved contrast-to-noise
- Increase speed at an order of magnitude for sample classes requiring repetitive workflow

The optional modules are workstation-based solutions for easy access and usability:
- DeepRecon Pro & Custom for Deep learning-based reconstruction
- PhaseEvolve for contrast enhancement
- OptiRecon for iterative reconstruction
ZEISS DeepRecon Pro provides a straightforward, uncomplicated, and powerful application of AI and deep neural network technology for enhancing X-ray tomography results without prior knowledge on deep learning technology. [...] It helps us to reduce the scan time required for in situ fluid-rock interaction experiments when we need to work with long exposure times.
Dr. Markus Ohl | X-Ray microscopy | EPOS-NL MINT | Utrecht University, NL
LabDCT Pro
Unlocking Crystallographic Information
LabDCT Pro for diffraction contrast tomography (DCT), available exclusively on Xradia 620 Versa, enables non-destructive mapping of grain orientation and microstructure in 3D. Direct visualization of 3D crystallographic grain orientation opens up a new dimension in the characterization of polycrystalline materials like metal alloys, geomaterials, ceramics, or pharmaceuticals.
- LabDCT Pro supports specimens with crystal structures from cubic symmetry to systems with lower symmetry such as monoclinic materials
- Acquire high resolution crystallographic information using the dedicated 4X DCT objective. For even larger samples, use large area mapping and increase your throughput with the Flat Panel Extension (FPX).
- Obtain comprehensive 3D microstructure analysis from larger representative volumes and wide-ranging sample geometries
- Investigate microstructural evolution with 4D imaging experiments.
- Combine 3D crystallographic information with 3D microstructural features.
- Combine modalities to understand structure-property relationships.

Flat Panel Extension
Image even larger samples with high throughput

Optional Flat Panel Extension (FPX) delivers large-sample, high throughput scanning with ZEISS best-in-class image quality. FPX enhances imaging flexibility and creates workflow efficiencies with an all-in-one system for industrial and academic research.
Scout-and-Zoom is a unique capability of ZEISS X-ray microscopes that leverages FPX to perform exploratory “Scout” scans across a large field of view to identify interior regions of interest for higher resolution “Zoom” scans without complex sample preparation.
FPX also enables high throughput and large area mapping capabilities for LabDCT Pro.
in situ experiments
Push the limits for scientific advancement
ZEISS Xradia X-ray systems provide the industry’s premier 3D imaging solution for the widest variety of in situ rigs, from high pressure flow cells to tension, compression, and thermal stages.
Moving beyond the three dimensions of space, leverage the non-destructive nature of X-ray investigation to extend your studies into the dimension of time with 4D experiments. ZEISS Xradia XRM platforms can accommodate a variety of in situ rigs, from high pressure flow cells to tension, compression and thermal stages, to user-customized designs. You can add the optional in situ Interface Kit to your ZEISS Xradia XRM, which includes a mechanical integration kit, a robust cabling guide and other facilities (feed-throughs) along with recipe-based software that simplifies your control from within the Scout-and-Scan user interface. When your needs require pushing the resolution limits of your in situ experiments, convert your ZEISS Xradia XRM to an Xradia 620 Versa X-ray microscope to leverage Resolution at a Distance (RaaD) technology for the maximum performance tomographic imaging of samples within in situ chambers or rigs.

SmartShield
Easily Protect Your Sample to Optimize Experiment Setup
SmartShield is a solution that protects your sample and your microscope. This automated collision avoidance system works within the Scout and Scan Control System. It enables you to navigate Xradia Versa more confidently than ever. How it works - with the click of a button SmartShield creates a digital protective layer based on the dimensions of your sample.
SmartShield lets you benefit from:
- Improved operator efficiency enabled by a streamlined sample setup
- Enhanced user experience for novice and advanced users
- Protecting your valuable samples and your investment
- Uncompromising scan quality
Metrology Extension
Adding Measurement Accuracy to X-ray Microscopy
With the Metrology Extension (MTX) you turn your Xradia 620 Versa into a verified measurement accuracy system far beyond the limits of conventional CT technology. This is essential for academic and industrial labs where miniaturization and integration of components drive a growing demand for high-resolution metrology. Benefit from high resolution X-ray imaging combined with high-precision metrology.

Reveal Smallest Dimensions
Measure them Most Accurately
- Leading CT metrology accuracy: Calibrated with MTX, ZEISS Xradia Versa provides a market-leading maximum permissible error value of MPESD = (1.9 + L/100) μm for measurements in small-scale volumes, where L is the measured length in mm.
- Small volumes at high resolution: MTX enables measurements with high dimensional accuracy within small reconstructed volumes of 125 mm3.
- Simple calibration workflow: The MTX package provides an integrated user-guided calibration workflow.
- Once the calibration routine has been executed, you perform precise measurements and make the data available to standard metrology software for further processing.

Autoloader
Increase your sample handling efficiency

Maximize your instrument's utilization with the optional Autoloader, available for all instruments in the ZEISS Xradia X-ray microscope platforms. Reduce the frequency of user interaction and increase productivity by queueing multiple jobs. Load up to 14 sample stations, which can support up to 70 samples, and set to run overnight, or across multiple days. Unprecedented mechanical stability enables high volume quantitative repetitive scanning of like samples.
Wide Field Mode
Flexibly image larger samples

Wide Field Mode (WFM) can be used to image across an extended lateral field of view. The wide lateral field of view can provide 3x larger 3D volume for large samples, or give a higher voxel density for a standard field of view. All Xradia Versa systems are capable of WFM with the 0.4x objective. The Xradia 620 Versa system also features WFM with the 4x objective. In combination with Vertical Stitching, WFM enables you to image larger samples at exceptional resolution.
Automated Filter Changer
Simplify exploration of challenging samples

X-ray source attenuation filters are used to tune the X-ray energy spectrum illuminating the sample to optimise contrast, which depends on the specific material properties of the sample. Every ZEISS Xradia Versa comes standard with a set of 12 filters. ZEISS Xradia 610 Versa is equipped with a single filter slot allowing for manual filter change. ZEISS Xradia 620 Versa systems feature an Automated Filter Changer (AFC), which improves ease of use, allowing seamless change of filters for convenient investigation of unknown samples.
The Xradia 600 Series Versa
|
ZEISS Xradia 610 Versa | ZEISS Xradia 620 Versa |
---|---|---|
Spatial resolutiona |
500 nm |
500 nm |
Resolution at a Distance (RaaD™)a,b |
1.0 μm |
1.0 μm |
Minimum Achievable Voxelc |
40 nm |
40 nm |
Source Voltage Range |
30–160 kV |
30–160 kV |
Source Maximum Power Output |
25 W |
25 W |
Scout-and-Scan™ Control System |
✓ |
✓ |
Scout-and-Zoom |
✓ |
✓ |
ZEISS OptiRecon |
Optional |
Optional |
ZEISS DeepRecon |
Optional |
Optional |
SmartShield |
✓ |
✓ |
Vertical Stitch |
✓ |
✓ |
XRM Python API |
✓ |
✓ |
Automated Filter Changer (AFC) |
|
✓ |
High Aspect Ratio Tomography (HART) |
|
✓ |
Dual Scan Contrast Visualizer (DSCoVer) |
|
✓ |
Wide Field Mode |
0.4x |
0.4x and 4x |
ZEISS LabDCT Pro for Diffraction Contrast Tomography |
|
Optional |
ZEISS Autoloader |
Optional |
Optional |
In Situ Interface Kit |
Optional |
Optional |
ZEISS ZEN Intellesis |
Optional |
Optional |
ORS Dragonfly Pro |
Optional |
Optional |
ZEISS Metrology Extension (MTX) |
|
Optional |
a Spatial resolution measured with ZEISS Xradia 2D resolution target, normal field mode, optional 40x objective.
b RaaD™ working distance defined as clearance around axis of rotation
c Voxel is a geometric term that contributes to but does not determine resolution, and is provided here only for comparison.
ZEISS specifies resolution via spatial resolution, the true overall measurement of instrument resolution
Protect Your Investment
ZEISS X-ray microscopes are designed to be upgradeable and extendible with future innovations and developments to protect our customer’s investment. This ensures the microscope capabilities evolve with the advancements in leading edge technology.
From ZEISS Xradia Context microCT, to ZEISS CrystalCT, to ZEISS Xradia 510/520 Versa, and now with the addition of ZEISS Xradia 610/620 Versa, users can field-convert their systems to the latest X ray microscopes.

Software
Create Efficient Workflows by Using The Simple Control System
Easily scout a region of interest and specify scanning parameters within the Scout-and-Scan Control System. Take advantage of the easy-to-use system in your central lab where users may have a variety of experience levels.
Benefit from:
- Internal camera for sample viewing
- Recipe control (set, save, recall)
- Multiple energies
- Multiple samples with Autoloader option
- Micropositioning capability with a simple mouse click


ZEISS Mineralogic - Automated Mineralogy
Phase identification and textural analysis in 2D and 3D using ZEISS SEM, XRM, and microCT systems.

Visualization and Analysis Software
ZEISS recommends Dragonfly Pro from Object Research Systems (ORS)
An advanced analysis and visualization software solution for your 3D data acquired by a variety of technologies including X-ray, FIB-SEM, SEM and helium ion microscopy.
Available exclusively through ZEISS, ORS Dragonfly Pro offers an intuitive, complete, and customizable toolkit for visualization and analysis of large 3D grayscale data. Dragonfly Pro allows for navigation, annotation, creation of media files, including video production, of your 3D data. Perform image processing, segmentation, and object analysis to quantify your results.
Downloads
3D Imaging Systems
Your Guide to the Widest Selection of Optical Sectioning, Electron Microscopy and X-ray Microscopy Techniques.
pages: 68
file size: 5952 kB
ZEISS Xradia 610 and 620 Versa
Your 3D X-ray Microscopes for Faster Sub-Micron Imaging of Intact Samples
pages: 41
file size: 11332 kB
Flyer: ZEISS DeepRecon Pro for Electronics and Failure Analysis
Faster 3D X-ray data acquisition and superior imaging quality for electronics failure analysis
pages: 2
file size: 1063 kB
Metrology Extensionfor ZEISS Xradia Versa
Adding measurement accuracy to X-ray microscopy.
pages: 4
file size: 812 kB
ZEISS DeepRecon
Faster throughput, superior image qualityfor industry
pages: 2
file size: 1780 kB
ZEISS Mineralogic 3D
The next dimension in automated mineralogy
pages: 2
file size: 1482 kB
ZEISS Mineralogic 3D for Mining - Flyer
Your geometallurgy goals realized with maximum efficiency
pages: 2
file size: 677 kB
ZEISS ORS Dragonfly
Outstanding 3D visualization with best-in-class graphics
pages: 2
file size: 689 kB
ZEISS PhaseEvolve
Reveal contrast that has never been seen before
pages: 2
file size: 2110 kB
ZEISS Xradia Versa with FPX
Larger samples, higher throughput
pages: 2
file size: 1729 kB
Results 1 - 10 of 14