ZEISS Xradia 610 and 620 Versa

• Non-destructive sub-micron scale microscopy of intact samples
  
• Higher flux and faster scans without compromising resolution
  
• True spatial resolution of 500 nm with a minimum achievable voxel size of 40 nm
  
• High resolution across a broad range of sample types, sizes, and working distances
  
• In situ imaging for non-destructive characterization of microstructures in controlled environments and over time
  
• Upgradeable and extendible with future innovations and developments

Where traditional tomography relies on single-stage geometric magnification, Xradia Versa features a combination of unique two-stage magnification optics and a high flux X-ray source to produce faster sub-micron scale resolution images. The Resolution at a Distance (RaaD) architecture enables high resolution 3D imaging of larger, denser objects including intact components and devices. The optional flat panel extension (FPX) enables rapid scans of very large samples (up to 25 kg), allowing navigation to interior regions of interest.

Use the industry’s most comprehensive 3D X-ray imaging solution for advanced scientific and industrial research: Maximize absorption and phase contrast to achieve unprecedented characterisation of your materials and their properties. Unlock 3D crystallographic information with Diffraction Contrast Tomography. Improve scan speed and accuracy of large or irregular samples with advanced acquisition techniques. Apply machine learning algorithms to help with post-processing and segmentation of your samples.

ZEISS Xradia 600-series Versa can non-destructively characterize the 3D microstructure of materials under controlled perturbations (in situ), and observe the evolution of structures over time (4D). By leveraging Resolution at a Distance, the Xradia Versa maintains highest resolution across large working distances, accommodating both sample, environmental chamber, and high precision in-situ load rigs without sacrificing resolution. The Versa seamlessly integrates with other ZEISS microscopes to solve multi-scale correlative imaging challenges. 

Standard X-ray computed tomography (CT) is limited to small sample sizes when imaging at high resolution; due to the geometric nature of magnification. Maintaining high resolution for larger samples is impossible due to the longer working distances required. High resolution imaging in CT systems also requires low X-ray flux, reducing the throughput of the measurement. This limits the practical application of maximum resolution claimed by most CT manufacturers.

ZEISS Xradia 600-series Versa overcomes these trade-offs by integrating dual-stage magnification architecture with high flux X-ray source technology.

ZEISS specifies true spatial resolution, bringing a standard measure of microscope performance to 3D X-ray measurement. Spatial resolution refers to the minimum separation at which two features can be resolved by an imaging system. ZEISS Xradia 600-series Versa systems obtain true spatial resolution of 500 nm with a minimum achievable voxel size of 40 nm.

ZEISS Xradia 600-series Versa introduces a breakthrough high power (25 W) X-ray source technology that can provide significantly higher X-ray flux compared to its predecessors. The new source pushes the boundaries of performance with improved thermal management, increased flux and throughput while preserving resolution performance. A new source control system improves source responsiveness enabling faster scan setup leading to an easier and more engaging user experience.

What higher X-ray flux offers:

• Faster tomography scans
  
• More sample runs
  
• More regions of interest
  
• Higher contrast-to-noise ratio
  
• Stronger diffraction patterns
  
• Enabling long/multi-scan workflows
  (in situ, DSCoVer, stitching, DCT)

ZEISS Xradia Versa uses a two-stage magnification architecture to enable sub-micron resolution imaging at large working distances (Resolution at a Distance) for a diverse set of sample sizes and types. Images are initially magnified via geometric projection as with conventional microCT, the projected image is cast onto a scintillator, converting X-rays to a visible light image which is then optically magnified by microscope optics before acquisition by a CCD detector.

With more X-ray photons available, the ZEISS Xradia 600-series Versa provides faster time to results for the widest range of sample sizes and types, without compromising resolution.

LabDCT (Diffraction Contrast Tomography), available exclusively on Xradia 620 Versa, enables non-destructive mapping of orientation and microstructure in 3D. Direct visualization of 3D crystallographic grain orientation opens up a new dimension in the characterization of metal alloys and polycrystalline materials.

• Obtain comprehensive 3D microstructure analysis from large volumes down to local individual grain boundary analysis.
  
• Investigate microstructural evolution with 4D imaging experiments.
  
• Combine 3D crystallographic information with 3D microstructural features.
  
• Combine modalities to understand structure-property relationships.

Optional Flat Panel Extension (FPX) delivers large-sample, high throughput scanning with ZEISS best-in-class image quality. FPX enhances imaging flexibility and creates workflow efficiencies with an all-in-one system for industrial and academic research.

Scout-and-Zoom is a unique capability of ZEISS X-ray microscopes that leverages FPX to perform exploratory “Scout” scans across a large field of view to identify interior regions of interest for higher resolution “Zoom” scans without complex sample preparation.

ZEISS Xradia Versa provides the industry’s premier 3D imaging solution for the widest variety of in situ rigs, from high pressure flow cells to tension, compression and thermal stages.

To accommodate various types of in situ apparatus, such experiments require samples to be mounted further away from the X-ray source. With traditional microCT systems, this significantly limits the resolution achievable during such measurements. ZEISS X-ray microscopes are uniquely capable of Resolution at a Distance (RaaD) technology, which give the highest fidelity of 3D structural information during in situ imaging.

Maximize your instrument's utilization with the optional Autoloader, available for all instruments in the ZEISS Xradia Versa series. Reduce the frequency of user interaction and increase productivity by queueing multiple jobs. Load up to 14 sample stations, which can support up to 70 samples, and set to run overnight, or across multiple days. Unprecedented mechanical stability enables high volume quantitative repetitive scanning of like samples.

Wide Field Mode (WFM) can be used to image across an extended lateral field of view. The wide lateral field of view can provide 3x larger 3D volume for large samples, or give a higher voxel density for a standard field of view. All Xradia Versa systems are capable of WFM with the 0.4x objective. The Xradia 620 Versa system also features WFM with the 4x objective. In combination with Vertical Stitching, WFM enables you to image larger samples at exceptional resolution.

X-ray source attenuation filters are used to tune the X-ray energy spectrum illuminating the sample to optimise contrast, which depends on the specific material properties of the sample. Every ZEISS Xradia Versa comes standard with a set of 12 filters. ZEISS Xradia 610 Versa is equipped with a single filter slot allowing for manual filter change. ZEISS Xradia 620 Versa systems feature an Automated Filter Changer (AFC), which improves ease of use, allowing seamless change of filters for convenient investigation of unknown samples.