Interdiffusion of Ni into Si nanowires for the formation of reconfigurable Schottky junctions
labs@location Partner
Dresden Center for Nanoanalysis (DCN)
Dresden Germany

Technical University Dresden

Dresden Center for Nanoanalysis (DCN)

Dresden Center for Nanoanalysis (DCN)
Technische Universität Dresden
Barkhausenbuilding, Room 168
Helmholtzstraße 18
01069 Dresden
Germany
  • Scanning electron microscopy, including elemental analysis (EDS) and quantitative microstructure analysis (EBSD)
  • Sub-micron X-ray tomography (highest spatial resolution 700 nm)
  • Focused ion beam processing (for e.g. lift-out of samples)
Image of a circuit showing the position of the silicon nanowire

Image of a circuit showing the position of the silicon nanowire

The Dresden Center for Nanoanalysis (DCN) aims to determine and influence structure-property relationships. How does the structure of a device or material lead to its final properties? And, based on this understanding, which handles to we have on the properties to get an optimal performance?

To achieve this goal, the DCN has state-of-the-art electron and X-ray microscopes, that enable the characterization of materials from centimeters down to the nanometer scale. In addition to imaging, we can also determine the material composition, crystal structure and the 3D morphology.

An annealed thin film of indium-tin-oxide, grown on glass

An annealed thin film of indium-tin-oxide, grown on glass

The DCN is part of the Center for Advancing Electronics Dresden (cfaed), a cluster of excellence at the Technische Universität Dresden. Therefore, a main focus is characterizing materials for novel electronic devices. However, the research topics beyond this and the DCN welcomes users that need nanoanalytical facilities and expertise.
 

X-ray tomography for metrology and failure analysis on through-Si via´s

X-ray tomography for metrology and failure analysis on through-Si via´s

Know-how/Expertise:

  • Scanning electron microscopy, including elemental analysis (EDS) and quantitative microstructure analysis (EBSD)
  • Sub-micron X-ray tomography (highest spatial resolution 700 nm)
  • Focused ion beam processing (for e.g. lift-out of samples)
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