Labs at Location - Quality Analysis Dettingen
labs@location Partner
Quality Analysis Dettingen - Germany

Quality Analysis - Dettingen

Thinking ahead and daring to innovate – to give you the edge

Quality Analysis GmbH
Kirchheimer Str. 188
73265 Dettingen unter Teck
  • Technical Cleanliness Verification
  • Materialography
  • Industrial Metrology
  • Industrial Computed Tomography

With our complete range of analytic services for quality assurance we are uniquely positioned in Europe. Our national and international customers greatly cherish the benefit that arises from the interlinking of all analytic options.
All departments work together seamlessly and offer an optimal range of resources that you can use to bring about your own success. Starting from this strategic understanding of our services, we see ourselves as a partner for development and solutions and we maintain a special relationship of trust with our customers.
Continuing investments in the very newest analytic technology that we adapt to the specific job requirements are an important part of our partnership with our customers.

One milestone in our company history was the ground-breaking of our new sustainable company building in Nuertingen on June 24th, 2016. We will move into it in mid-2017. The new location will also be home to the newly founded “FORUM ZUKUNFT – Qualität im Dialog”.

  • Industrial Computed Tomography

    A Non-destructive Look Inside the Component

    Industrial computed tomography is an important component in reliable product and process development as well as process monitoring and re-qualification. Our technical equipment is constantly adapted to the high demands of our customers. By using computed tomography, the entire component can be digitally scanned. Even complex geometries can be recorded and assessed. This technology is also used where optical and tactile measurements are not possible.

    Based on a 3-D-volume model, CT provides comprehensive data on the internal and external composition of the component. This provides in turn accurate statements about porosity, defects, wall thicknesses, nominal/actual comparisons and assembly states. The high-precision voxel-data make rapid assessment possible and you will get the desired analysis results from us promptly along with the data set so that you can review the results in the analysis software.

    Completing the CT-Scans

    • Defect Analysis
      • Porosity Analysis
      • Inclusion Analysis
      • Crack Analysis
    • Wall Thickness Analysis
    • Nominal/Actual Comparison

    • Coordinate Measurement
    • Assembly Controlling
    • Surface Reconstruction
    • Fiber Composite Material Analysis
    • Reverse Engineering

  • Industrial Metrology

    Tactile and Optical Measurement of Components

    Industrial Metrology forms the basis for reliable product and process development and is an important component for process monitoring as well as first article inspections. Our technical equipment is constantly adapted to the high demands of our customer.

    We use the most modern coordinate metrology technology for precise analysis of production parts, initial samples and serial components in any size and number.
    With personnel and mechanical capacities, we are able to take on serial measurements with high numbers of pieces, conduct measurements of initial samples for the production part approval process (PPAP), draft nominal/actual comparisons, as well as surface, contour and commissioned measurements.
    A special advantage is offered by multi-sensor scanning that uses different tactile or optical sensors as needed.

    We also undertake the programming of the planned measurement path for the reliable execution of 3-D-coordinate measurements.

    • Offline-programming
    • First Article Inspection
    • Nominal/Actual Comparison
    • Commissioned Measurements
    • Serial Production Measurements
    • Statistical Process Control (SPC)
    • Form and Position Measurement
    • Gear Measurement
    • Surface and Roughness Measurement
    • Contour Measurement

  • Technical Cleanliness Verification

    Particulate and Residual Dirt Analysis

    Functionally relevant parts of components and systems are often located on the insides of pipes, channels, housings, tanks, pumps, valves or similar components. If fluids are used here, particles can be transported to sensitive locations and can lead over the long term to loss of function and even to damage to the system.
    Technical cleanliness verification can be assessed through analysis especially in the initial sampling evaluation, re-qualification, as well as the, input and output controls for monitoring the manufacturing process.

    Our accredited testing laboratory conforms to DIN EN ISO/IEC 17025, a clean room in ISO class 8, is equipped for all conventional extraction procedures for both the smallest components as well as for large assembly groups (see Technical Equipment). By using light and scanning electron microscopy as well as RAMAN- and FT-IR-spectroscopy, the particular pollution will be detected and identified in the most precise manner. We also analyze particle traps from ambient monitoring.
    The standard VDA Bd. 19/19.1 and VDA Bd. 19.2, as well as, ISO 16232 are the basis for the cleanliness tests. All customer and works norms will be adapted on request.

    Extraction Procedures:

    • Rinsing / Spraying
    • Ultrasound
    • Oil- /Fluid Analysis
    • Particle Traps for Ambient Monitoring

    Analytic Procedures:

    • Filtration
    • Gravimetry
    • Light Microscope Analysis
    • Chemical Elementary Analysis (EDX)
    • RAMAN-Spectroscopy
    • FT-IR-Spectroscopy
  • Materialography

    A Non-destructive Look Inside the Component

    As a destructive materials test, materialography is always used in industry and research when quantitative and qualitative statements on material composition are needed in which the relationships between the chemical composition, crystalline structure and technological composition can be recorded.
    The analyses are carried out primarily in the evaluation of production processes, damage prevention, cause analysis in the event of a defect and for process optimization in product development. They also aid in identifying causes in the case that a component fail.

    Our modern analytical procedures include highly precise metallographic sample preparation, crystalline structure analysis, light microscope analyses as well as layer thickness measurements and weld seam analyses, chemical elementary analyses, RAMAN- and FT-IR-spectroscopy as well as hardness testing.

    • Metallographic Sample and Microsection Preparation
    • Light microscopy
      • Layer Thickness Measurement
      • Defect Analysis: cracks, break analysis, anomalies in the component, material accumulation
      • Weld Seam Inspection
      • Soldering Point Analysis
      • Microstructure Examination

    • Scanning-Electron-Microscopy
      • Chemical Elementary Analysis (EDX-Analysis)
      • Surface-sensitive Analysis (Topography)
      • Joint-Sensitive Analysis
      • Fully Automatic Particle Analysis SmartPI
    • RAMAN-Spectroscopy
      • Organic and inorganic material analysis
    • FT-IR-Spectroscopy
    • Spark-Optical-Emission Spectroscopy (OES)
    • Hardness Testing
    • Boro- & Videoscopy