Parallel advances in FIB-SEM and 3D X-ray have radically changed microscopy sample preparation and analysis. This opens new capabilities for semiconductor research, development and failure analysis.
Follow this informative series to learn about:
- Achieving unprecedented 3D X-ray image quality at high speed using artificial intelligence
- Finding the “needle in the haystack” with correlative software and workflows
- Improving sample preparation by adding a femtosecond laser onto a FIB-SEM
- New applications, workflows and research opportunities, enabled by these new technologies, that could never be done before
This interactive graphic shows new approaches for non-destructive imaging and cross-sectional analysis, and a correlated workflow that delivers new insights from macroscale to nanoscale with fast time to results.
Two webinars deliver rich insights into the latest microscopy advances and how they work together to enable materials characterization and failure analysis for the next generation of electronic packages and devices.
- Webinar 1: Learn about "More-than-Moore" (MtM) packaging trends, how 3D X-ray microscopy enabled by artificial intelligence is used to address the challenge of MtM package analysis, and technical highlights of a new "packaging FIB" for an improved failure analysis workflow.
- Webinar 2: Discover how sample preparation and materials characterization of a broad range of sample types is revolutionized by integrating a fs-laser with a focused ion beam scanning electron microscope (FIB-SEM). Learn how this new LaserFIB capability compares with other newly emerging techniques.
The slowing of Moore’s Law continues to present challenges for integrated circuit (IC) package characterization and failure analysis (FA). Package developers and failure analysts are faced with complex System-in-Package (SiP) architectures enabled by heterogenous integration, package interconnect pitches approaching one micron, buried silicon and system-on-chip (SOC) disaggregation, leading to larger package footprints approaching 100mm x 100mm or larger. These trends drive requirements for new capabilities across the entire FA workflow. New ZEISS solutions addressing IC package analysis challenges will be presented including artificial intelligence for 3D X-ray imaging and a new “packaging FIB”, the Crossbeam laser. These technologies represent significant advancements for the package FA workflow.
A new instrument that integrates a femtosecond laser with a FIB-SEM (also known as a LaserFIB) is revolutionizing sample preparation for microelectronics, as well as other industrial and research fields. Join this 1-hour webinar to learn about LaserFIB applications and understand how it compares to sample preparation tools such as broad ion beam (BIB), standalone ps-laser and integrated PFIB laser instruments.
Ga focused ion beams are cost effective and highly versatile: powerful enough today to polish a few hundred microns area, yet precise enough for 10 nm thick lamella preparation or 3D tomography with <5 nm isotropic voxel resolution. High quality fs-laser processing requires only minor FIB polishing at low currents, where a Ga beam has 35 times greater current density than a PFIB. This makes a Ga FIB the most effective technology for the broadest range of applications.
The LaserFIB enables things that could never be done before, leading to higher productivity and new applications. Do you want 2X faster atom probe prep with higher sample quality than normal? Do you need to locate and image rare defects randomly distributed within a large volume? Do you need multiscale and multimodal analysis at timescales that enable statistical sampling for new material development? How about receiving large-area analytical results at unheard of speeds? This is just a small sampling of the new capabilities.
There is growing need for material and device characterization across length scales in microelectronics, battery research, and other industries. This includes a need to accurately perform nanoscale analysis, at site-specific regions contained within mm volumes of material, at faster rates than classical Ga and plasma FIB (PFIB) technologies allow.
The LaserFIB architecture provides laser processing under vacuum conditions tailored for best quality, enabling rapid SEM imaging and visual feedback for process set-up and optimization. Laser integration enables automation and high productivity, while conserving floor space and cost of ownership.
How can we help you? Contact us to speak directly with a ZEISS representative about the specific needs of your facility.