ZEISS 3D X-ray Microscopy

Helping You Solve Your Advanced Packaging Challenges

ZEISS X-ray microscopes have been installed at many prestigious institutions including a majority of top semiconductor manufacturers, OSATs, and electronic device manufacturers. X-ray microscopes uniquely enable them to visualize failures in advanced packages non-destructively with high resolution virtual cross sections.
 

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3D X-ray Microscopy: Non-destructive alternative to physical cross sectioning

Reconstructed 3D Dataset

Virtual Cross Section

  • Highest resolution imaging over a wide range of samples
  • No sample preparation
  • Improved quality in root cause analysis assembly development cycles
  • Analysis of intact devices

Applications for imaging intact electronic components & devices

Analysis of inact devices:
300 mm wafers, speakers, printer heads, smartphones, components on board
 

Speakers
Speakers
Optics
Optics
Printheads
Printheads
Smartphones
Smartphones

Applications in failure analysis, reliability and process development
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