ZEISS X-ray Microscopy

Helping you Solve your Advanced Packaging Challenges

 

High-Resolution Non-Destructive 3D Imaging

Review Article

 

Virtual Cross Sectioning in the Failure Analysis Workflows

Abstract

 

X-ray Microscopy and Root Cause Analysis in Electronic Packaging

Abstract

 

Related Resources

 

High resolution, non-destructive imaging of bulk samples: Intact 6 inch speaker

 

Submicron Failure Analysis of TSV

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