Overview: ZEISS CT Solutions

A 3D One-Stop Show for Greater Efficiency and Transparency Along the Entire Industrial Process

Smart manufacturing is enabling shorter technology life-cycles and accelerated development times. Additionally, components have increasingly elaborate surface shapes and more demanding architectures that present all new challenges for design, development, and production.

From Lab to Production: A Key to Controlling Industrial Processes

Industrial 3D X-ray for computed tomography from ZEISS gives you the tools to gain entirely new insight into these complex structures for a wide range of materials...in record time.

ZEISS is an innovator of CT technology enabling volume-based analysis, measurement, and inspection for the complete product life-cycle — with strong industrial experience in markets ranging from aluminium castings for automotive to plastic parts for consumer goods.

Learn more about the potential and advantages of ZEISS CT solutions for smart manufacturing


ZEISS CT Solutions

For R&D, Product & Process Development, Assembly and Volume Production

ZEISS 3D X-ray for computed tomography supports the effort of achieving the Industry 4.0 goal of richer data for more effective decision making by delivering maximum information in the shortest amount of time, from R&D to process development to manufacturing.

Read on to understand solutions relevant to your process below:


General research in R&D labs
General research in R&D labs

High-resolution Non-destructive Imaging of Internal Structures for R&D Labs

Do you need resolution in the sub-micron range for your R&D efforts such as materials characterization and microstructural evolution? X-ray microscopy is a non-destructive sub-micron resolution technique that provides 3D volume information on samples across a wide range of length scales - from polymers to metals.

View infographic on ZEISS X-ray Microscopy applications

Product and process <br>development
Product and process

Traceable 3D X-ray Measurements in Product and Process Development

Do you want to measure and evaluate entire components by standard-compliant and traceable precision testing as per VDI/VDE 2630? Is reverse engineering and mold correction important for your business? You will be amazed by the capabilities of ZEISS METROTOM. Within minutes you can successfully perform measuring and inspection jobs with only one X-ray scan including linear guideways and a rotary table which meet customer's highest demands for precision.

View infographic on ZEISS METROTOM applications

Volume production and <br>quality control
Volume production and
quality control

CT Inspection with High Throughput in Assembly and Volume Production

Do you need a customized product design for CT inspection directly in or near production? Are you searching for minimal cycle times with 3D scanning in seconds? ZEISS VoluMax CT machines are designed for applications where many components must be inspected quickly. ZEISS customizes the machine and software to fit the inspection job.

View infographic on ZEISS VoluMax applications


Application Examples

ZEISS 3D X-ray Microscopy for R&D Lab

Are you looking for a better way to visualize defects and failures in your samples non-destructively?

A non-destructive alternative/compliment to physical cross sectioning, 3D X-ray microscopy (XRM) is bridging the inspection gap between high-resolution, destructive SEM and low-resolution, non-destructive 2D X-ray and microCT capabilities. Users are able to generate 3D images of internal structures, such as suspected failure locations, or other user-specified locations, without sacrificing the sample.

ZEISS XRM offers advanced imaging solutions that have removed major hurdles for three-dimensional imaging by achieving high contrast and submicron resolution imaging even for your relatively large samples.

The world's leading companies are using ZEISS CT solutions for the following applications and more: ZEISS 3D X-ray for computed tomography supports the effort of achieving the Industry 4.0 goal of richer data for more effective decision making by delivering maximum information in the shortest amount of time, from R&D to process development to manufacturing.

Read on to understand solutions relevant to your process below:


Electronic Package Failure Analysis

Are you tasked with failure analysis of products based on advanced packaging technologies?

XRM enables you to image failures localized in complex 3D-IC structures without physical destruction of the imaged sample. 

  • Visualize voids, solder shape, cracks, contamination in metal interconnects
  • View as many cross sections as you like, from any angle
  • Reveal the exact cause of the failure
  • Obtain valuable information regarding the optimal orientation for further physical cross sectioning for detailed chemical analysis

View infographic on ZEISS X-ray Microscopy applications

Composite sample imaged at<br> 0.8 micron voxel. 
<i>Courtesy <br>of University of British <br>Columbia</i>
Composite sample imaged at
0.8 micron voxel. Courtesy
of University of British

Composites - Orientation of Pores and Fibers

The internal structure of fiber-reinforced composite material greatly affects strength and function of the constructed materials. X-ray microscopy (XRM) can provide quantitative, 3D structural analysis of relatively large samples for understanding reliability and failure mechanisms. In addition, the non-destructive nature of X-rays provides the opportunity to image the sample before and after the application of tension or shear to observe microstructural changes.

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Direct visualization of a beta-Ti alloy with overlaid 3D crystallographic information reconstructed from diffraction patterns showing reflections of over 500 grains simultaneously.

Metals - Grain Analysis

LabDCT is an advanced imaging module (hardware + software) for ZEISS Xradia X-ray microscope that provides direct visualization of 3D crystallographic grain orientation in a non-destructive tomography environment. Primary applications of LabDCT for materials science characterization:

  • Metals and alloys (automotive, aerospace, nuclear, biomedical, electrochemical, and additive manufacturing applications)
  • Grain growth & recrystallization
  • Abrasives,energetic materials, semiconductor
  • Non-destructive correlation to 2D/3D EBSD or optical methods
  • Input for computational models

Complex metal component manufactured by 3D printing and imaged using ZEISS Xradia Versa. Sample courtesy of Aalen University.

Additive Manufacturing - Microstructure Investigations

3D XRM with the Versa family provide sub-micron resolution for defect investigation in plastic and metal printed parts. Unlike microCT, with the Versa unique detector design you can select your magnification and field-of-view to optimize resolution - just like in a microscope! This also allows users to choose an interior sample region for interior tomography while keeping samples intact and without the need to manipulate it. A capability which is not possible in traditional microCT. 


Application Examples

ZEISS METROTOM for Product & Process Development

Correction of injection molding tool by ZEISS Reverse Engineering:

Due to the difficulty in predicting the quality of an injection mold process, tools must often be reworked multiple times until the molded parts meet the quality requirements. With ZEISS Reverse Engineering software, the CAD model of the injection molding tool can be corrected using the nominal data of a plastic component and the actual-data generated using the ZEISS METROTOM.

Read the full application story here


Application Example

ZEISS VoluMax for Assembly and Volume Production

High throughput in-line inspection of connector housing in volume production:

The connector housing to be inspected is combined with other components to form a plug over the course of the production process. This plug is ultimately integrated into machines and systems. Defects in the connector housing which are only identified in later process steps can lead to high additional costs. Thus quality defects in the plastic casting should be identified as quickly as possible and with 100% reliability.

Read the full application story here