Microscopy Events

ZEISS at the International Symposium for Testing and Failure Analysis (ISTFA)

November 5-9, 2017 - Pasadena, CA, USA, booth #725

ZEISS offers unique, advanced 3D imaging solutions for both front-end and back-end processes. Please visit our booth to speak with our team about our light, electron/ion and X-ray microscopy solutions for your semiconductor and electronics applications.


Don’t miss Dr. Christian Schmidt’s presentation “Use of 3D X-ray Microscopy for BEOL and Advanced Packaging Analysis” in the Packaging and Assembly Level FA session on Monday, November 6.

ZEISS 3D X-ray microscopes (XRM) provide high resolution, non-destructive cross-section imaging solutions for failure analysis.

3D Non-destructive Failure Analysis

Highest resolution 3D for flexible virtual cross-sectioning that compliments PFA

ZEISS Crossbeam FIB-SEM offers outstanding resolution for 3D tomography and a wide variety of analytical techniques useful for the semiconductor lab.  

3D Nano Structure Analysis

3D tomography of NAND device for structural and compositional analysis

ZEISS smart digital microscopes are ideal for failure analysis, quality control and quality assurance applications in virtually every field of industry.

Flexible 3D Topography Imaging

LSM 800 confocal reflected light image of solder bump array
(20 x 16 mm)