Microscopy Events

ZEISS at SEMICON West 2017

July 11 – 13, 2017 - San Francisco, CA, USA, booth #5214

ZEISS offers unique, advanced 3D imaging solutions for both front-end and back-end processes. Please visit our booth to speak with our team about our light, electron/ion and X-ray microscopy solutions for your semiconductor applications.

ZEISS Crossbeam FIB-SEM offers outstanding resolution for 3D tomography and a wide variety of analytical techniques useful for the semiconductor lab. 

ZEISS 3D X-ray microscopes (XRM) provide high resolution, non-destructive cross-section imaging solutions for failure analysis.  

ZEISS smart digital microscopes are ideal for failure analysis, quality control and quality assurance applications in virtually every field of industry.

3D Nano Structure Analysis
3D Non-destructive Failure Analysis
Flexible 3D Topography Imaging

3D tomography of NAND device for structural and compositional analysis

Highest resolution 3D for flexible virtual cross-sectioning that compliments PFA

LSM 800 confocal reflected light image of solder bump array
(20 x 16 mm)

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