Microscopy Events

ZEISS at SEMICON West 2018

July 10 - 12, 2018 - Moscone Center, San Francisco, CA, Booth #1217

ZEISS offers advanced 3D imaging solutions for both front-end and back-end processes. Please visit our booth #1217 at SEMICON West to speak with our team about our unique X-ray, electron/ion and light microscopy solutions for advanced packaging failure analysis and process development.

ZEISS in Smart Manufacturing Session

3D X-ray Microscopy for High-Resolution Metrology Aids Semiconductor Packaging Development and Assembly

Join us on Thursday, July 12, 2018 at 2:30 PM at the Meet the Experts Thearter and attend our presentation, 3D X-ray Microscopy for High-resolution Metrology Aids Semiconductor Packaging Development and Assembly. We will present XRM measurements and a workflow developed for a variety of samples, including memory devices as well as the CMOS imaging sensor (CIS) package and lens optics assembly from a smartphone camera.

Click here to view the abstract.
Click here to register for the sessions.

Learn about our Microscopy Solutions for Semiconductors

ZEISS FIB-SEM Systems

Benefit from outstanding resolution for 3D tomography and a wide variety of techniques useful for the semiconductor lab with ZEISS Crossbeam.

Learn more

ZEISS 3D X-ray Microscopes

Achieve high resolution, non-destructive cross-section imaging solutions for failure analysis using ZEISS 3D X-ray microscopes.

Learn more

ZEISS Smartzoom 5

ZEISS Smartzoom 5 is ideal for failure analysis, quality control, and quality assurance in virtually every field of industry.

Learn more

We use cookies on this site. Cookies are small text files that are stored on your computer by websites. Cookies are widely used and help to optimize the pages that you view. By using this site, you agree to their use. more