Microscopy Events

ZEISS at SEMICON West 2018

July 10 - 12, 2018 - Moscone Center, San Francisco, CA, Booth #1217

ZEISS offers advanced 3D imaging solutions for both front-end and back-end processes. Please visit our booth #1217 at SEMICON West to speak with our team about our unique X-ray, electron/ion and light microscopy solutions for advanced packaging failure analysis and process development.

ZEISS in Smart Manufacturing Session

3D X-ray Microscopy for High-Resolution Metrology Aids Semiconductor Packaging Development and Assembly

Join us on Thursday, July 12, 2018 at 2:30 PM at the Meet the Experts Thearter and attend our presentation, 3D X-ray Microscopy for High-resolution Metrology Aids Semiconductor Packaging Development and Assembly. We will present XRM measurements and a workflow developed for a variety of samples, including memory devices as well as the CMOS imaging sensor (CIS) package and lens optics assembly from a smartphone camera.

Click here to view the abstract.
Click here to register for the sessions.

Learn about our Microscopy Solutions for Semiconductors

ZEISS FIB-SEM Systems

Benefit from outstanding resolution for 3D tomography and a wide variety of techniques useful for the semiconductor lab with ZEISS Crossbeam.

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ZEISS 3D X-ray Microscopes

Achieve high resolution, non-destructive cross-section imaging solutions for failure analysis using ZEISS 3D X-ray microscopes.

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ZEISS Smartzoom 5

ZEISS Smartzoom 5 is ideal for failure analysis, quality control, and quality assurance in virtually every field of industry.

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