Accelerating 3D Characterization: ZEISS X-ray Microscopy’s Advanced Reconstruction Toolbox

Ravikumar Sanapala

Carl Zeiss X-ray Microscopy

Ravi Sanapala is the Sr. Product Manager at ZEISS X-ray Microscopy. He has more than 10 years of experience in the capital equipment industry working in various applications and product marketing/management roles. Before joining Carl Zeiss, he worked at KLA in the semiconductor industry and led the launch of several successful wafer inspection products. Ravi received an MBA from the Haas School of Business, University of California, Berkeley, and an MS degree from the University of Maryland, College Park. He lives in the San Francisco Bay Area.


The Advanced Reconstruction Toolbox is the platform on which ZEISS delivers cutting-edge reconstruction technologies. It enables you to continuously access advanced capabilities to enrich your research and increase the return on investment from your ZEISS Xradia 3D X-ray microscopes (XRM). The first version of the Advanced Reconstruction Toolbox offers two new reconstruction technologies: OptiRecon and DeepRecon.

OptiRecon is a fast and efficient algorithm-based technology that delivers iterative reconstruction from your desktop, allowing you to achieve up to 4X faster scan times or enhanced image quality at similar throughput. OptiRecon offers superior interior tomography and throughput for a broad class of samples.

DeepRecon is the first commercially available deep learning reconstruction technology. It enables you to increase throughput by an order of magnitude (up to 10X) without sacrificing novel XRM Resolution at a Distance (RaaD) for repetitive workflow applications. DeepRecon uniquely harvests the hidden opportunities in big data generated by your XRM and provides significant AI-driven speed and image quality improvement.

These optional modules are workstation-based solutions that provide easy access and usability.

Watch on Demand