Due to the increasing complexity of emerging 3D packages, the packaging industry faces challenges for finding effective inspection and metrology techniques. 3D X-ray metrology offers a potential solution through a non-destructive workflow at submicron resolution. The 3D X-ray microscopic (XRM) imaging technique has become integrated in the electronics package failure analysis workflow because it enables the acquisition of rich volumetric information on buried defects not available by cross section. We present XRM sample measurements and a workflow that is applied for multiple repetitive parts for high repeatability and reproducibility. Other 3D metrics may be developed with this metrology workflow.