ZEISS at ISTFA 2021
Phoenix, Arizona, USA | October 31 – November 4, 2021 | Booth 601
Visit us at ISTFA to learn about the latest failure analysis solutions for semiconductor devices and advanced packaging.
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Accelerate Failure Analysis for Next-generation Electronic Devices
New materials and semiconductor technologies are advancing the performance of next-generation electronics. Fast failure analysis becomes more important than ever for all stages of the product life cycle – from R&D to yield improvement to field returns.
Don’t miss our award-winning SEM nanoprobing results (IPFA 2021 Best Paper for Failure Analysis.)
Learn about our breakthrough Crossbeam laser “packaging FIB” for rapid nanoscale imaging of deeply buried features. See how Xradia 3D X-ray microscopes powered by artificial intelligence deliver faster scan times with images that look better than ever. Discover how our new GeminiSEM FE-SEM enables ultra-low voltage surface imaging and large field of view nanoprobing for your most demanding imaging and analytical tasks.
Attend the Opening Session where ZEISS presents the Award-winning Best Failure Analysis paper from IPFA 2021, Low Voltage EBIC Investigation of Fails.
ZEISS Papers in the Technical Program
Date |
Topic |
Sunday, October 31 |
Tutorial - FA Technique Selection for Front-end Defect Localization in Bulk Semiconductor (Si) FA |
Sunday, October 31 |
Tutorial - Basics and Current Aspects of Scanning Electron Microscopy |
Wednesday, November 3 |
Poster Session |
Wednesday, November 3 |
FIB User Group |
Thursday, November 4 |
EBIRCH Localization for Low-current Soft Fails |