Phoenix, Arizona, USA | October 31 – November 4, 2021 | Booth 601

Visit us at ISTFA to learn about the latest failure analysis solutions for semiconductor devices and advanced packaging.

Accelerate Failure Analysis for Next-generation Electronic Devices

New materials and semiconductor technologies are advancing the performance of next-generation electronics. Fast failure analysis becomes more important than ever for all stages of the product life cycle – from R&D to yield improvement to field returns.

Don’t miss our award-winning SEM nanoprobing results (IPFA 2021 Best Paper for Failure Analysis.)
Learn about our breakthrough Crossbeam laser “packaging FIB” for rapid nanoscale imaging of deeply buried features. See how Xradia 3D X-ray microscopes powered by artificial intelligence deliver faster scan times with images that look better than ever. Discover how our new GeminiSEM FE-SEM enables ultra-low voltage surface imaging and large field of view nanoprobing for your most demanding imaging and analytical tasks.

Attend the Opening Session where ZEISS presents the Award-winning Best Failure Analysis paper from IPFA 2021, Low Voltage EBIC Investigation of Fails.

ZEISS Papers in the Technical Program



Sunday, October 31
12:30 pm

Tutorial - FA Technique Selection for Front-end Defect Localization in Bulk Semiconductor (Si) FA
Mr. Gregory Johnson, ZEISS

Sunday, October 31
2:20 pm

Tutorial - Basics and Current Aspects of Scanning Electron Microscopy
Dr. Heiko Stegman, ZEISS

Wednesday, November 3
1:05-3:05 pm

Poster Session
AI Applications for FA: Accelerate Your 3D X-ray Failure Analysis by Deep Learning High Resolution Reconstruction
Dr. Allen Gu, ZEISS

Wednesday, November 3
3:05-5:20 pm

FIB User Group
Achieving Faster & More Accurate FIB Sample Prep
Ms. Cheryl Hartfield, ZEISS

Thursday, November 4
11:05 am

EBIRCH Localization for Low-current Soft Fails
Mr. Gregory Johnson, ZEISS
Andreas Rummel, Kleindiek

ZEISS Crossbeam laser

Laser-integrated FIB-SEM for rapid time-to-results in package FA

ZEISS Xradia Versa X-ray Microscope

High-resolution and non-destructive 3D imaging for visualizing internal structures of intact samples


Versatile analytics and high-resolution imaging for past, present, and future nodes

Connect with Product Experts in Live Demonstrations