Discover ZEISS at MRS Fall

In-Person Experience | November 29 - December 2, 2021
Virtual Experience | December 6 - 8, 2021

One thing that remains consistent this year is finding ways to continue research in our ever-changing working environments.

ZEISS will be attending MRS Fall 2021 in Boston, Massachusetts, booth number 301. 

ZEISS is your partner to help you find your next breakthrough and is delivering new innovations to support you. Spend some time in our booth and learn about what’s new and sign up for a live remote demo with our product experts.

Tour our virtual booth

MRS Fall 2021 - Materials ResearchSnap Content

Attending in person?

Come to booth 301 to explore our interactive touch screen display, featuring multiple researchers and their breakthroughs in materials microscopy.

Featured Presentations

The Impact of Advanced SEM on Materials Characterization

Dr. Sato Kaoru
JFE Techno-Research Corporation, Japan

Unlike TEM/STEM, the finest probe condition that is normally achieved at the highest accelerating voltage does not always give the best resolution in the SEM where bulk specimens are normally used. SEM today has excellent performances at low voltages and implementation of multiple imaging detectors is enabling efficient acquisition of high quality SE and BSE images. By optimizing the acceptance of signal electrons, material and topographic contrast can be obtained separately with different SE detectors. Optimization of collection angle will allow preferential extraction of either atomic number or channelling contrast in the BSE imaging. Furthermore, a latest windowless SDD, whose WD is optimized to that for the imaging sweet spot, enables EDX analyses below 10 nm for a bulk specimen.

Key Learnings:

  • The need to adjust working distance and voltage depending on the material
  • Several examples of the data obtainable from the "sweet spot" of WD and voltage
  • Realization of x-ray analysis at the imaging "sweet spot"

Application of Ultra-short Pulsed (USP) Lasers For Improved Microscopy Sample Preparation

Cheryl Hartfield
Product Marketing Manager for Materials Research & Electronics
ZEISS Microscopy

The emergence of ultra-short pulsed lasers for sample preparation opens new workflow strategies as well as challenges in knowing which approach to use. This talk will give an overview of different sample preparation strategies for high-resolution imaging and analysis, with application examples showcasing new capabilities enabled by a FIB-SEM with integrated fs-laser.

Key Learnings:
  • Introduction to cross-section techniques
  • Review of mechanical methods, BIB, FIB-SEM, ex situ USP lasers, integrated laser FIB-SEM
  • LaserFIB applications and technique comparisons

Presented by

From Micro to Nanoplastics

Prof. Dr. Silke Christiansen, Head of department: Correlative Microscopy and Materials Data, Fraunhofer Institute for Ceramic Technologies and Systems IKTS

In this webcast, the speaker will specify the challenges of scale-bridging analytics, in particular when identifying individual, identical M/NPs, and the various analytical techniques required to truly correlate physical and chemical properties at particle levels. The speaker will moreover demonstrate the strengths of scale-bridging analytics and will introduce correlative Raman-SEM technology as an enabler of this multi-modal analytics correlation at a single particle level.

Featured Products

Imaging Below 1kV. Expert Knowledge Integrated.


Your FIB-SEM for High Throughput 3D Analysis and Sample Preparation

ZEISS Crossbeam Family

Synchrotron-quality Nanoscale 3D X-ray Imaging

ZEISS Xradia 810 Ultra

Your Automated Digital Microscope for Routine and Failure Analysis

ZEISS Smartzoom 5

Software workbenches and tools to tap into advanced image recognition, automation, large area imaging, and correlative microscopy solutions

ZEISS ZEN Ecosystem