3D X-ray Microscopy

For High Resolution Measurements in Semiconductor Package Development

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Iwona Jóźwik, Ph.D., Łukasiewicz Institute of Electronic Materials Technology
Juan Atkinson Mora, PhD Applications Technologist
ZEISS Semiconductor Manufacturing Technology

Due to the increasing complexity of emerging 3D packages, the packaging industry faces challenges for finding effective inspection and metrology techniques. 3D X-ray metrology offers a potential solution through a non-destructive workflow at submicron resolution. The 3D X-ray microscopic (XRM) imaging technique has become integrated in the electronics package failure analysis workflow because it enables the acquisition of rich volumetric information on buried defects not available by cross section. We present XRM sample measurements and a workflow that is applied for multiple repetitive parts for high repeatability and reproducibility. Other 3D metrics may be developed with this metrology workflow.


Key Learnings:

  • Application of 3D X-ray microscopy to semiconductor materials and consumables characterization
  • Use of 3D X-ray microscopy in semiconductor process development
  • Improvement of semiconductor quality assurance and reliability with 3D X-ray microscopy

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