The LaserFIB combines an ultra-short pulsed laser, typically a femtosecond (fs) laser, and a FIB-SEM, all in one microscope. Massive material ablation by the laser allows to gain rapid access to structures buried deeply in e.g. packaged electronics or display devices. The targeted regions of interest can then be analyzed by FIB-SEM. Remarkably, sample damage or heat effects induced by the laser are minimal. Thus, the LaserFIB is attracting attention also in the field of materials engineering and characterization, e.g. for the fabrication of micromechanical testing devices with dimensions of up to millimeters or large cross sections for EBSD.
As a leading supplier of electron and ion optical systems ZEISS offers a state of the art Secondary Ion Mass Spectroscopy (SIMS) technology for compositional and Isotopic analysis. The webinar will give an overview of the high-end SIMS technology and its potential application space.
- Learn about two of the latest additions to ZEISS FIB-SEM portfolio: ZEISS Crossbeam laser and the ToF-SIMS add-on
- Learn how ZEISS Crossbeam laser is a unique solution for large-scale sample preparation and sub-sequent analysis in the FIB-SEM
- Gain an overview about the high-resolution SIMS technology from ZEISS and potential applications
Crossbeam Laser FIB-SEM is a site-specific cross-section solution enabling faster package failure analysis and process optimization.
Combined in the Crossbeam laser FIB-SEM is a fs-laser for speed, Ga+ beam for accuracy, and SEM for high-resolution imaging to enable the fastest workflows. The isolated laser chamber prevents contamination of the electron column and detectors from ablated materials, while ensuring sample integrity with easy transfer between the SEM and laser chamber under vacuum.