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Your FIB-SEMs for Nanotomography and Nanofabrication
Your FIB-SEM for High Throughput
3D Analysis and Sample Preparation
Highlights
TEM Lamella Workflow
Technology
Crossbeam Family
Applications
Accessories
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Get in touch with us
Crossbeam
Get in touch with us
Highlights
TEM Lamella Workflow
Technology
Crossbeam Family
Applications
Accessories
Downloads

ZEISS Crossbeam Family

Discovering and Designing Advanced Materials With Ease

Combine imaging and analytical performance of a high resolution field emission scanning electron microscope (FE-SEM) with the processing ability of a next-generation focused ion beam (FIB). You may be working in a multi-user facility, as an academic or in an industrial lab. Take advantage of ZEISS Crossbeam’s modular platform concept and upgrade your system with growing needs. During milling, imaging or when performing 3D analytics Crossbeam will speed up your FIB applications.

Learn in this video how the TEM lamella preparation workflow of ZEISS Crossbeam enables Benedikt Müller, University of Tuebingen, and Claus Burkhardt, NMI Reutlingen, to investigate the crystal structure of NanoSQUIDS.

  • Extract true sample information from your high resolution SEM images using Gemini electron optics
  • The Ion-sculptor FIB column introduces a new way of FIB-processing: by minimizing sample damage you’ll maximize sample quality and perform experiments faster at the same time
  • When preparing TEM samples use the low voltage capabilities of the Ion-sculptor FIB: get ultra-thin samples while keeping amorphization damage at a minimum
  • Within the ZEISS Crossbeam Family, either exploit the variable pressure capabilities of Crossbeam 350
  • Or use Crossbeam 550 for your most demanding characterizations. Enjoy even more options with the large chamber.

Advantages in FIB-SEM

ZEISS Crossbeam with Gemini Optics

Maximize Your SEM Insights

Take advantage of achieving up to 30% better SEM resolution at low voltage.

  • Count on the SEM performance of your ZEISS Crossbeam for 2D surface sensitive images or when performing 3D tomography
  • Benefit from high resolution, contrast and signal-to-noise ratios, even when using very low accelerating voltages
  • Characterize your sample comprehensively with a range of detectors. Get pure materials contrast with the unique Inlens EsB detector
  • Investigate non-conductive specimens undisturbed by charging artifacts
SEM Performance
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Focused Ion Beam Column of ZEISS Crossbeam

Increase Your FIB Sample Throughput

Profit from up to 40% faster material removal by the introduction of intelligent FIB milling strategies.

  • Use the gallium FIB column Ion-sculptor for a new way of FIB-processing
  • Get high quality samples, minimize FIB-induced damage and perform experiments faster at the same time
  • Manipulate your samples precisely and fast by using up to 100 nA current without compromising FIB resolution
  • Profit from speed and precision of intelligent FIB scanning strategies for material removal and perform your experiments up to 40% faster than before
Ion-sculptor FIB
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EDS Analytics in 3D with ZEISS Crossbeam

Experience Best 3D Resolution in Your FIB-SEM Analysis

Enjoy the benefits of integrated 3D analysis for EDS and EBSD investigations.

  • Expand the capacity of your Crossbeam with ZEISS Atlas 5, the market-leading package for fast, precise tomography
  • Perform EDS and EBSD analysis during tomography runs with the integrated 3D Analytics module of ZEISS Atlas 5
  • Profit from best 3D resolution and leading isotropic voxel size in FIB-SEM tomography. Probe less than 3 nm in depth and produce surface sensitive, material contrast images using the Inlens EsB detector
  • Save time by collecting your serial section images while milling. Take advantage of trackable voxel sizes and automated routines for active control of image quality
Expand Your Crossbeam
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Array of TEM lamella fabricated with automated preparation. Crossbeam 550.

The Workflow for TEM Lamella Preparation

Just do it with high quality at high throughput

Crossbeam offers a complete solution for preparing ultra-thin, high quality TEM samples at high throughput, ready for analysis in transmission imaging mode, in TEM or STEM.

Optional add-on
Optional add-on
Optional add-on:
A navigation camera is mounted on the airlock, here on ZEISS Crossbeam 550 L, but it could also be mounted on an airlock of a ZEISS GeminiSEM or the chamber of a ZEISS EVO.

1. Automated navigation to the specimen’s region of interest (ROI)

  • Begin the workflow without time-consuming search for the ROI
  • Use the navigation camera on the airlock to locate specimens
  • The integrated user interface makes it easy to navigate to your ROI
  • Benefit from the large, distortion-free field of view in the SEM
Lamella of a copper sample ready for lift out
Lamella of a copper sample ready for lift out
Lamella of a copper sample ready for lift out
Fabricated with automatic sample preparation, prepared and imaged by FIB. Field of view 76.22 µm.

2. Automated Sample Preparation (ASP) to prepare a lamella out of the bulk

  • Start the preparation with a simple three-step process: ASP
  • Define the recipe including drift correction, deposition and coarse and fine milling
  • The ion optics of the FIB column enables high throughput for the workflow
  • Duplicate the recipe and repeat as often as required in order to start a batch preparation
Part of the TEM lamella preparation workflow in a ZEISS Crossbeam
Part of the TEM lamella preparation workflow in a ZEISS Crossbeam
Part of the TEM lamella preparation workflow in a ZEISS Crossbeam
the needle of the micromanipulator with the TEM lamella attached is lifted out from the bulk.

3. Lift out

  • Bring in the micromanipulator and attach the lamella to its tip
  • Cut out the lamella from the bulk
  • The lamella is then ready for lift out and can be transferred to a TEM grid
TEM lamella of a silicon sample after final thinning
TEM lamella of a silicon sample after final thinning
TEM lamella of a silicon sample after final thinning
This split image lets the user control thickness and surface quality simultaneously. The thinned area appears bright in the SE image.

4. Thinning: the final step is crucial, as it defines the quality of your TEM lamella

  • The instrument’s design allows you to reach a desired thickness of the lamella by enabling live monitoring of the thinning
  • Use two detector signals in parallel to judge lamella thickness and obtain reproducible end thickness on the one hand (with the SE detector) and to control surface quality on the other hand (with the Inlens SE detector)
  • Prepare high quality samples with negligible amorphization
360° view of Crossbeam 550
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The Technology Behind ZEISS Crossbeam

SEM Electron Optics

Choose between Two Columns

The FE-SEM column of ZEISS Crossbeams is based on Gemini electron optics as all ZEISS FE-SEMs. Decide on the Gemini VP column of Crossbeam 350 or the Gemini II column of Crossbeam 550.

Electron Optics
 

Gemini - Novel Optics

Profit from Surface Sensitive Imaging

High resolution imaging at low landing energy is required for beam sensitive, non-conductive samples. A two-step deceleration modus, the Tandem decel, is now introduced to ZEISS Crossbeam 550.

Novelties in Gemini Technology
 

FIB-SEM Technology

Discover a new way of FIB processing

The Ion-sculptor FIB column speeds up your FIB work without compromising machining precision and lets you benefit of its low voltage performance for any sample.

FIB-SEM Technology

ZEISS Crossbeam Family

ZEISS Crossbeam 350 standard chamber

ZEISS Crossbeam 350: standard chamber

ZEISS Crossbeam 350 standard chamber
ZEISS Crossbeam 350 standard chamber

ZEISS Crossbeam 550: large chamber

ZEISS Crossbeam 550: large chamber

ZEISS Crossbeam 550: large chamber
ZEISS Crossbeam 550 with large chamber

Within ZEISS Crossbeam Family you have the choice between Crossbeam 350 or Crossbeam 550. Exploit the variable pressure capabilities of Crossbeam 350 (optional). Or use Crossbeam 550 for your most demanding characterizations and choose the chamber size, standard or large, that best suits your samples.  

  ZEISS Crossbeam 350 ZEISS Crossbeam 550
SEM Gemini I optics
VP option
               - 		 Gemini II optics
               -
Tandem decel option 
 
Chamber Size and Ports standard with 18 configurable ports standard with 18 configurable ports or large with 22 configurable ports
Stage 100 mm travel range in x/y standard with 100 mm or large 153 mm travel range in x/y
Charge Control Flood Gun
Local Charge Compensation
Variable Pressure
 Flood Gun
Local Charge Compensation
                  -
Exemplified Options Inlens SE and Inlens EsB* for simultaneous imaging SE/EsB* imaging
VPSE detector
 		 Inlens SE and Inlens EsB* for simultaneous imaging SE/EsB* imaging
large airlock for 8 inch wafers
configure three pneumatically driven accessories simultaneously on the large chamber, e.g. STEM, 4-Quadrant-Backscatter detetor, and local charge compensation
Advantages Maximum sample variety due to optional variable pressure mode, wide range of in situ experiments, sequential Inlens SE / EsB* imaging possible. High throughput in analytics and imaging, high resolution under all conditions, simultaneous Inlens SE and Inlens EsB* imaging.
    * SE secondary electron, EsB energy selective backscatter

Application Examples

  • Images
    Alumina spheres imaged with Tandem decel on Crossbeam 550

    Alumina spheres imaged with
    Tandem decel on Crossbeam 550

    Comparison of milling strategies on Crossbeam 550

    Comparison of milling strategies on Crossbeam 550

    TEM lamella in Ag-Ni-Cu multi-layer system

    TEM lamella in Ag-Ni-Cu multi-layer system

    Batch of 35 TEM lamellae

    Batch of 35 TEM lamellae

    STEM image and EDS elemental map of Cr depletion in steel

    STEM image and EDS elemental map
    of Cr depletion in steel

    Silicon in <110> orientation, STEM image of a FIB lamella.

    Silicon in <110> orientation, STEM image of a FIB lamella.

    Nanopatterning:
    Nanofluidics channels fabricated by FIB in a silicon master stamp (left).
    Detail: meander- shaped channel (center). Inlets and outlets have a funnel shape (right).
    Courtesy of: I. Fernández-Cuesta, INF Hamburg, Germany.  

    inlens_meander-channels-total_crossbeam-550

    Nanofluidic channels, master stamp

    Nanofluidic channels, meander-shaped channels

    Nanofluidic channels, meander-shaped channels

    Nanofluidic channels, funnel-shaped inlets and outlets

    Nanofluidic channels, funnel-shaped inlets and outlets

  • Videos
    Live imaging of FIB milling a spiral

    Live imaging of FIB-milling a spiral in silicon
    Imaged with the SEM using an Inlens detector.

    3D tomogram of a solid oxide fuel cell

    3D tomogram of a solid oxide fuel cell
    The SOFC’s anode is made of a heat resistant composite material: Nickel Samaria-doped Ceria.

    Investigation of a lead free solder containing Cu and Ag particles in an Sn matrix
    Video on 3D tomography of a lead free solder with ZEISS Crossbeam

    Tomography data of SEM images were acquired at 1.8 kV
    Courtesy of: M. Cantoni, EPFL Lausanne, Switzerland.

    Video on EDS Analytics in 3D with ZEISS Crossbeam

    Elemental mapping: EDS maps were acquired at 6 kV, using Atlas 5 Analytics.Courtesy of:  M. Cantoni, EPFL Lausanne, Switzerland.

    FIB-Tomography in Life Sciences
    Cell Biology – Algae

    Cell Biology – Algae
    3D reconstruction of a vitrified Emiliania huxleyi coccolithophore obtained from a cryo-FIB-SEM image series. The 3D reconstruction shows the immature coccolith (in yellowish), a coccolith in statu nascendi (blue) and lipid bodies (red).
    Courtesy: L. Bertinetti, Max-Planck Institute of Colloids and Interfaces, Potsdam, DE and A. Scheffel, Max-Planck Institute Plant Physiology, Potsdam, DE.

    Neuroscience – Brain Sections

    Neuroscience – Brain Sections
    Large area milling and imaging of a brain section with the 3D module of ZEISS Atlas 5. High current allows fast milling and imaging of large fields of view up to 150 μm in width. The depicted brain image has a field of view of 75 μm in width and the sample was milled with a beam current of 20 nA.
    Courtesy: C. Genoud, FMI Basel, CH.

Accessories

FIB-SEM-Microscop

ZEISS Atlas 5 – Master Your Multi-scale Challenge

Atlas 5 makes your life easier: create comprehensive multi-scale, multi-modal images with a sample-centric correlative environment. Atlas 5 is the powerful yet intuitive hardware and software package that extends the capacity of your focused ion beam SEM.

Correlate X-ray microscopy and FIB-SEM: use the X-ray data to localize sub-surface features in 3D to target FIB sites that are not visible on the sample surface.

Profit from two modules dedicated specifically to FIB-SEM applications: Automatically create 3D data stacks with the 3D Tomography module. Solve even complex tasks in nanopatterning and –prototyping with the module for advanced nanopatterning and visualization engine (NPVE Advanced).


read more

Visualization and Analysis Software

Visualization and Analysis Software

ZEISS recommends Dragonfly Pro from Object Research Systems (ORS)

An advanced analysis and visualization software solution for your 3D data acquired by a variety of technologies including X-ray, FIB-SEM, SEM and helium ion microscopy.
Formerly Visual SI Advanced, Dragonfly Pro delivers high-definition visualization techniques and industry-leading graphics. Dragonfly Pro supports customization through easy to use Python scripting. Users now have total control of their 3D data post-processing environment and workflows.

more

 

Working principle of SIMS

Working principle of SIMS

Working principle of SIMS
Working principle of SIMS
The Ga focused ion beam (blue) removes material from the top few nm of the sample surface.Different sputtered ion species (light and dark grey) are collected and transferred to the ToF-SIMS detector.

Introducing ToF-SIMS enables High Throughput in 3D Analysis

Add the ToF-SIMS (time of flight secondary ion mass spectrometry) spectrometer to your Crossbeam 350 or Crossbeam 550 and analyze trace elements, light elements (e.g. lithium), and isotopes. Profit from sensitive and comprehensive analyses in 3D. Perform elemental mapping and depth profiling. Benefit from parallel detection of atomic and molecular ions down to the ppm level, achieve resolutions better than 35 nm in lateral direction and 20 nm in depth. Retrieve any signal from the ROI post-mortem.

Downloads


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ZEISS Crossbeam Family

Your FIB-SEM for High Throughput 3D Analysis and Sample Preparation

Pages: 24
Filesize: 5,811 kB

ZEISS Crossbeam Family

Introducing ToF-SIMS enables High Throughput in 3D Analysis

Pages: 2
Filesize: 1,322 kB

ZEISS Microscopy Solutions for Steel and Other Metals

Multi-modal characterization and advanced analysis options for industry and research

Pages: 22
Filesize: 12,439 kB

X² STEM Lamella Preparation from Multicomposite Organic Electronic Devices with ZEISS FIB-SEMs

Application Note

Pages: 6
Filesize: 883 kB

ZEISS Crossbeam Family

High Resolution STEM and EDS Study of Chromium Depletion in Stainless Steel

Pages: 5
Filesize: 1,615 kB

ZEISS Crossbeam 550

High Throughput Imaging

Pages: 5
Filesize: 2,045 kB

ZEISS Crossbeam

Reproducible TEM Lamella Thinning by FIB with Real-time Thickness Control and End-point Detection

Pages: 5
Filesize: 1,395 kB

Application Note:

FIB-SEM Investigations of the Microstructure of CIGS Solar Cells

Pages: 7
Filesize: 1,388 kB