ZEISS Crossbeam Family

Discovering and Designing Advanced Materials With Ease

Combine imaging and analytical performance of a high resolution field emission scanning electron microscope (FE-SEM) with the processing ability of a next-generation focused ion beam (FIB). You may be working in a multi-user facility, as an academic or in an industrial lab. Take advantage of ZEISS Crossbeam’s modular platform concept and upgrade your system with growing needs. During milling, imaging or when performing 3D analytics Crossbeam will speed up your FIB applications.

Learn in this video how the TEM lamella preparation workflow of ZEISS Crossbeam enables Benedikt Müller, University of Tuebingen, and Claus Burkhardt, NMI Reutlingen, to investigate the crystal structure of NanoSQUIDS.

Extract true sample information from your high resolution SEM images using Gemini electron optics
The Ion-sculptor FIB column introduces a new way of FIB-processing: by minimizing sample damage you’ll maximize sample quality and perform experiments faster at the same time
When preparing TEM samples use the low voltage capabilities of the Ion-sculptor FIB: get ultra-thin samples while keeping amorphization damage at a minimum
Within the ZEISS Crossbeam Family, either exploit the variable pressure capabilities of Crossbeam 350
Or use Crossbeam 550 for your most demanding characterizations. Enjoy even more options with the large chamber.

Advantages in FIB-SEM

Maximize Your SEM Insights

Take advantage of achieving up to 30% better SEM resolution at low voltage.

SEM Performance

Focused Ion Beam Column of ZEISS Crossbeam

Increase Your FIB Sample Throughput

Profit from up to 40% faster material removal by the introduction of intelligent FIB milling strategies.

Ion-sculptor FIB

EDS Analytics in 3D with ZEISS Crossbeam

Experience Best 3D Resolution in Your FIB-SEM Analysis

Enjoy the benefits of integrated 3D analysis for EDS and EBSD investigations.

Expand Your Crossbeam

Array of TEM lamella fabricated with automated preparation. Crossbeam 550.

The Workflow for TEM Lamella Preparation

Just do it with high quality at high throughput

Crossbeam offers a complete solution for preparing ultra-thin, high quality TEM samples at high throughput, ready for analysis in transmission imaging mode, in TEM or STEM.

1. Automated navigation to the specimen’s region of interest (ROI)

Begin the workflow without time-consuming search for the ROI
Use the navigation camera on the airlock to locate specimens
The integrated user interface makes it easy to navigate to your ROI
Benefit from the large, distortion-free field of view in the SEM

Lamella of a copper sample ready for lift out

2. Automated Sample Preparation (ASP) to prepare a lamella out of the bulk

Start the preparation with a simple three-step process: ASP
Define the recipe including drift correction, deposition and coarse and fine milling
The ion optics of the FIB column enables high throughput for the workflow
Duplicate the recipe and repeat as often as required in order to start a batch preparation

Part of the TEM lamella preparation workflow in a ZEISS Crossbeam

3. Lift out

Bring in the micromanipulator and attach the lamella to its tip
Cut out the lamella from the bulk
The lamella is then ready for lift out and can be transferred to a TEM grid

TEM lamella of a silicon sample after final thinning

4. Thinning: the final step is crucial, as it defines the quality of your TEM lamella

The instrument’s design allows you to reach a desired thickness of the lamella by enabling live monitoring of the thinning
Use two detector signals in parallel to judge lamella thickness and obtain reproducible end thickness on the one hand (with the SE detector) and to control surface quality on the other hand (with the Inlens SE detector)
Prepare high quality samples with negligible amorphization

360° view of Crossbeam 550

The Technology Behind ZEISS Crossbeam

SEM Electron Optics

Choose between Two Columns

The FE-SEM column of ZEISS Crossbeams is based on Gemini electron optics as all ZEISS FE-SEMs. Decide on the Gemini VP column of Crossbeam 350 or the Gemini II column of Crossbeam 550.

Electron Optics

Gemini - Novel Optics

Profit from Surface Sensitive Imaging

High resolution imaging at low landing energy is required for beam sensitive, non-conductive samples. A two-step deceleration modus, the Tandem decel, is now introduced to ZEISS Crossbeam 550.

Novelties in Gemini Technology

FIB-SEM Technology

Discover a new way of FIB processing

The Ion-sculptor FIB column speeds up your FIB work without compromising machining precision and lets you benefit of its low voltage performance for any sample.

FIB-SEM Technology

ZEISS Crossbeam Family

ZEISS Crossbeam 350: standard chamber

ZEISS Crossbeam 550: large chamber

Within ZEISS Crossbeam Family you have the choice between Crossbeam 350 or Crossbeam 550. Exploit the variable pressure capabilities of Crossbeam 350 (optional). Or use Crossbeam 550 for your most demanding characterizations and choose the chamber size, standard or large, that best suits your samples.

	ZEISS Crossbeam 350	ZEISS Crossbeam 550
SEM	Gemini I optics VP option -	Gemini II optics - Tandem decel option
Chamber Size and Ports	standard with 18 configurable ports	standard with 18 configurable ports or large with 22 configurable ports
Stage	100 mm travel range in x/y	standard with 100 mm or large 153 mm travel range in x/y
Charge Control	Flood Gun Local Charge Compensation Variable Pressure	Flood Gun Local Charge Compensation -
Exemplified Options	Inlens SE and Inlens EsB* for simultaneous imaging SE/EsB* imaging VPSE detector	Inlens SE and Inlens EsB* for simultaneous imaging SE/EsB* imaging large airlock for 8 inch wafers configure three pneumatically driven accessories simultaneously on the large chamber, e.g. STEM, 4-Quadrant-Backscatter detetor, and local charge compensation
Advantages	Maximum sample variety due to optional variable pressure mode, wide range of in situ experiments, sequential Inlens SE / EsB* imaging possible.	High throughput in analytics and imaging, high resolution under all conditions, simultaneous Inlens SE and Inlens EsB* imaging.
		^{* SE secondary electron, EsB energy selective backscatter}

Application Examples

Images

High resolution at FIB-SEM coincidence

The point where the stage and SEM- and FIB beam join for FIB patterning, deposition or milling: Alumina nanospheres imaged at 1 kV with Tandem decel.

Alumina spheres imaged with
Tandem decel on Crossbeam 550

Comparison of milling strategies in silicon:

Material removal with conventional milling (left) takes 10 min 54 sec whereas with Fastmill the same amount of material is removed in 7 min 21 sec (right). With Fastmill, a newly-introduced scanning strategy, milling speed is enhanced by optimally exploiting the angle-dependent sputtering effect. Fastmill enables up to 40% faster milling than regular line milling.

Comparison of milling strategies on Crossbeam 550

Precise sample preparation in a dense matrix

TEM-Lamella of a silver/nickel/copper-layered system ready for lift out, fabricated with automatic sample preparation.

TEM lamella in Ag-Ni-Cu multi-layer system

Preparation of batches

Array of TEM lamellae fabricated with automated preparation.

Batch of 35 TEM lamellae

EDS analysis at very high resolution with STEM

Chromium carbides at the grain boundary of thermally-affected X2CrNi18-10 steel: STEM BF (left), EDS chromium map (right).

STEM image and EDS elemental map
of Cr depletion in steel

Silicon in <110> orientation, STEM image of a FIB lamella.

<110> silicon dumbbells and a twin boundary are clearly visible. The TEM lamella was prepared with the lon-sculptor FIB of ZEISS Crossbeam 550 with low kV thinning. Image Courtesy of: C. Downing, CRANN Institute, Trinity College, Dublin, Ireland. Nion UltraSTEM 200.

Silicon in <110> orientation, STEM image of a FIB lamella.

Nanopatterning:
Nanofluidics channels fabricated by FIB in a silicon master stamp (left).
Detail: meander- shaped channel (center). Inlets and outlets have a funnel shape (right).
Courtesy of: I. Fernández-Cuesta, INF Hamburg, Germany.

Nanofluidic channels, master stamp

Nanofluidic channels, master stamp

Nanofluidic channels, meander-shaped channels

Nanofluidic channels, meander-shaped channels

Nanofluidic channels, funnel-shaped inlets and outlets

Nanofluidic channels, funnel-shaped inlets and outlets
Videos

Live imaging of FIB-milling a spiral in silicon
Imaged with the SEM using an Inlens detector.

3D tomogram of a solid oxide fuel cell
The SOFC’s anode is made of a heat resistant composite material: Nickel Samaria-doped Ceria.

Investigation of a lead free solder containing Cu and Ag particles in an Sn matrix

Tomography data of SEM images were acquired at 1.8 kV
Courtesy of: M. Cantoni, EPFL Lausanne, Switzerland.

Elemental mapping: EDS maps were acquired at 6 kV, using Atlas 5 Analytics.Courtesy of: M. Cantoni, EPFL Lausanne, Switzerland.

FIB-Tomography in Life Sciences

Cell Biology – Algae
3D reconstruction of a vitrified Emiliania huxleyi coccolithophore obtained from a cryo-FIB-SEM image series. The 3D reconstruction shows the immature coccolith (in yellowish), a coccolith in statu nascendi (blue) and lipid bodies (red).
Courtesy: L. Bertinetti, Max-Planck Institute of Colloids and Interfaces, Potsdam, DE and A. Scheffel, Max-Planck Institute Plant Physiology, Potsdam, DE.

Neuroscience – Brain Sections
Large area milling and imaging of a brain section with the 3D module of ZEISS Atlas 5. High current allows fast milling and imaging of large fields of view up to 150 μm in width. The depicted brain image has a field of view of 75 μm in width and the sample was milled with a beam current of 20 nA.
Courtesy: C. Genoud, FMI Basel, CH.

Accessories

ZEISS Atlas 5 – Master Your Multi-scale Challenge

Atlas 5 makes your life easier: create comprehensive multi-scale, multi-modal images with a sample-centric correlative environment. Atlas 5 is the powerful yet intuitive hardware and software package that extends the capacity of your focused ion beam SEM.

Correlate X-ray microscopy and FIB-SEM: use the X-ray data to localize sub-surface features in 3D to target FIB sites that are not visible on the sample surface.

Profit from two modules dedicated specifically to FIB-SEM applications: Automatically create 3D data stacks with the 3D Tomography module. Solve even complex tasks in nanopatterning and –prototyping with the module for advanced nanopatterning and visualization engine (NPVE Advanced).

Visualization and Analysis Software

ZEISS recommends Dragonfly Pro from Object Research Systems (ORS)

An advanced analysis and visualization software solution for your 3D data acquired by a variety of technologies including X-ray, FIB-SEM, SEM and helium ion microscopy.
Formerly Visual SI Advanced, Dragonfly Pro delivers high-definition visualization techniques and industry-leading graphics. Dragonfly Pro supports customization through easy to use Python scripting. Users now have total control of their 3D data post-processing environment and workflows.

Working principle of SIMS

Introducing ToF-SIMS enables High Throughput in 3D Analysis

Add the ToF-SIMS (time of flight secondary ion mass spectrometry) spectrometer to your Crossbeam 350 or Crossbeam 550 and analyze trace elements, light elements (e.g. lithium), and isotopes. Profit from sensitive and comprehensive analyses in 3D. Perform elemental mapping and depth profiling. Benefit from parallel detection of atomic and molecular ions down to the ppm level, achieve resolutions better than 35 nm lateral direction and 20 nm in depth. Retrieve any signal from the ROI post-mortem.

Downloads

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ZEISS Crossbeam Family

Your FIB-SEM for High Throughput 3D Analysis and Sample Preparation

Pages: 24
Filesize: 5,811 kB

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ZEISS Microscopy Solutions for Steel and Other Metals

Multi-modal characterization and advanced analysis options for industry and research

Pages: 22
Filesize: 12,439 kB

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X² STEM Lamella Preparation from Multicomposite Organic Electronic Devices with ZEISS FIB-SEMs

Application Note

Pages: 6
Filesize: 883 kB

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ZEISS Crossbeam Family

High Resolution STEM and EDS Study of Chromium Depletion in Stainless Steel

Pages: 5
Filesize: 1,615 kB

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ZEISS Crossbeam 550

High Throughput Imaging

Pages: 5
Filesize: 2,045 kB

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ZEISS Crossbeam

Reproducible TEM Lamella Thinning by FIB with Real-time Thickness Control and End-point Detection

Pages: 5
Filesize: 1,395 kB

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Application Note:

FIB-SEM Investigations of the Microstructure of CIGS Solar Cells

Pages: 7
Filesize: 1,388 kB

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ZEISS Crossbeam Family

Discovering and Designing Advanced Materials With Ease

Advantages in FIB-SEM

Maximize Your SEM Insights

Increase Your FIB Sample Throughput

Experience Best 3D Resolution in Your FIB-SEM Analysis

The Workflow for TEM Lamella Preparation

Just do it with high quality at high throughput

360° view of Crossbeam 550

The Technology Behind ZEISS Crossbeam

SEM Electron Optics

Choose between Two Columns

Gemini - Novel Optics

Profit from Surface Sensitive Imaging

FIB-SEM Technology

Discover a new way of FIB processing

ZEISS Crossbeam Family

Application Examples

Investigation of a lead free solder containing Cu and Ag particles in an Sn matrix

FIB-Tomography in Life Sciences

Accessories

ZEISS Atlas 5 – Master Your Multi-scale Challenge

Visualization and Analysis Software

Introducing ToF-SIMS enables High Throughput in 3D Analysis

Downloads

ZEISS Crossbeam Family

ZEISS Microscopy Solutions for Steel and Other Metals

X² STEM Lamella Preparation from Multicomposite Organic Electronic Devices with ZEISS FIB-SEMs

ZEISS Crossbeam Family

ZEISS Crossbeam 550

ZEISS Crossbeam

Application Note: