20 July 2018, 8:30 am – 5:00 pm | Marina Bay Sands Expo and Convention Centre, Singapore

ZEISS Process Control Innovations Seminar (PCIS)

Level 3, Begonia Ballroom

As the complexity and variety of semiconductor technologies continue to increase, so do challenges for process control technologies. Modern manufacturing techniques are increasingly incorporating novel materials and more complex 3D structures to meet rapidly evolving market demands. Resulting new processes are driving the need for new failure analysis and process control methods.


Please join us at the 1st Annual ZEISS Process Control Innovations Seminar (PCIS) to hear industry experts and leaders from the academic community present case studies for a variety of advanced process control and metrology topics.

Reserve your spot

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8:30 AM



9:00 AM 

Welcome Address


9:15 AM

Keynote - Deep Learning in Advanced Semiconductor Manufacturing: Opportunities and Challenges

Professor Dim-Lee Kwong, Executive Director I2R & IME, A*STAR

9:45 AM

Novel Semiconductor Failure Analysis Workflow using Integrated 3D High-resolution X-ray Microscopy

Mr. Fu Chao, Director of Marketing, WinTech Nano

10:15 AM

Nanoscale XRM: Next-generation X-ray Microscopy for Advanced
Semiconductor Packaging

Dr. Christian Schmidt, Senior Manager, Semiconductor Application Development & Strategy, ZEISS
Luke England, 3D Packaging Manager, Global Foundries
Ingrid DeWolf, Chief Scientist, IMEC

10:45 AM

Tea Break


11:15 AM

Device Analysis for Microprocessors in Advanced Process Technology Nodes

Vinod Narang, Engineering Manager, Device Analysis Lab, AMD Singapore

11:45 AM

Focused Helium Ion Beam Applications in Advanced-Node Nanolithography R&D

Dr. Ken Tsai, Associate Professor, National Taiwan University

12:15 PM



1:30 PM

Submicron Resolution X-ray Microscopy for 3D Inspection and Measurement of Semiconductor Packages

Dr. Allen Gu, Staff Development Engineer, ZEISS

2:00 PM

How 3D Data Analytics Helps to re-imagine Process Control in Semiconductor Manufacturing

Dr. Eugen Foca, Director Digital Solutions, ZEISS

2:30 PM

Multibeam Imaging for Rapid Advanced Circuit Layout Extraction (MIRACLE): Applications & Opportunities

Raghu Nayak, Segment Solutions Manager, ZEISS

3:00 PM

Summary and Closing


3:15-5:00 PM

Cocktail Reception 

Level 4, Bayview Foyer