vZTech Japan Virtual Customer Meeting
May 18 - 19, 2021
15:00 - 18:30 Japan Standard Time
Agenda
This vZTech is planned especially for the Japanese market. The agenda refers to technologies, questions and discussions according to Japanese companies and customers.

JST Time |
Topic |
Speaker |
15:00 |
Knowing ZEISS - Meet SMS and ZEISS Japan |
Christoph Hensche, Head of ZEISS SMS |
15:30 |
Keynote Speech: EUV blanks technical review |
Mr. Yoshiaki Ikuta, AGC Inc. |
16:00 |
Closing the gap – total solution for hard and soft defects |
Dr. Markus Waiblinger, Senior Product Manager |
16:30 |
Coffee Break |
|
16:40 |
High-end EUV Photomask Repairs for advanced nodes |
Dr. Michael Waldow, Product Manager FoB Repair |
17:10 |
Feeling ZEISS - virtual factory tour |
Satoshi Watanabe, Head of ZEISS SMS Japan |
Note: Given time is Japan Standard Time.
JST Time |
Topic |
Speaker |
15:00 |
Knowing ZEISS - Meet ZEISS Japan |
Stefan Sacré, Head of ZEISS Japan |
15:30 |
ZEISS ForTune |
Ofir Sharoni, Head of Product Management FoB Tuning |
16:00 |
The Solution for 193nm high-end Mask Qualification |
Robert Birkner, Senior Product Manager Operational Business AIMS |
16:30 |
Coffee Break |
|
16:40 |
Solution for actinic review of EUV mask |
Sven Krannich, Customer Project Manager |
17:10 |
Talking to ZEISS - Panel Discussion: Key to unlock EUVL potential |
to be published |
Note: Given time is Japan Standard Time.
EUV blanks technical review
by Mr. Yoshiaki Ikuta, AGC Inc.
The EUV lithography has been employed to manufacture the state-of-the-art semiconductor devices. This talk will review the technical review of the EUV blanks, which is one of the key EUV eco system.
Closing the gap – total solution for hard and soft defects by Dr. Markus Waiblinger
In this talk, we investigated an extension of the existing mask repair product line to also address particle defects. The resulting tool for particle removal leverages the know-how on defect repair using e-beam based repair schemes with a novel in-situ manipulator to remove particles, including real-time observation by scanning electrode microscopy. This talk will focus primarily on successfully demonstrating defect removal, reviewing the area of interest by SEM and showing no collateral damage being observed by SEM-EDX (Energy Dispersive X-ray) analysis.
High-end EUV Photomask Repairs for advanced nodes by Dr. Michael Waldow
Scaling trends in the semiconductor industry towards smaller technology nodes and features sizes are continuing and first consumer products manufactured with the help of EUV technology are already on the market. During the talk the latest results of high-end EUV repairs carried out on the next generation photomask repair tool MeRiT® LE will be presented.
ZEISS ForTune EUV talk by Ofir Sharoni
Abstract to come
ZEISS AIMS 1x-193i – The Solution for 193nm high-end Mask Qualification by Robert Birkner
The industry widely utilizes 193nm lithography for high end chip manufacturing. Together with the introduction of EUV lithography and application of mix & match technologies the mask specifications for 193nm high end masks tighten continuously. Source Mask Optimization technologies are applied to meet the printing targets. As result mask designs as well as scanner illumination schemes become more complex. This talk will demonstrate how ZEISS AIMS® 1x-193i high-end system supports our customers to meet the challenges of increasing complexity, tighter mask specification control and high productivity.
AIMS® EUV – ZEISS’ solution for actinic review of EUV mask by Sven Krannich
In the ever-lasting development towards smaller nodes, DUV lithography has recognized the importance of understanding the mask contribution to the wafer printing, for which the error tolerances are constantly tighten with every node. The same process will be necessarily undergone by EUV lithography, for which the more complex nature of the mask and of the imaging process will require a tighter control of all components concurring to the manufacturing of the chip as the nodes will be scaling down. In this talk, we demonstrate how AIMS® EUV supports our customers to meet the challenges of EUV lithography.
Speakers at vZTech
Experts in the industry
Christoph Hensche
ZEISS
Mr. Yoshiaki Ikuta
AGC, Inc.
Dr. Markus Waiblinger
ZEISS
Dr. Michael Waldow
ZEISS
Satoshi Watanabe
ZEISS
Ofir Sharoni
ZEISS
Robert Birkner
ZEISS
Sven Krannich
ZEISS
Key to unlock EUVL potential Panel Discussion
Registration for vZTech
- Experience ZEISS
- Invited Keynote Speech
- News and Product Updates
- Panel Discussion