vZTech Japan Virtual Customer Meeting

May 18 - 19, 2021

15:00 - 18:30 Japan Standard Time

.. Days .. Hours .. Minutes .. Seconds

Agenda

This vZTech is planned especially for the Japanese market. The agenda refers to technologies, questions and discussions according to Japanese companies and customers.

JST Time

Topic

Speaker

15:00

Knowing ZEISS - Meet SMS and ZEISS Japan

Christoph Hensche, Head of ZEISS SMS

15:30

Keynote Speech: EUV blanks technical review

Mr. Yoshiaki Ikuta, AGC Inc.

16:00

Closing the gap – total solution for hard and soft defects

Dr. Markus Waiblinger, Senior Product Manager

16:30

Coffee Break

16:40

High-end EUV Photomask Repairs for advanced nodes

Dr. Michael Waldow, Product Manager FoB Repair

17:10

Feeling ZEISS - virtual factory tour

Satoshi Watanabe, Head of ZEISS SMS Japan

Note: Given time is Japan Standard Time.

JST Time

Topic

Speaker

15:00

Knowing ZEISS - Meet ZEISS Japan

Stefan Sacré, Head of ZEISS Japan

15:30

ZEISS ForTune

Ofir Sharoni, Head of Product Management FoB Tuning

16:00

The Solution for 193nm high-end Mask Qualification

Robert Birkner, Senior Product Manager Operational Business AIMS

16:30

Coffee Break

16:40

Solution for actinic review of EUV mask

Sven Krannich, Customer Project Manager

17:10

Talking to ZEISS - Panel Discussion: Key to unlock EUVL potential

to be published

Note: Given time is Japan Standard Time.

Key Note

EUV blanks technical review

by Mr. Yoshiaki Ikuta, AGC Inc.

The EUV lithography has been employed to manufacture the state-of-the-art semiconductor devices. This talk will review the technical review of the EUV blanks, which is one of the key EUV eco system.

Tuesday

May 18
15:30 p.m. – 16:00 p.m.

Repair

Closing the gap – total solution for hard and soft defects by Dr. Markus Waiblinger

In this talk, we investigated an extension of the existing mask repair product line to also address particle defects. The resulting tool for particle removal leverages the know-how on defect repair using e-beam based repair schemes with a novel in-situ manipulator to remove particles, including real-time observation by scanning electrode microscopy. This talk will focus primarily on successfully demonstrating defect removal, reviewing the area of interest by SEM and showing no collateral damage being observed by SEM-EDX (Energy Dispersive X-ray) analysis.

Tuesday

May 18
16:00 p.m. – 16:30 p.m.

Repair

High-end EUV Photomask Repairs for advanced nodes by Dr. Michael Waldow

Scaling trends in the semiconductor industry towards smaller technology nodes and features sizes are continuing and first consumer products manufactured with the help of EUV technology are already on the market. During the talk the latest results of high-end EUV repairs carried out on the next generation photomask repair tool MeRiT® LE will be presented.

Tuesday

May 18
16:40 p.m. – 17:10 p.m.

Tuning

ZEISS ForTune EUV talk by Ofir Sharoni

Abstract to come

Wednesday

May 19
15:30 p.m. – 16:00 p.m.

Qualification

ZEISS AIMS 1x-193i – The Solution for 193nm high-end Mask Qualification by Robert Birkner

The industry widely utilizes 193nm lithography for high end chip manufacturing. Together with the introduction of EUV lithography and application of mix & match technologies the mask specifications for 193nm high end masks tighten continuously. Source Mask Optimization technologies are applied to meet the printing targets. As result mask designs as well as scanner illumination schemes become more complex. This talk will demonstrate how ZEISS AIMS® 1x-193i high-end system supports our customers to meet the challenges of increasing complexity, tighter mask specification control and high productivity.

Wednesday

May 19
16:00 p.m. – 16:30 p.m.

EUV

AIMS® EUV – ZEISS’ solution for actinic review of EUV mask by Sven Krannich

In the ever-lasting development towards smaller nodes, DUV lithography has recognized the importance of understanding the mask contribution to the wafer printing, for which the error tolerances are constantly tighten with every node. The same process will be necessarily undergone by EUV lithography, for which the more complex nature of the mask and of the imaging process will require a tighter control of all components concurring to the manufacturing of the chip as the nodes will be scaling down. In this talk, we demonstrate how AIMS® EUV supports our customers to meet the challenges of EUV lithography.

Wednesday

May 19
16:40 p.m. – 17:10 p.m.

Speakers at vZTech

Experts in the industry

Christoph Hensche

ZEISS

Head of ZEISS SMS

Mr. Yoshiaki Ikuta

AGC, Inc.

Director of Blanks Business Unit

Dr. Markus Waiblinger

ZEISS

Senior Product Manager

Dr. Michael Waldow

ZEISS

Product Manager Field of Business Repair

Satoshi Watanabe

ZEISS

Head of SMS Japan

Ofir Sharoni

ZEISS

Head of Product Management FoB Tuning

Robert Birkner

ZEISS

Senior Product Manager Operational Business AIMS

Sven Krannich

ZEISS

Product Management AIMS® EUV

Key to unlock EUVL potential Panel Discussion

Registration for vZTech

  • Experience ZEISS
  • Invited Keynote Speech
  • News and Product Updates
  • Panel Discussion
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