Papers from ZEISS authors and joint projects

Scientific Publications covering photomask relevant topics

You can find publications written by ZEISS SMS authors or jointly with other companies, sorted by technology and conference. Copy Downloads are free of charge. Copyright 2019 Society of Photo Optical Instrumentation Engineers. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in all papers for a fee or for commercial purposes, or modification of the content of the paper are prohibited.

Publications sorted by technology

Mask Qualification

Papers covering qualification and verification of photomask defects.
Papers covering qualification and verification of photomask defects.

2019

Actinic metrology platform for defect review and mask qualification: flexibility and performance
Proceedings Volume 10957, Extreme Ultraviolet (EUV) Lithography X; 109570X (2019) https://doi.org/10.1117/12.2518596 Event: SPIE Advanced Lithography, 2019, San Jose, California, United States

SEM AutoAnalysis for reduced turnaround time and to ensure repair quality of EUV photomasks
Proceedings Volume 11147, International Conference on Extreme Ultraviolet Lithography 2019; 111471G (2019) https://doi.org/10.1117/12.2538474 Event: SPIE Photomask Technology + EUV Lithography, 2019, Monterey, California, United States

2018

AIMSTM EUV first insertion into the back end of the line of a mask shop: a crucial step enabling EUV production
Proceedings Volume 10810, Photomask Technology 2018; 108100S (2019) https://doi.org/10.1117/12.2503361 Event: SPIE Photomask Technology + Extreme Ultraviolet Lithography, 2018, Monterey, California, United States

AIMSTM EUV tool platform: aerial image based qualification of EUV masks
Proceedings Volume 10810, Photomask Technology 2018; 108100V (2018) https://doi.org/10.1117/12.2501379 Event: SPIE Photomask Technology + Extreme Ultraviolet Lithography, 2018, Monterey, California, United States

 

2017

*** under constrcution ***

Mask Metrology

Scientific papers about photomask metrology.
Scientific papers about photomask metrology.

2019

Wafer alignment mark placement accuracy impact on the layer-to-layer overlay performance
Proceedings Volume 11148, Photomask Technology 2019; 1114811 (2019) https://doi.org/10.1117/12.2536270
Event: SPIE Photomask Technology + EUV Lithography, 2019, Monterey, California, United States

The impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay
Proceedings Volume 11178, Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology; 111780R (2019) https://doi.org/10.1117/12.2535900 Event: Photomask Japan 2019, 2019, Yokohama, Japan

2018

Intra-field mask-to-mask overlay, separating the mask writing from the dynamic pellicle contribution
Proceedings Volume 10807, Photomask Japan 2018: XXV Symposium on Photomask and Next-Generation Lithography Mask Technology; 108070K (2018) https://doi.org/10.1117/12.2500086 Event: Photomask Japan 2018, 2018, Yokohama, Japan

*** more publications coming ***

2017

*** under constrcution ***

Mask Tuning

Publications on the topic excursion prevention and tuning of photomasks.
Publications on the topic excursion prevention and tuning of photomasks.

2019

Enhanced Wafer Overlay Residuals Control; Deep Sub-Nanometer at Sub-Millimeter Lateral Resolution
Proceedings Volume 11177, 35th European Mask and Lithography Conference (EMLC 2019); 111770J (2019) https://doi.org/10.1117/12.2535641 Event: 35th European Mask and Lithography Conference, 2019, Dresden, Germany

Reduce Probability of Wafer Intra-Field Process (Printing) Defects for Logic & DRAM Applications
Proceedings Volume 11177, 35th European Mask and Lithography Conference (EMLC 2019); 1117712 (2019) https://doi.org/10.1117/12.2535686 Event: 35th European Mask and Lithography Conference, 2019, Dresden, Germany

Improving chip performance by photomask tuning: ultimate intra-field CD control as a major part of an overall excursion prevention strategy
Proceedings Volume 11148, Photomask Technology 2019; 111480L (2019) https://doi.org/10.1117/12.2536896 Event: SPIE Photomask Technology + EUV Lithography, 2019, Monterey, California, United States

2018

*** under construction ***

2017

*** under constrcution ***

Mask Repair

Papers about photomask repair.
Papers about photomask repair.

2019

On the road to automated production workflows in the back end of line
Proceedings Volume 10775, 34th European Mask and Lithography Conference; 107750N (2018) https://doi.org/10.1117/12.2326908 Event: 34th European Mask and Lithography Conference, 2018, Grenoble, France

*** more publications coming ***

Publications sorted by event

SPIE Photomask Technology  + EUV Lithography

Papers which were presented during SPIE PT/Bacus.
Papers which were presented during SPIE PT/Bacus.

2019

Actinic metrology platform for defect review and mask qualification: flexibility and performance
Proceedings Volume 10957, Extreme Ultraviolet (EUV) Lithography X; 109570X (2019) https://doi.org/10.1117/12.2518596 Event: SPIEAdvanced Lithography, 2019, San Jose, California, United States

Improving chip performance by photomask tuning: ultimate intra-field CD control as a major part of an overall excursion prevention strategy
Proceedings Volume 11148, Photomask Technology 2019; 111480L (2019) https://doi.org/10.1117/12.2536896 Event: SPIE Photomask Technology + EUV Lithography, 2019, Monterey, California, United States

Wafer alignment mark placement accuracy impact on the layer-to-layer overlay performance
Proceedings Volume 11148, Photomask Technology 2019; 1114811 (2019) https://doi.org/10.1117/12.2536270 Event: SPIE Photomask Technology + EUV Lithography, 2019, Monterey, California, United States

SEM AutoAnalysis for reduced turnaround time and to ensure repair quality of EUV photomasks
Proceedings Volume 11147, International Conference on Extreme Ultraviolet Lithography 2019; 111471G (2019) https://doi.org/10.1117/12.2538474 Event: SPIE Photomask Technology + EUV Lithography, 2019, Monterey, California, United States

2018

AIMSTM EUV first insertion into the back end of the line of a mask shop: a crucial step enabling EUV production
Proceedings Volume 10810, Photomask Technology 2018; 108100S (2019) https://doi.org/10.1117/12.2503361 Event: SPIE Photomask Technology + Extreme Ultraviolet Lithography, 2018, Monterey, California, United States

AIMSTM EUV tool platform: aerial image based qualification of EUV masks
Proceedings Volume 10810, Photomask Technology 2018; 108100V (2018) https://doi.org/10.1117/12.2501379 Event: SPIE Photomask Technology + Extreme Ultraviolet Lithography, 2018, Monterey, California, United States

SPIE Advanced Lithography

Publications presented during SPIE AL.
Publications presented during SPIE AL.

2019

Enhanced Wafer Overlay Residuals Control; Deep Sub-Nanometer at Sub-Millimeter Lateral Resolution
Proceedings Volume 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII; 109592K (2019) https://doi.org/10.1117/12.2516362 Event: SPIE Advanced Lithography, 2019, San Jose, California, United States

2018

*** more publications coming ***

Photomask Japan

Scientific papers published during PMJ.
Scientific papers published during PMJ.

2019

Wafer alignment mark placement accuracy impact on the layer-to-layer overlay performance
Proceedings Volume 11148, Photomask Technology 2019; 1114811 (2019) https://doi.org/10.1117/12.2536270
Event: SPIE Photomask Technology + EUV Lithography, 2019, Monterey, California, United States

The impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay
Proceedings Volume 11178, Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology; 111780R (2019) https://doi.org/10.1117/12.2535900 Event: Photomask Japan 2019, 2019, Yokohama, Japan

2018

Intra-field mask-to-mask overlay, separating the mask writing from the dynamic pellicle contribution
Proceedings Volume 10807, Photomask Japan 2018: XXV Symposium on Photomask and Next-Generation Lithography Mask Technology; 108070K (2018) https://doi.org/10.1117/12.2500086 Event: Photomask Japan 2018, 2018, Yokohama, Japan

European Mask and Lithography Conference

Scientific publications shown during EMLC.
Scientific publications shown during EMLC.

2019

Enhanced Wafer Overlay Residuals Control; Deep Sub-Nanometer at Sub-Millimeter Lateral Resolution
Proceedings Volume 11177, 35th European Mask and Lithography Conference (EMLC 2019); 111770J (2019) https://doi.org/10.1117/12.2535641 Event: 35th European Mask and Lithography Conference, 2019, Dresden, Germany

Reduce Probability of Wafer Intra-Field Process (Printing) Defects for Logic & DRAM Applications
Proceedings Volume 11177, 35th European Mask and Lithography Conference (EMLC 2019); 1117712 (2019) https://doi.org/10.1117/12.2535686 Event: 35th European Mask and Lithography Conference, 2019, Dresden, Germany

2018

On the road to automated production workflows in the back end of line
Proceedings Volume 10775, 34th European Mask and Lithography Conference; 107750N (2018) https://doi.org/10.1117/12.2326908 Event: 34th European Mask and Lithography Conference, 2018, Grenoble, France

*** more publications coming ****

Newsletter

Subscribe to our photomask newsletter.

Events

Meet us at global conferences and meetings.

Contact

Further questions and suggestions.