MultiSEM 505/506

The World’s Fastest Scanning Electron Microscopes

  • Overview

    MultiSEM 505/506

    Unleash the acquisition speed of up to 91 parallel electron beams on this multi-beam scanning electron microscope. Simply set up your high-throughput data acquisition workflow and your MultiSEM will acquire high contrast images automatically.

    Image in the centimeter scale at nanometer resolution. Get the detailed nanoscale picture‚ without losing the macroscopic context.

    MultiSEM is designed for continuous, reliable 24/7 operation. Proven ZEN imaging software from ZEISS enables your workflow setup in an intuitive yet flexible way.

  • Highlights

    Highlights

    High throughput multi-beam imaging

    • Acquire your images at the highest speed with up to 91 electron beams working in parallel
    • Image an area of 1 cm² at nanometer resolution in 3 hours or faster
    • Top net speed up to 2 terapixels/hour for your big data acquisition

    High resolution multi-beam imaging

    • 3.5 nm or better  resolution imaging
    • High efficiency secondary electron collection enables high contrast images at low noise levels
    • Get the detailed nanoscale picture without losing the macroscopic context - Automated acquisition protocols enable large area imaging

    Intuitive and user friendly imaging software

    • Easy to use ZEN imaging software, common for all ZEISS imaging systems, controls MultiSEM in a straightforward intuitive way
    • Smart auto-tuning routines capture images with high resolution and high contrast
    • Quick and easy set up of complex automated acquisition procedures are adapted and tuned to your big data samples
  • Key Applications

    Key Applications

    Mask Inspection

    Application: EUV Mask validation for FinFETs

    MultiSEM Advantage: Particle defects, line breaks, and line crossovers are all imaged in a single MultiSEM field of view (FOV) in rapid fashion compared to single defect in FOV using single beam approach.

    Courtesy: SEMATECH

    Semiconductor Wafer Inspection

    Application: Large area imaging on semiconductor wafers

    MultiSEM Advantage: Quickly get an image which surveys the entire region of interest while simultaneously providing the detail required to identify sub features in high resolution.

    Courtesy: SEMATECH

    Application: Imaging on 1xnm process window characterization wafers

    MultiSEM Advantage: MultiSEM breaks the throughput limitations of conventional SEMs by employing massively parallel imaging. High resolution image quality supports the robust extraction of contours and enables CD measurements with repeatability down to 0.64 nm, even without frame averaging, in a consistent and repeatable way.

    Courtesy: IMEC

    Reverse Engineering

    Application: Rapid reverse engineering through circuit extraction of modern microelectronics to qualify trusted suppliers and avoid threat through built-in malware

    MultiSEM Advantage: Large area imaging at nanometer resolution enables faster data collection on exposed layers on time sensitive reverse engineering applications

  • Video & Images

    Videos & Images

    MultiSEM Technology

    Loading the player...

    IC Wafer with 20 nm Gold/Palladium Particles

    Loading the player...

    Reverse Engineering on Graphics Processor

    Loading the player...
    Graphics Processor

    Multi-beam image at 200 µm acquired in 1.4s at 4.5 nm pixel size

    Silicon Test Sample with Nanometer-sized Structures

    Multi-beam image at 200 µm acquired in 8s

    20 nm Gold/Palladium Particles

    Multi-beam image at 200 µm acquired in 1.4s at 4.5 nm pixel size

    Semiconductor Wafer

    Single beam image on wafer with 3.8 nm pixel

    EUV Mask

    Single beam image on EUV mask with 3.8 nm pixel

  • Technology

    Technology

    MultiSEM uses multiple electron beams (green: illumination path) and detectors in parallel.

    A finely tuned detection path (red) collects a large yield of secondary electrons (SE) for imaging.

    Each beam carries out a synchronized scanning routine at one sample position, resulting in a single sub-image. The electron beams are arranged in a hexagonal pattern.

    The full image is formed by merging all image tiles.

    A parallel computer setup is used for fast data recording, which increases the total imaging speed. Image acquisition and workflow control are fully separated in the MultiSEM system.

  • Software

    ZEN 2 Browser

    View Demo-Samples here

  • Downloads

    External Publications

We use cookies on this site. Cookies are small text files that are stored on your computer by websites. Cookies are widely used and help to optimize the pages that you view. By using this site, you agree to their use. more