MultiSEM 505/506

The World’s Fastest Scanning Electron Microscopes

MultiSEM 505/506 Overview

Unleash the acquisition speed of up to 91 parallel electron beams on this multi-beam scanning electron microscope. Simply set up your high-throughput data acquisition workflow and your MultiSEM will acquire high contrast images automatically.

Image in the centimeter scale at nanometer resolution. Get the detailed nanoscale picture‚ without losing the macroscopic context.

MultiSEM is designed for continuous, reliable 24/7 operation. Proven ZEN imaging software from ZEISS enables your workflow setup in an intuitive yet flexible way.

Highlights

High throughput multi-beam imaging

  • Acquire your images at the highest speed with up to 91 electron beams working in parallel
  • Image an area of 1 cm² at nanometer resolution in 3 hours or faster
  • Top net speed up to 2 terapixels/hour for your big data acquisition

High resolution multi-beam imaging

  • 3.5 nm or better resolution imaging
  • High efficiency secondary electron collection enables high contrast images at low noise levels
  • Get the detailed nanoscale picture without losing the macroscopic context - Automated acquisition protocols enable large area imaging

Intuitive and user friendly imaging software

  • Easy to use ZEN imaging software, common for all ZEISS imaging systems, controls MultiSEM in a straightforward intuitive way
  • Smart auto-tuning routines capture images with high resolution and high contrast
  • Quick and easy set up of complex automated acquisition procedures are adapted and tuned to your big data samples

Key Applications

Mask Inspection

Application: EUV mask validation for FinFETs

MultiSEM Advantage: Particle defects, line breaks, and line crossovers are all imaged in a single MultiSEM field of view (FOV) in rapid fashion compared to single defect in FOV using single beam approach.

 

Courtesy: SEMATECH

Semiconductor Wafer Inspection

Application: Large area imaging on semiconductor wafers

MultiSEM Advantage: Quickly get an image which surveys the entire region of interest while simultaneously providing the detail required to identify sub features in high resolution.

 

Courtesy: SEMATECH

Application: Imaging on 1xnm process window characterization wafers

MultiSEM Advantage: MultiSEM breaks the throughput limitations of conventional SEMs by employing massively parallel imaging. High resolution image quality supports the robust extraction of contours and enables CD measurements with repeatability down to 0.64 nm, even without frame averaging, in a consistent and repeatable way.

 

Courtesy: IMEC

Reverse Engineering

Application: Rapid reverse engineering through circuit extraction of modern microelectronics to qualify trusted suppliers and avoid threat through built-in malware.

MultiSEM Advantage: Large area imaging at nanometer resolution enables faster data collection on exposed layers on time sensitive reverse engineering applications.

Videos & Images

MultiSEM Technology

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IC Wafer with 20 nm Gold/Palladium Particles

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Reverse Engineering on Graphics Processor

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Graphics Processor

Multi-beam image at 200 µm acquired in 1.4s at 4.5 nm pixel size

Silicon Test Sample with Nanometer-sized Structures

Multi-beam image at 200 µm acquired in 8s

EUV Mask

Single beam image on EUV mask with 3.8 nm pixel

20 nm Gold/Palladium Particles

Multi-beam image at 200 µm acquired in 1.4s at 4.5 nm pixel size

Semiconductor Wafer

Single beam image on wafer with 3.8 nm pixel

Technology

MultiSEM uses multiple electron beams (green: illumination path) and detectors in parallel.

A finely tuned detection path (red) collects a large yield of secondary electrons (SE) for imaging.

Each beam carries out a synchronized scanning routine at one sample position, resulting in a single sub-image. The electron beams are arranged in a hexagonal pattern.

The full image is formed by merging all image tiles.

MultiSEM uses multiple electron beams (green: illumination path) and detectors in parallel.

A finely tuned detection path (red) collects a large yield of secondary electrons (SE) for imaging.

Each beam carries out a synchronized scanning routine at one sample position, resulting in a single sub-image. The electron beams are arranged in a hexagonal pattern.

The full image is formed by merging all image tiles.

MultiSEM uses multiple electron beams (green: illumination path) and detectors in parallel.

A finely tuned detection path (red) collects a large yield of secondary electrons (SE) for imaging.

Each beam carries out a synchronized scanning routine at one sample position, resulting in a single sub-image. The electron beams are arranged in a hexagonal pattern.

The full image is formed by merging all image tiles.

MultiSEM uses multiple electron beams (green: illumination path) and detectors in parallel.

A finely tuned detection path (red) collects a large yield of secondary electrons (SE) for imaging.

Each beam carries out a synchronized scanning routine at one sample position, resulting in a single sub-image. The electron beams are arranged in a hexagonal pattern.

The full image is formed by merging all image tiles.

MultiSEM uses multiple electron beams (green: illumination path) and detectors in parallel.

A finely tuned detection path (red) collects a large yield of secondary electrons (SE) for imaging.

Each beam carries out a synchronized scanning routine at one sample position, resulting in a single sub-image. The electron beams are arranged in a hexagonal pattern.

The full image is formed by merging all image tiles.

MultiSEM uses multiple electron beams (green: illumination path) and detectors in parallel.

A finely tuned detection path (red) collects a large yield of secondary electrons (SE) for imaging.

Each beam carries out a synchronized scanning routine at one sample position, resulting in a single sub-image. The electron beams are arranged in a hexagonal pattern.

The full image is formed by merging all image tiles.

MultiSEM uses multiple electron beams (green: illumination path) and detectors in parallel.

A finely tuned detection path (red) collects a large yield of secondary electrons (SE) for imaging.

Each beam carries out a synchronized scanning routine at one sample position, resulting in a single sub-image. The electron beams are arranged in a hexagonal pattern.

The full image is formed by merging all image tiles.

A parallel computer setup is used for fast data recording, which increases the total imaging speed. Image acquisition and workflow control are fully separated in the MultiSEM system.

ZEN 2 Browser

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