Versa 3D X-ray Microscopes

for Non-destructive High Resolution Fault Imaging

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  • Journal Article - High-resolution 3D X-ray Microscopy for Semiconductor advanced packaging measurements
  • Application Note - Non-destructive, High-resolution Fault Imaging for Package Failure Analysis with 3D X-ray Microscopy
  • White Paper - Package Optimization and Failure Analysis with 3D X-ray Microscopy
  • White Paper - Resolution of a 3D X-ray Microscope
  • Journal Article - “Application of 3D X-ray Microscopy for 3D IC Process Development”
  • Journal Article - "High-res 3D X-ray Microscopy for Non-destructive Failure Analysis of Chip-to-chip Micro-bump Interconnects in Stacked Die Packages"
  • Journal Article - "Non-destructive 3D X-ray Imaging for Advanced Packaging Failure Analysis"
  • Journal Article - "3D X-ray Microscopy: A Non-destructive High Resolution Imaging Technology that Replaces Physical Cross-sectioning for 3DIC Packaging"