Analyzing structures and quickly solving failures are tasks at the heart of semiconductor development and electronics manufacturing. Package interconnect structures are shrinking with higher packing density while packages are growing larger. The end result is smaller, more difficult to find defects and longer analysis times.

ZEISS Advanced Reconstruction Toolbox was created to improve 3D X-ray image quality and scan times. It includes two workstation-based, advanced reconstruction modules, ZEISS OptiRecon and ZEISS DeepRecon.

Advanced Reconstruction Toolbox Modules

OptiRecon Iterative Reconstruction Module

Improve 3D X-ray Image Quality and Increase Scan Speed by 2X for Semiconductor Packages

ZEISS OptiRecon provides up to 2X faster scan times, boosts productivity, enables new workflows, and aids faster understanding of processes and defects. For easier defect visualization, OptiRecon improves image quality, leading to reduced eye fatigue for the analyst and better FA success rates.

Better Image Quality at Same Scan Speed

ZEISS OptiRecon

Better Image Quality at Same Scan Speed

Improved visualization of fine-line crack in 2.5D semiconductor package at same scan speed.

Improved visualization of fine-line crack in 2.5D semiconductor package at same scan speed.

Up to 2X Faster Scan Speeds

ZEISS OptiRecon

Up to 2X Fast Scan Speeds

Faster acquisition with similar or better image quality of 2.5D semiconductor package (50 mm x 75 mm).

Faster acquisition with similar or better image quality of 2.5D semiconductor package (50 mm x 75 mm).
DeepRecon Deep-learning based Module

Faster 3D X-ray Imaging Throughput and Superior Imaging Quality for Advanced Package Analysis

ZEISS DeepRecon is the first commercially available deep-learning reconstruction technology in the 3D X-ray imaging market. For repetitive workflow applications used in process development and quality control, DeepRecon enables up to 4X faster scan speeds by leveraging deep-learning networks customized per package type.

To apply DeepRecon, the user simply selects the desired network model from the Scout-and-Scan Reconstructor Interface.

Up to 4X Faster Scan Speeds for Repetitive Workflows

ZEISS DeepRecon

Up to 4X Fast Scan Speeds for Repetitive Workflows

4X throughput improvement with comparable image quality on 2.5D semiconductor package (50 mm x 75 mm).

4X throughput improvement with comparable image quality on 2.5D semiconductor package (50 mm x 75 mm).