ZEISS Xradia 800 Ultra 3D X-ray microscopes (XRM) achieve nanoscale resolution with unparalleled performance for 3D imaging of advanced packaging structures and defects, aiding package development and failure analysis.
The industry’s only 3D X-ray microscope designed with unique X-ray optics adapted from synchrotron technology, ZEISS Xradia 800 Ultra produces images of buried features with resolution down to 50 nm. Applications include process analysis, construction analysis and defect analysis of ultra-fine-pitch flip chip and wafer-level interconnects, including redistribution layers, die-level back-end-of-line (BEOL) interconnects, direct hybrid bonds, and ultra-fine-pitch Cu-pillar microbumps.
Non-invasive, Nanoscale-resolution 3D Imaging
Improve Processes for Ultra-fine-pitch Package and BEOL Interconnects
Xradia 800 Ultra Benefits
Back-end-of-line (BEOL) and microbump structural and defect analysis
Stacked die interconnect analysis. Projection image of extracted volume (center); 3D image of 25 μm diameter Cu-pillar microbump and virtual cross section (left); 3D image and virtual plan-view slice (right) of BEOL metal 6 interconnect (28 nm Si node).
Xradia 800 Ultra uses X-ray technology originally designed for synchrotron facilities to deliver the highest possible nanoscale resolution in a lab-based instrument for imaging ultra-fine-pitch interconnects and features.
Xradia Ultra optics schematic