Versa RepScan X-ray Microscopes

for Non-destructive 3D Measurement and Inspection of Advanced Packages

Overview

The new ZEISS Xradia 620 Versa RepScan is a submicron-resolution, 3D non-destructive imaging solution for inspection and measurement that accelerates time to market for advanced IC packages. Utilizing 3D X-ray microscopy (XRM) with ZEISS’s revolutionary Resolution at a Distance (RaaD™) technology and sophisticated analytical software, the 620 Versa RepScan provides rich volumetric and linear measurements of buried features in the most advanced packages that cannot be acheived with existing methods, such as physical cross section, 2D X-ray and microCT. The result is higher-accuracy engineering data that can be used to reduce development and yield learning cycles of advanced packages.

Highlights of Versa RepScan

Semi-automated workflow

The new Versa RepScan system enables automatic loading, scanning and unloading of identical samples without the need for operator intervention. Scan results may be automatically transferred to a separate workstation where a variety of measurements can be executed semi-automatically. This establishes a new benchmark for non-destructive off-line measurements that support process optimization, product development and QA/QC of complex fine-pitch 3D architectures, including 2.5D interposers, high bandwidth memory stacks with TSVs and microbumps, wafer-level packages with package on package interconnects, and ultra-thin memory with multiple chips in a stack.

Unique volumetric measurements are now possible

  • Image and measure buried features non-destructively with submicron resolution
  • Perform dimensional analysis of virtually any package structure that can be imaged by Versa, including:
    • TSVs and microbumps
    • Solder volumes and shapes
    • Bond-line thicknesses and warpage
  • Easily export data to statistical programs such as JMP® or Maple® for further analysis

Eliminate operator measurement variability

  • Multiple identical samples can be loaded for fully automated non-stop data acquisition
  • Measurements and results summarization are semi-automatically executed, which removes human error
  • ZEISS applications engineering support is provided for training and deployment assistance

Achieve faster time to market

  • Base development decisions on richer, higher-accuracy engineering data
  • Use acquired data for designs of experiments, process skews, corner lot or other statistical process analysis
  • Benefit from 3D measurements and analysis that are not possible with conventional methods such as 2D X-ray and physical cross sectioning
  • Gain insights beyond “blind” open/short reporting from electrical test data
  • Eliminate the endpointing challenge that exists for physical cross sectioning

Based on proven Xradia Versa

  • Guaranteed data quality based on proven ZEISS Xradia technology including ZEISS’s revolutionary Resolution at a Distance (RaaD™) architecture
  • 500 nm spatial resolution with minimum voxel size <40 nm
  • Stable spot size from 30-160 kV with long-life sealed X-ray source

Versa RepScan measurement system features

  • 620 Versa X-ray microscope
  • Autoloader with 14 stations and capacity for up to 70 samples
  • Secondary workstation with high-performance multi-CPU/multi-GPU hardware configuration
  • Custom automation software with file transfer utility
  • VGSTUDIO Max 3D data analytics software
  • Optional mass storage center with file transfer utility

Applications for Advanced Packaging

Microbump Standoff Analysis

Versa RepScan Measurement identifies units that do not meet bump standoff specifications.

Versa RepScan Measurement identifies units that do not meet bump standoff specifications.

Bump-on-Trace Solder Wetting Analysis

Versa RepScan Measurement identifies units with unacceptable bump wetting.

Versa RepScan Measurement identifies units with unacceptable bump wetting.

Solder Fillet Shape Analysis

Versa RepScan Measurement identifies units that do not meet solder fillet shape requirements.

Versa RepScan Measurement identifies units that do not meet solder fillet shape requirements.

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