ZEISS Xradia Context microCT

Large Field of View Submicron-resolution 3D X-ray

Overview

ZEISS Xradia Context is an easy-to-use 3D micro-computed tomographic (microCT) X-ray system for analysis of all types of electronic products. A high-density detector enables high resolution of fine details even with relatively large imaging volumes. The system features a large field of view, rapid sample mounting and alignment, a streamlined acquisition workflow and fast exposure and data reconstruction times.

Context microCT is the ideal entryway into the ZEISS X-ray ecosystem, with guaranteed data quality based on the proven Xradia Versa platform, and the flexibility to be converted to a Versa X-ray microscope (XRM).

Highlights of Xradia Context microCT

Versatile

  • Analyze diverse electronic products and packages
  • Visualize buried structures non-destructively in 3D for process analysis, construction analysis and failure analysis
  • Enable larger fields of view and samples sizes by automated vertical stitching
  • Achieve highest resolution on small samples

Easy to Use

  • User-friendly Scout-and-Scan™ system for quick sample set-up and local area positioning
  • Robust stage with flexible software-controlled source/detector positioning
  • Recipe-based data acquisition and automated reconstruction
  • Optional autoloader for continuous operation

Superior Image Quality

  • Large high-speed 6-megapixel detector with small pixel sizes maintains resolution at even relatively large fields of view
  • 30-160 kV range enables superior contrast
  • Optimized high-purity filters enhance image quality and reduce beam hardening
  • Advanced drift correction for superior stability
  • Dynamic hardware- and software-enabled ring artifact removal system

Proven Performance

  • Based on award winning ZEISS Xradia Versa XRM platform
  • Field convertible to Versa XRM

Key Applications for Semiconductors

Visualize buried stuctures and defects non-destructively in 3D for failure analysis and quality control.
3D microCT scan of smartwatch motherboard showing SMT components and BGA bump array, 2.85 μm/voxel.

3D microCT scan of smartwatch motherboard showing SMT components and BGA bump array, 2.85 μm/voxel.

3D microCT scan of power management chip showing multiple wire bond and interconnect layers, 0.9 μm/voxel.

3D microCT scan of power management chip showing multiple wire bond and interconnect layers, 0.9 μm/voxel.

Downloads

  • Product Flyer - "ZEISS Xradia Context microCT - 3D submicron-resolution X-ray microCT with superior image quality"