Precision Unlocked for Semiconductors

ZEISS solutions achieve significant advancements for package failure analysis workflows. By providing superior imaging and cross-sectional analysis, as well as a correlated workflow using artificial intelligence (AI), ZEISS delivers new insights from macroscale to nanoscale with fast time to results.

Semiconductor products serve the needs of transportation, work, social communication, and industrial infrastructure. There is constant demand for higher computing performance in ever smaller form factors. Logic and memory semiconductor structure analysis is challenged by novel materials and increasingly complex geometries. Shrinking transistor sizes at the newest technology nodes demand the highest performance for electron microscopy and nanoprobing applications.

The mobile communication, Internet of Things (IoT), cloud computing, and the electrification of automotive industries are driving huge demand for high-performing “More than Moore” semiconductor devices, which require the integration of new materials and processes, or novel silicon architectures and packaging technologies such as micro-electromechanical systems (MEMS). Direct band gap and wide band gap materials such as gallium arsenide (GaAs), silicon carbide (SiC), and gallium nitride (GaN) present new challenges to equipment manufacturers and device fabricators alike. Many of these devices also integrate traditional ICs, which creates fabrication and packaging challenges.

Consumer demand for brighter and more interactive display panels in electronic products is driving innovation in the highly competitive display industry. Display technology is evolving, with LCD and rigid organic light-emitting-diode (OLED) technology now produced in large volumes at low cost, and premium consumer products offering flexible OLED and microLED displays.

OLED, microLED and photonics applications are complex systems utilizing sensitive and difficult-to-analyze materials that demand advanced microscopy technologies in their development and manufacture.