ZEISS Webinar

Ensuring reliability in AI thermal management through advanced metrology and inspection

October 1, 2026 | 11 AM PDT | 2 PM EDT

Presented by

Sales Development Manager – Electronics Lee Kulow

Lee Kulow is a Sales Development Manager for Electronics with ZEISS Industrial Quality Solutions, where he works closely with leading manufacturers to improve quality, precision, and production performance through advanced metrology and inspection technologies. With extensive experience supporting customers in high-tech manufacturing, Lee helps organizations implement innovative quality solutions to meet increasingly demanding engineering and production requirements. Lee has been with ZEISS for 12 years mainly focused in X-Ray.

As AI infrastructure expands at an unprecedented pace, manufacturers are facing increasingly complex AI data center cooling challenges. Higher power densities, liquid cooling adoption, tighter tolerances, and the need for continuous uptime are driving new requirements for quality, reliability, and thermal performance. Components such as cooling plates, manifolds, fluid connectors, and thermal management assemblies must be manufactured and validated to exacting standards to support next-generation AI data centers.

Join our ZEISS expert to explore how advanced measurement technologies including CT/X-ray, CMMs, optical measurement, surface analysis, and quality data management help manufacturers validate critical cooling components, identify defects before failure, and accelerate product development. Learn how leading organizations are addressing AI infrastructure quality challenges, improving reliability, minimizing leakage risks, optimizing manufacturing processes, and ensuring the performance of the systems that power next-generation AI data centers.

What You’ll Learn

In this session, you'll gain insight into the manufacturing and quality challenges associated with AI data center cooling systems and learn how advanced inspection and measurement technologies help ensure performance, reliability, and long-term operational success.

  • Key quality challenges associated with AI data center cooling systems
  • How liquid cooling and increasing power densities are driving tighter manufacturing requirements
  • Measurement technologies including CT/X-ray, CMMs, optical measurement, and surface analysis used to validate critical thermal management components
  • How quality data management helps improve traceability, reduce leakage risk, and support reliability objectives

Who Should Attend

This webinar is ideal for:

  • Quality managers and quality engineers responsible for thermal management component validation
  • Electronics and manufacturing engineers working with cooling plates, manifolds, connectors, and liquid cooling assemblies
  • Product development and R&D teams designing next-generation AI infrastructure solutions
  • Data center, server, and cooling system manufacturers seeking to improve reliability and reduce quality risks
  • Supply chain and operations leaders supporting AI infrastructure manufacturing

Register now for our free Webinar

Join ZEISS on October 1, 2026 | 11 AM PDT | 2 PM EDT to learn how manufacturers are using advanced metrology and inspection technologies to improve reliability, minimize leakage risk, and accelerate the development of AI data center cooling systems.

Form is loading...

/ 4
Next Step:
  • Personal Details
  • Company Details

If you want to have more information on data processing at ZEISS please refer to our data privacy notice.