What is 3D X-Ray Microscopy?

Application Examples

Capabilities beyond microCT

A new field of 3D X-ray microscopy (XRM) has emerged, bringing dramatic resolution and contrast improvements to X-ray tomographic imaging. It offers more than traditional X-ray microCT for a variety of applications.

Materials Characterization: Composites
Microstructural Evolution: Metals
Process Development: Additive Manufacturing
Failure Analysis: Electronics

Composite sample imaged at 0.8 micron voxel. Sample courtesy of Professor Milani, University of British Columbia

Materials Characterization: Composites

The superior contrast and resolution of XRM facilitates easier separation of low Z materials at sub-micron resolution
Quantitative information such as void content, fiber orientation, and fiber distribution is easily determined
Complex composite image is segmented to a 3D dataset of glass fibers (green), polypropylene fibers (orange), and voids (white)

Steel sample imaged at 1.5 micron voxel. Sample provided by Sandia National Laboratories

Microstructural Evolution: Metals

3D in situ imaging requires samples inside larger load stage. XRM's unique detector design allows for large working distances while maintaining "Resolution at a Distance" (RaaD)

RaaD allows you to non-destructively characterize and quantify the evolution of 3D microstructures with high resolution

Images show in situ tensile testing of a laser welded steel sample under increasing load. The data reveals a crack initiating from rough surface imperfections (top), as well as the elongation of internal voids (bottom)

Aluminum additive manufacturing part images at 20 micron full field of view and 3 micron ROI. Sample courtesy of Aalen University

Process Development: Additive Manufacturing

XRM allows you to choose an interior sample region for interior tomography while keeping samples intact
Unlike microCT, with unique detector design you can select your magnification and field-of-view to optimize resolution - just like in a microscope!
XRM scans can measure porosity with sub-micron resolution and be used for 3D printing files (STL)

Intact 50 mm 2.5 interposer sample imaged at 14.5 μm and 1 μm voxel resolution

Failure Analysis: Electronics

Video shows non-destructive imaging of an electronics package with 2.5D interposer after thermal cycling. Internal defects in C4 and micro-bumps are clearly visualized
"Resolution-at-a-Distance" (RaaD) allows region of interest imaging at high resolution (<1 micron voxel resolution) with no sample trimming
This technique allows observation of failure evolution during progressive testing in many devices, as well as general non-destructive investigation of packaging failures of all types

Download the Whitepaper

What is 3D X-ray Microscopy?

High-resolution Non-destructive Imaging of Internal Structures

Pages: 4

File size: 488 KB

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