Know Before You Go: 3D X-ray Visualization Without Altering Your Defect

Improve Efficiency and Success Rates for Semiconductor Package Failure Analysis

While searching for the root cause of problems in your device,
3D X-ray microscopy can help you…

  • Avoid mechanical sample preparation and cross sectioning
  • Preserve sample integrity and avoid sample preparation artifacts
  • Visualize defect size and failure types
  • Clearly communicate findings to stakeholders and partners
  • Develop a plan for subsequent physical FA techniques

ZEISS 3D X-ray Microscopy Enables Accurate Insights

  • Unique optics provide non-destructive imaging of intact samples with submicron resolution
  • Intuitive, true 3D visualization​ with unlimited 2D “virtual cross sections” from any angle
  • AI-enabled software enables high-speed data acquisition and high contrast imaging
  • Hardware flexibility ensures optimized signal strength, throughput, and resolution on every sample
  • Easy navigation to any site in the sample allows accurate and fast set ups

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