Know Before You Go: Visualize in 3D Without Altering Your Defect
Improve success rates & efficiency for semiconductor package failure analysis
While searching for the root cause of problems in your device,
3D X-ray microscopy (XRM) can help you…
ZEISS 3D XRM Enables Accurate Insights
- Unique optics provide non-destructive imaging of intact samples with submicron resolution
- Intuitive, true 3D visualization with unlimited 2D “virtual cross sections” from any angle
- AI-enabled software enables high-speed data acquisition and high contrast imaging
- Hardware flexibility ensures optimized signal strength, throughput, and resolution on every sample
- Easy navigation to any site in the sample allows accurate and fast set ups
Non-destructive 3D X-ray Package Failure Analysis
With increasing package complexity comes more challenges for failure analysts to provide definitive proof on the root causes of a failure. Non-destructive 3D X-ray imaging allows visualization inside of disturbing your regions of interest. Acquire high-resolution data in tens of minutes to several hours to increase your FA success rate.
Learn how 3D X-ray microscopy fits into your failure analysis workflow and see the throughput benefits as compared to physical cross-sections.
Simple Navigation to the Site of Your Defect
In package level failure analysis, multiple defects can spread out anywhere in a package. Fully motorized sample stages are required to automatically scan different locations in one recipe. X-ray microscopy uses submicron-accuracy positioning stages to precisely locate regions of interest.
Learn about ZEISS’s mature workflow-based user interface that enables users to navigate through several easy steps to setup multiple tomographies.
True 3D Data Acquisition
3D X-ray microscopy (XRM) performs full angular rotation of a sample. True 3D data are generated by the reconstruction based on collective projection views. Other X-ray imaging techniques such as 2D X-ray or laminography suffer from the intrinsic limitation in inadequate sampling.
Read about differences between several X-ray imaging techniques and learn how 3D X-ray microscopy is the only technique to provide true 3D views of semiconductor package defects.
3D X-ray Resolution at a Distance
Modern semiconductor package designs are trending towards large sizes and complex architectures. ZEISS’s unique Resolution at a Distance (RaaD) capability offers advantages to acquire high-resolution images compared with traditional microCT systems.
Learn about the key architecture differences between these two X-ray imaging techniques and the resolution performance comparisons on imaging semiconductor packages
Speed Up Data Acquisition through AI
Fast product introduction requires rapid structural and failure analysis. Increasing packaging sizes result in smaller, more difficult-to-find defects and longer imaging time. AI-powered reconstruction using ZEISS DeepRecon Pro enables faster high-resolution 3D X-ray image acquisition. Additionally, the optional robotic autoloader allows unattended imaging of multiple samples.
Learn how these groundbreaking advances in scan productivity empower users to fully realize XRM benefits.
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