ZEISS Crossbeam Samplefab FIB-SEM

ZEISS Crossbeam Samplefab is designed to standardize and scale repetitive FIB sample-preparation tasks, reducing operator dependence and increasing throughput in production, service, and shared-facility environments. By automating the bulk-to-grid workflow, Crossbeam Samplefab ensures consistent lamella quality and reliable results across shifts, operators, and sites.

Crossbeam Samplefab prioritizes automation and reproducibility over flexibility. Unlike other Crossbeam models, it delivers fully hands-free, recipe-based workflows for high-throughput TEM lamella preparation. This makes Crossbeam Samplefab ideal for environments where consistency and scalability are critical, such as semiconductor production and yield engineering

Crossbeam Samplefab is best suited for repetitive workflows such as TEM lamella preparation, routine cross-sectioning, and standardized FIB processes where consistency and throughput are critical.

No. Crossbeam Samplefab is primarily optimized for standardized, repeatable preparation rather than exploratory or frequently changing workflows. However, Crossbeam Samplefab can support exploratory recipe development by allowing users to set up different recipes for each preparation site. This enables testing and evaluation of optimal conditions for specific material compositions before standardizing workflows.

Software is central to Crossbeam Samplefab’s automation and efficiency. ZEN core EM integrates SEM and FIB control within a single environment, supporting recipe-based workflows, batch execution, and synchronized imaging during milling. For downstream analysis, the ZEISS arivis ecosystem enables scalable visualization, segmentation, and quantitative analysis of complex datasets, ensuring consistent evaluation and documentation.

Crossbeam Samplefab delivers qualified automation yields exceeding 90 percent, from chunking to grid attachment. This high success rate is achieved through hands-free processing, low-kV finishing, and recipe-driven workflows that minimize user intervention. The system prioritizes device safety first and sample quality second, ensuring that critical device layers remain intact during preparation. User intervention is only prompted when necessary, further enhancing reliability and reproducibility across workflows.

Yes. Crossbeam Samplefab is designed to handle beam-sensitive materials with care, utilizing low-energy FIB finishing and low-kV SEM imaging to reduce damage and preserve fine structural details. This ensures reliable preparation of delicate samples, including thin films, polymers, and intricate semiconductor structures.