ZEISS Crossbeam

ZEISS Crossbeam is built to deliver exceptional low-kV SEM imaging and true see while you mill control — not just high-resolution images. It combines Gemini electron optics (optimized to deliver strong detail and stability at low landing energies) with the Ion-sculptor FIB for precise processing and low-voltage capability to help minimize sample damage. During preparation, real-time SEM imaging at preparation tilt lets you see structures clearly while milling, adjust patterns immediately, and reduce stop-and-check steps — driving higher first-try success and more repeatable outcomes for workflows like TEM lamella prep, defect localization, and nanopatterning.

The Crossbeam portfolio is purpose-built. Crossbeam 350 provides flexibility for a wide range of applications and is suitable for shared laboratory environments. The Crossbeam 550 is tailored for high-resolution imaging and analytics and consistent TEM sample preparation. The Crossbeam 750 enables deterministic sub-20 nm lamella preparation with live endpoint control. The Crossbeam Samplefab is optimized for high-throughput, automated TEM workflows. Additionally, benefit from upgrading your Crossbeam e.g. with a femtosecond laser for rapid access to very large, deeply buried areas.

Crossbeam systems utilize low-energy FIB finishing, low-kV SEM imaging, and real-time SEM monitoring during milling. This approach reduces amorphization, preserves fine structural details, and enhances reliability when preparing delicate or high-value samples.

Software is central to how Crossbeam systems deliver precision, repeatability, and efficiency. ZEN core for EM integrates SEM and FIB control within a single environment, supporting guided workflows, recipe-based automation, batch execution, and synchronized imaging during milling. This enables consistent, user-independent operation and real-time control for demanding preparation and analysis tasks. For downstream image analysis, the ZEISS arivis ecosystem extends Crossbeam workflows with scalable visualization, segmentation, and quantitative analysis of complex FIB-SEM datasets — supporting high-confidence interpretation across applications and teams.

ZEISS Crossbeam systems are versatile tools for materials science, semiconductor analysis, and life sciences workflows. They enable site-specific cross-sectioning, 3D tomography, nanofabrication, and nanoscale characterization across metals, ceramics, polymers, batteries, and composites. For semiconductor analysis, Crossbeam provides rapid access to buried device layers, defect localization, and repeatable lamella preparation. In life sciences, Crossbeam supports targeted preparation and 3D reconstruction of biological samples, preserving ultrastructure for tomography and serial sectioning workflows.

Crossbeam systems streamline workflows through real-time SEM monitoring, recipe-based automation, and integrated SEM and FIB control. Real-time imaging during milling eliminates stop-and-check steps, driving higher first-try success rates. Recipe-based workflows ensure consistent results across users and sites, while automation improves throughput for high-volume applications such as TEM lamella preparation.

Crossbeam systems are optimized for beam-sensitive materials like polymers, thin films, and biological samples. Features such as low-kV imaging and low-energy FIB finishing minimize damage, preserve fine structural details, and ensure high-quality results for delicate samples.

See while you mill refers to real-time SEM imaging during FIB milling, allowing users to monitor structures as they are exposed. This capability enables immediate adjustments to milling patterns, reduces workflow interruptions, and enhances first-try success rates for workflows like TEM lamella preparation, defect localization, and nanopatterning.

Yes, Crossbeam systems offer modular options and upgrades to meet evolving research needs. For example, when rapid access to large, deeply buried areas is required, the ZEISS Crossbeam laser provides very high milling rates on the order of 10^6 µm³/s for rapid, precise ablation, while advanced detectors enhance imaging capabilities for specific applications. Software extensions like ZEISS arivis provide advanced data analysis, visualization, and automation.