June 23–25, 2026
Infineon Technologies, Dresden
From June 23 to 25, 2026, ZEISS Digital Innovation, Infineon Technologies, and Smart Systems Hub will bring together interdisciplinary teams to tackle a key challenge in semiconductor manufacturing: the intelligent use of sensor data for predictive maintenance.
In a three-day hackathon format, participants from software engineering, data science, research, and industry will develop practical prototypes and architectural approaches based on real data and technologies. The focus is on building an edge-to-cloud AI pipeline using distributed AI to detect machine conditions at an early stage and improve maintenance decisions through data-driven insights.
Participation is free of charge, but places are limited.