Skip to main content
Research Microscopy Solutions
back
Webinar

Nanoprobing: 10 Signals for device characterization & defect localization

Failure analysis (FA) ensures the quality, reliability, and performance of semiconductor devices – factors that are essential in a field defined by high precision and large-scale production. Defect localization is a critical step in semiconductor FA, enabling the identification of faults within complex integrated circuits and driving yield improvements in manufacturing processes.

Register for the free webinar here
Register for the free webinar here
Register for the free webinar

About the webinar

Defect localization is a critical step in semiconductor failure analysis, enabling the identification of faults within complex integrated circuits and driving yield improvements in manufacturing processes.

In this webinar, we shift the focus to nanoprobing, introducing techniques such as current-voltage characterization, electron beam absorbed current (EBAC), electron beam induced current (EBIC), and electron beam induced resistance change (EBIRCH). Logic and power device applications will be presented along with a case study on eDRAM shorts that illustrates nanoprobing’s ability to uncover subtle defects, particularly in complex systems.

Learn the importance of localization in semiconductor failure analysis, the essential equipment such as SEM and nanoprobing systems used to perform key electrical measurements like resistance and threshold voltage, and the physics and use cases behind 10 different localization signals in nanoprobe-based analyses. The webinar also covers the challenges of identifying shorts in complex systems and highlights how nanoprobing enables accurate device health assessment and localization of a wide range of defects.

Profile image of Doctor Katerina Karali
Speaker Greg Johnson Senior Application Development Engineer

Greg Johnson is a Senior Application Development Engineer in the Electronics Sector of ZEISS Microscopy and a senior IEEE member. With over 20 years of experience in semiconductor process development and failure analysis, Greg brings a wealth of experience to his role. Previously at IBM, he contributed to ceramic packaging process development and led FEOL defect localization efforts across multiple technology nodes, developing advanced failure analysis techniques. At ZEISS, Greg works with failure analysis engineers worldwide to advance SEM, FIB-SEM, and AFM techniques for semiconductor process development.

Speaker Dr. Sven Davani Market Sector Manager

Dr. Sven Davani is the Market Sector Manager for Electronics at ZEISS, specializing in SEM and FIB-SEM technologies to tackle challenges in advanced semiconductor logic, memory, and packaging. He brings a customer-focused approach to driving technology adoption in the electronics industry. Before ZEISS, Sven worked in R&D consulting on innovation strategies and led product management in a startup, gaining experience in bringing new technologies to market. Sven holds a PhD in Physics from the University of Münster, with research in material science and microscopy published in journals like Acta Materialia and Ultramicroscopy.

With this webinar, you learn:

  • Why defect localization matters in semiconductor failure analysis
  • The SEM and nanoprobing setup used for key electrical measurements and localization signals
  • How nanoprobing detects shorts and assesses device health in complex systems

Form is loading...

Personal Information

If you want to have more information on data processing at ZEISS, please refer to our data privacy and legal notice.