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Lamella Preparation Success Toolkit

Prepare TEM Lamella at Your Regions of Interest with Unmatched Precision and Accuracy

Preparing TEM lamellae at targeted regions of interest is essential for advanced materials research, particularly when dealing with rare or precious samples where over-milling or inaccurate end-pointing are unacceptable outcomes.

To ensure reliable TEM sample preparation, real-time, high-resolution monitoring of the sample’s cross-section and thickness is crucial. In addition, a highly stable ion column ensures constant focus at the milling site, eliminating the need for repetitive probe realignment.

Discover how the ZEISS Ion-sculptor and ZEISS Gemini electron optics worked synergistically to deliver high resolution live imaging while milling of TEM samples - enabling precise, high-quality lamella preparation at your critical regions of interest. Click register below to attend the free webinar & learn how to...

  1. Achieve high-resolution live imaging during TEM sample milling with complete freedom to choose any FIB and SEM kV combination
  2. Continuously monitor lamella thickness in high resolution to achieve the ideal electron-transparent sample
  3. Prepare TEM lamellae with multiple FIB probes in one run without beam realignment
  4. Perform low kV FIB polishing for highest lamella quality
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1. Achieve High Resolution Live Imaging while Milling at Any FIB / SEM kV Combination

Do you struggle to precisely locate the critical region of interest in your sample during FIB milling? See the video inset for targeted end-pointing of a 20nm feature.

Learn how the immersion-free Gemini column works seamlessly with the FIB ion beam—supporting high resolution live imaging while milling for real-time end-pointing to your targeted region of interest.

This video shows real-time SEM imaging during milling using two detectors— SE2 (left) and in-column Inlens SE (right). The arrow marks the final region of interest, a 20 nm feature within a multilayer specimen.

  • 2. Live TEM Lamella Thickness Monitoring

    Do you struggle to avoid over-thinning or to monitor lamella thickness to achieve the desired electron transparency for TEM analysis?

    Learn how the in-chamber detector enables real-time correlation between sample transparency and lamella thickness. This is made possible by the immersion-free Gemini electron column, which works seamlessly with the FIB ion beam to provide high-resolution live imaging for real-time TEM lamella thickness monitoring.

    This video shows real-time lamella thickness monitoring on 2 detectors - SE2 (left) & in-column Inlens SE (right) while milling. Milling starts from left to right where TEM lamella transparency is achieved by the SE2 detector indicating certain thickness achieved.

  • This image shows the progression of TEM lamella milling at 3 kV, where increasing transparency reveals progressive sample thinning.

    This image shows the progression of TEM lamella milling at 3 kV, where increasing transparency reveals progressive sample thinning.

    Live TEM Lamella Thickness Monitoring

    Do you struggle to avoid over-thinning or to monitor lamella thickness to achieve the desired electron transparency for TEM analysis?

    Learn how the in-chamber detector enables real-time correlation between sample transparency and lamella thickness. This is made possible by the immersion-free Gemini electron column, which works seamlessly with the FIB ion beam to provide high-resolution live imaging for real-time TEM lamella thickness monitoring. 

3. Prepare TEM lamellae with Multiple FIB Probes in One Run - Without Beam Realignment

Do you have complex material systems that need different FIB probes and currents? A full FIB workflow typically requires multiple beam probes, and conventional methods demand realignment with each change — a cumbersome step.

Learn how the stability of the ZEISS ion column, Ion-sculptor, keeps the field of view focused even with changing probe current or EHT — benefit from a workflow that simplifies TEM lamella preparation for the user when compared to conventional technology.

This video shows a fiducial marker on a copper surface at 4× speed, without any video edits. Beam current varies from 10 pA to 100 nA and acceleration voltage from 30 kV to 2 kV. Field of view and focus remain stable, with no need for beam realignment after probe switching.

Ion-sculptor images correspond to different FIB EHTs. The TEM lamella remained visible in all conditions, even at extreme values such as 0.5kv & 10pA.

Ion-sculptor images correspond to different FIB EHTs. The TEM lamella remained visible in all conditions, even at extreme values such as 0.5kv & 10pA.

4. Perform Low kV FIB Polishing for Highest Lamella Quality

Do you struggle to locate, image and perform final low-kV cleaning or polishing of your TEM lamella to achieve the highest sample quality.

The ZEISS Ion-sculptor column is optimized for low-kV FIB processes, providing detailed imaging and a precise ion beam profile—even at 1 or 0.5 kV—ideal for final polishing at your targeted region of interest.

The ZEISS Crossbeam family carries the next-generation focused ion beam column, Ion-sculptor, featuring high currents for high throughput and excellent low voltage performance for high sample quality..

  • Accelerate your FIB applications with fast probe current exchanges
  • Perform high throughput experiments thanks to beam currents of up to 100 nA
  • Get precise and reproducible results with maximum stability
  • Achieve exceptional FIB resolution of less than 3 nm
  • Maximize sample quality by using the low voltage capabilities of the Ion-sculptor FIB column
  • Minimize amorphization of your specimens and get the best results after thinning
  • The Crossbeam family comes with automatic FIB emission recovery for long-term experiment

Register to watch the webinar today!

Learn how the ZEISS Crossbeam FIB-SEM can make a difference to your TEM lamella preparation workflow and improve sample quality.

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