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Webinar 10 April | 4pm CEST

3D X-ray Microscopy for Semiconductor Applications:

Discover new insights for package failure analysis
Register for the free webinar
  • Learn how ZEISS microscopy solutions solve failure analysis challenges for next-generation semiconductor packages
  • Discover the latest development and progress in 3D X-ray microscopy for semiconductor package failure analysis
  • Gain insights into how artificial intelligence technology is implemented in XRM workflows to improve failure analysis efficiency

Join our free webinar on April 10th | 4pm CEST

3D X-ray Microscopy for Semiconductor Applications:

Discover new insights for package failure analysis

3D X-ray microscopes (XRM) has been widely adopted in package level failure analysis over the past decade. However, the non-destructive imaging technique is challenged by the emerging architectures, interconnects, and materials in modern IC packages. In this webinar, we will present the recent progress on XRM resolution improvement and data acquisition acceleration through detector optics innovation, AI-based reconstruction implementations, and correlative workflow development. A groundbreaking resolution improvement has been achieved through a detector innovation. Award-winning AI-based reconstruction modules enable 4x faster scans and superior image quality for imaging advanced IC packages. Correlated with laser FIB-SEM microscopy, an XRM to laserFIB workflow has been developed to enable fast and precise failure analysis. For the further demands on resolution and speed in advanced fault isolation, we will report a 50 nm resolution nanotomography technique, recently powered by a deep learning reconstruction method.

Register below to attend the free webinar

Webinar Speakers

Webinar Presenter: Mohsen Samadi Khoshkhoo
Speaker Allen Gu, Ph.D. Senior Sector Manager – Electronics

Dr. Allen Gu is a senior sector manager of ZEISS Microscopy with a focus on developing new microscopy solutions for next-generation semiconductor packages. With a background in materials science and engineering, he’s spent his past 18 years in a variety of microscopy technologies with focus on micro/nanoscale imaging and analysis. He joined Carl Zeiss X-ray Microscopy in 2010 and played a leading role in pioneering X-ray imaging techniques for semiconductor failure analysis. Now the ZEISS XRM becomes the world’s most advanced 3D X-ray microscopy brand among non-destructive techniques. Prior to his ZEISS career, he severed as a Sr. applications scientist for scanning probe microscopic technologies in Pacific Nano and Agilent, USA. He has (co)authored about numerous journal articles, conference paper, presentations, and US patents.

Speaker Ian Belding Business Development Manager - XRM

Ian is the Global Business Development Manager for X-ray microscopy at ZEISS. Ian studied Physics before joining ZEISS in 2004. During his time at ZEISS, Ian has specialized in electron and X-ray microscopy, looking after XRM sales globally since 2017.

Please fill out the form below to register for our free webinar

April 10th, 2025 | 4:00-5:00 pm CEST

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