Advanced Microscopy for Electronic Materials & Semiconductor Packages
Parallel advances in FIB-SEM and 3D X-ray microscopy have radically changed sample preparation, characterization and failure analysis of semiconductor devices and packages.
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Transform Your Sample Prep and Site-specific Analysis with Efficient Workflows
New Technology Insights for Materials Characterization & Failure Analysis
Two webinars deliver rich insights into the latest microscopy advances and how they work together to enable materials characterization and failure analysis for the next generation of electronic packages and devices.
Advanced Package Analysis Solutions for the More-than-Moore Era
The slowing of Moore’s Law continues to present challenges for integrated circuit (IC) package characterization and failure analysis (FA). Package developers and failure analysts are faced with complex System-in-Package (SiP) architectures enabled by heterogenous integration, package interconnect pitches approaching one micron, buried silicon and system-on-chip (SOC) disaggregation, leading to larger package footprints approaching 100mm x 100mm or larger. These trends drive requirements for new capabilities across the entire FA workflow. New ZEISS solutions addressing IC package analysis challenges will be presented including artificial intelligence for 3D X-ray imaging and a new “packaging FIB”, the Crossbeam laser. These technologies represent significant advancements for the package FA workflow.
Application of Ultra-Short Pulsed (USP) Lasers for Improved Microscopy Sample Preparation
A new instrument that integrates a femtosecond laser with a FIB-SEM (also known as a LaserFIB) is revolutionizing sample preparation for microelectronics, as well as other industrial and research fields. Join this 1-hour webinar to learn about LaserFIB applications and understand how it compares to sample preparation tools such as broad ion beam (BIB), standalone ps-laser and integrated PFIB laser instruments.
How can we help you?
Contact us to speak directly with a ZEISS representative about the specific needs of your facility.